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Topic: Thickness Control

Results

Application of Multiple Models BP NN Weighting Optimal Controller in medium plate cooling process

2011 / IEEE / 978-988-17255-9-2
By: Wang Xiaobo; Liu Ye; Wang Xin;

Modeling and forecast of glazing thickness deposition rate using artificial neural network

2011 / IEEE / 978-1-61284-722-1
By: Hao Feng; Sheng-rui Yu;

Fine thickness control of amorphous silicon by wet-etching for low loss wire waveguide

2011 / IEEE / 978-1-4244-8340-2
By: Takei, R.; Furuya, K.; Nakanishi, K.; Sakakibara, Y.; Itoga, E.; Mori, M.; Kamei, T.; Okano, M.; Suzuki, M.;

All ALD TiO2-Al2O3-TiO2 horizontal slot waveguides for optical sensing

2011 / IEEE / 978-1-4244-9289-3
By: French, P.J.; Purniawan, A.; Sarro, P.M.; Huang, Y.; Pandraud, G.;

Study on Friction Coefficient Mechanism Model of Tandem Cold Mill in Unstable Condition

2011 / IEEE / 978-1-4577-2008-6
By: Hao Peifeng;

Design of a novel fuzzy adaptive PI controller for monitor hydraulic AGC system of cold rolling mill

2011 / IEEE / 978-1-4577-1461-0
By: Afshar, A.; Khosravi, S.; Barazandeh, F.;

Optical and structural study of Ag/ZrO2/SiO2 planar waveguide structure: Glass/film/air

2012 / IEEE / 978-1-4673-1515-9
By: Kandasamy, S.K.; Palanisamy, M.;

Strained silicon on insulator substrates for fully depleted application

2012 / IEEE / 978-1-4673-0145-9
By: Schwarzenbach, W.; Maleville, C.; Nguyen, B.-Y.; Cauchy, X.; Kerdiles, S.; Daval, N.; Guerroudj, S.; Figuet, C.; Chabanne, G.; Bonnin, O.;

Fabrication of Spacer and Catalytic Layers in Monolithic Dye-Sensitized Solar Cells

2013 / IEEE
By: Vesce, L.; Reale, A.; Di Carlo, A.; Brown, T. M.; Soscia, G.; Orabona, A.; Mincuzzi, G.; Riccitelli, R.;

The analysis and improvement of FGC strategy on five tandem cold mill

2013 / IEEE
By: Zhiyong, Xiao;

The Amorphous-Si CMP process improvement for L14 nm FinFET technology node

2014 / IEEE
By: Li, Y. T.; Huang, P. C.; Wu, J. Y.; Lin, J.F.; Liu, C.C.; Lin, W. C.; Lin, Y. M.; Hsu, S. K.; Sie, W. S.; Liu, Y. L.; Lin, Z. J.; Lin, C. H.; Tsai, F. S.; Li, K. R.;

Research on decoupling method of thickness and tension control in rolling process

2014 / IEEE
By: Wang, Longna; Tan, Shubin; Liu, Jianchang;

A cost-efficient spring-powered dermatome to treat skin trauma

2014 / IEEE
By: Ranger, Bryan J.; Mantzavinou, Aikaterini; Casey, Jonathan; Sheridan, Robert L.; Secundo, Rafael G.;

A control system for material layer thickness of chain grate based on weighted mean filtering method

2014 / IEEE
By: Luo, Shanlin; Zhang, Zheng; Fang, Kangling;

Ohmic contacts to semiconducting diamond

1988 / IEEE
By: Nguyen, R.; Moazed, K.L.; Zeidler, J.R.;

A directional coupler of a vertically installed planar circuit structure

1988 / IEEE
By: Konishi, Y.; Nakajima, M.; Fukuoka, Y.; Awai, I.;

A new triple-well resonant tunneling diode with controllable double-negative resistance

1988 / IEEE
By: Takahashi, S.; Tanoue, T.; Mizuta, H.;

Chemical beam epitaxy

1988 / IEEE
By: Tsang, W.T.;

UHV-preparation and in situ characterization of magneto-optical thin films

1988 / IEEE
By: Weller, D.; Reim, W.; Schrijner, P.;

Flux resetting characteristics of amorphous thin-tape cores up to megahertz region

1988 / IEEE
By: Yamaguchi, M.; Murakami, K.;

The thermal-cycled adhesion of thick-film copper conductors

1988 / IEEE
By: Knaak, J.F.; Needes, C.R.S.;

Study of electrochemical etch-stop for high-precision thickness control of silicon membranes

1989 / IEEE
By: de Rooij, N.F.; Collins, S.D.; Kloeck, B.; Smith, R.L.;

Process optimization tweaking tool (POTT) and its application in controlling oxidation thickness

1989 / IEEE
By: Foster, T.A.; Baum, T.A.; Oamminga, G.M.; Jenkins, C.D.; Guldi, R.L.;

The design of distributed thickness control systems for hot strip mills incorporating hydraulic roll positioning

1988 / IEEE
By: Mok, D.W.S.; Foulds, J.G.; Eaton, N.B.;

Radiation response of CMOS/SOI devices formed by wafer bond and etchback

1988 / IEEE
By: Ling, P.; Palkuti, L.J.; Yuan, J.; Ormond, R.; Kawayoshi, H.; Leonov, P.;

A new silicon-on-glass process for integrated sensors

1988 / IEEE
By: Spangler, L.J.; Wise, K.D.;

Use of annular saw for the cutting of quartz resonator blanks and substrates

1988 / IEEE
By: Morley, P.; Spencer, R.B.; Dowsett, J.;

High-speed DCFL circuits with very shallow junction GaAs JFETs

1989 / IEEE
By: Hida, Y.; Kawasaki, H.; Takano, C.; Okubora, A.; Wada, M.; Kasahara, J.;

A new high sensitivity photo-transistor for area image sensors

1988 / IEEE
By: Yamashita, H.; Matsunaga, Y.; Iesaka, M.; Manabe, S.; Harada, N.;

Atomic layer epitaxy for the growth of heterostructures

1988 / IEEE
By: Dapkus, P.D.; DenBaars, S.P.;

GaAlAs/GaAs heterojunction bipolar transistors: issues and prospects for application

1989 / IEEE
By: Chang, M.-C.F.; Asbeck, P.M.; Wang, K.-C.; Sullivan, G.J.; Sheng, N.H.; Higgins, J.A.;

Improved coating for amorphous alloy with low loss deterioration

1989 / IEEE
By: Okazaki, Y.; Sakuma, E.; Kanno, H.;

The synthesis of Sm/sub 2/(Co,Fe,Zr)/sub 17/ high energy product, 16 to 30 MGOe, thick sputtered films

1989 / IEEE
By: Cadieu, F.J.; Chen, K.; Hegde, H.;

The Bragg reflection waveguide directional coupler

1989 / IEEE
By: Lenz, G.; Salzman, J.;

Electromagnetic coupling of coplanar waveguides and microstrip lines to highly lossy dielectric media

1989 / IEEE
By: Iskander, M.F.; Lind, T.S.;

A waveform alignment approach to positioning airborne radar-sounding data

1990 / IEEE
By: Clarke, G.K.C.; Cross, G.M.;

An introduction to automatic profile control

1989 / IEEE
By: Cumming, J.R.;

PPC 6020-Gravimetric extrusion control

1989 / IEEE
By: Darley, D.; Smith, D.J.;

Reduction of lateral phosphorus diffusion in CMOS n-wells

1990 / IEEE
By: Ahn, S.T.; Tiller, W.A.; Plummer, J.D.; Kennel, H.W.;

Laser measurement system for on-line control of a manufacturing process

1989 / IEEE
By: Bose, S.; Yang, J.;

Multiple-wavelength diode laser superarray

1990 / IEEE
By: Paoli, T.L.; Nelson, S.E.; Treat, D.W.; Epler, J.E.;

Determination of lubricant film thickness on a particulate disk surface by atomic force microscopy

1990 / IEEE
By: Mate, C.M.; Novotny, V.J.; Lorenz, M.R.;

Excitation of the half-frequency of the input signal in the response of an antenna immersed in a plasma

1990 / IEEE
By: Nachman, M.; Linh, N.P.;

Step spacing effects on electromigration

1990 / IEEE
By: Oates, A.S.;

Automated on-line optimization of an epitaxial process

1990 / IEEE
By: Metz, W.; Hu, A.; Ha, S.; Sachs, E.;

Medical ultrasonic probe using electrostrictive-ceramics/polymer composite

1989 / IEEE
By: Nakaya, C.; Masuzawa, H.; Takeuchi, H.; Ito, Y.;

Air-gap determination of the cut-off frequency of unelectroded plates and effects of local thickness modifications in plane resonators

1989 / IEEE
By: Joly, C.; Schwartzel, J.; Carru, H.; Detaint, J.; Zarka, A.; Capelle, B.;

Poly Si-Si interfacial oxide ball-up mechanism and its control for 0.8 mu m BiCMOS VLSIs

1989 / IEEE
By: Momose, H.; Higashizono, M.; Maeda, T.; Matsunaga, J.;

Polarization phenomena in cross-linked polyethylene (XLPE) containing water-trees

1989 / IEEE
By: Densley, J.; Das-Gupta, D.K.;

Gallium arsenide on insulator by electrostatic bonding

1989 / IEEE
By: Qin-Yi Tong; Shi-Ji Lu; Qing-An Huang;

ONO inter-poly dielectric scaling for nonvolatile memory applications

1991 / IEEE
By: Mori, S.; Yoshikawa, K.; Arai, N.; Ohshima, Y.; Narita, K.; Kaneko, Y.; Araki, H.; Sakagami, E.;

Calculation and design of grids in Pierce guns

1989 / IEEE / 0-7803-0817-4
By: True, R.;

A new E(E)PROM technology with a TiSi/sub 2/ control gate

1989 / IEEE / 0-7803-0817-4
By: Druyts, F.; Cuppens, R.; Vollebregt, F.; Solo, J.; Verberne, F.; Lemmen, G.;

Production of thin, uniform toner layers through use of a contact blade with mono-component development systems

1991 / IEEE
By: Terao, K.; Ito, K.; Inaba, S.;

Quasi-dielectrically isolated bipolar junction transistor with subcollector fabricated using silicon selective epitaxy

1991 / IEEE
By: Denton, J.P.; Neudeck, G.W.; Gilbert, P.V.; Duey, S.J.;

A new bonding technology using gold and tin multilayer composite structures

1991 / IEEE
By: Matijasevic, G.S.; Wang, C.Y.; Lee, C.C.;

Characteristics of full etchstop layer transfer/silicon-on-insulator (FELT/SOI) material

1988 / IEEE
By: Bean, K.; Malhi, S.; Shen, C.C.; Anderson, M.; Sundaresan, R.; Smith, J.; Yeakley, D.; Lindberg, K.; Gopffarth, G.;

Active regulation of grasp stiffness in neuroprosthesis for restoration of hand function in quadriplegics

1989 / IEEE
By: Crago, P.E.; Lemay, M.;

On line non-contact thickness measurement of flat rolled metals

1989 / IEEE
By: Mitchell, J.F.;

Fly ash layer depth control by ion current distribution for upgrading a rapping efficiency in an electrostatic precipitator

1989 / IEEE
By: Watanabe, T.;

Thickness and roughness dependence of DC modulation noise in thin film magnetic recording disk media

1990 / IEEE
By: Katti, R.R.; Saunders, D.A.;

A simple electrical method to determine the Si and oxide thicknesses in SOI materials

1991 / IEEE
By: Boden, M.J.; Zavracky, P.M.; Vu, D.-P.; Cheong, N.K.;

A new method of forming a thin single-crystal silicon diaphragm using merged epitaxial lateral overgrowth for sensor applications

1991 / IEEE
By: DeRoo, D.W.; Kabir, A.E.; Neudeck, G.W.; Pak, J.J.; Staller, S.E.;

In-situ monitoring of epitaxial film thickness by IEMI

1992 / IEEE
By: Reif, R.; Stout, P.; Zhou, Z.-H.; Yu, F.;

In situ fabrication of reproducible YBCO epitaxial planar Josephson tunnel junctions

1991 / IEEE
By: Iguchi, I.; Wen, Z.;

Making separation architectures serve the user

1990 / IEEE / 0-87942-597-0
By: Ruston, L.; Muller, M.J.; Wildman, D.M.; Cebulka, K.D.;

Polished fiber-optic coupler with intermediate planar waveguiding layer. I

1992 / IEEE
By: Zafirova, B.S.; Panajotov, K.P.; Andreev, A.T.;

Furnace nitridation of thermal SiO/sub 2/ in pure N/sub 2/O ambient for ULSI MOS applications

1992 / IEEE
By: Kwong, D.-L.; Ting, W.; Ahn, J.;

High-quality MOSFETs with ultrathin LPCVD gate SiO/sub 2/

1992 / IEEE
By: Kwong, D.-L.; Ting, W.; Ahn, J.;

Vertical multiple-quantum-well directional-coupler switch with low switching voltage

1992 / IEEE
By: Tada, K.; Yamaguchi, T.; Ishikawa, T.;

SIMOX layers and interfaces studies with a new fast multichannel spectroscopic ellipsometer

1990 / IEEE / 0-87942-573-3
By: Biasse, B.; Stehle, J.-L.;

Improved performance and reliability of MOSFETs with thin gate oxides grown at high temperature

1991 / IEEE / 0-87942-680-2
By: Lee, S.; Kwong, D.L.; Lo, G.Q.; Joshi, A.B.;

Comparison of dielectric wear-out between oxides grown in O/sub 2/ and N/sub 2/O

1991 / IEEE / 0-87942-680-2
By: Kwong, D.-L.; Chu, T.Y.; Ahn, J.; Lo, G.Q.; Ting, W.;

Quasi-dielectrically isolated bipolar junction transistor with sub-collector fabricated using silicon selective epitaxy

1991 / IEEE / 0-7803-0009-2
By: Gilbert, P.V.; Duey, S.J.; Denton, J.P.; Neudeck, G.W.;

A novel method of forming a thin single crystal silicon diaphragm with precise thickness for potential use in fabricating micromechanical sensors using merged epitaxial lateral overgrowth

1991 / IEEE / 0-7803-0109-9
By: Logsdon, J.H.; Neudeck, G.W.; Pak, J.J.; Kabir, A.E.; Staller, S.E.; DeRoo, D.R.;

Novel high-performance pressure sensors using double SOI structures

1991 / IEEE / 0-87942-585-7
By: Chung, G.-S.; Nakamura, T.; Ishida, M.; Ashiki, M.; Kawahito, S.;

A micromachining technique for a thin silicon membrane using merged epitaxial lateral overgrowth of silicon and SiO/sub 2/ for an etch-stop

1991 / IEEE / 0-87942-585-7
By: DeRoo, D.R.; Logsdon, J.H.; Neudeck, G.W.; Kabir, A.E.; Pak, J.J.; Staller, S.E.;

Floated backing metal film effects on peeling electrostatic discharge

1990 / IEEE / 0-87942-553-9
By: Oda, T.; Takahashi, T.;

Hydraulic screwdown control system for mandrel mill

1990 / IEEE / 0-87942-553-9
By: Shigematsu, N.; Matsuura, T.; Nakashima, K.; Moribe, K.;

Development of a film profile control system in a film plant

1991 / IEEE / 0-7803-0069-6
By: Onaka, Y.; Akasaka, N.; Hattori, S.; Tsutsui, Y.;

Gamma backscatter thickness measurement for control of multiple-strip rubber calenders

1991 / IEEE / 0-7803-0069-6
By: Bates, J.R.; Bickel, C.;

Real-time in situ monitoring of antireflection coatings for semiconductor laser amplifiers by ellipsometry

1992 / IEEE
By: Wu, I.-F.; Dagenais, M.; Verdiell, J.-M.; Riant, I.;

Allowable surface silicon thickness for fully-depleted SOI MOSFET's

1991 / IEEE / 0-7803-0184-6
By: Lyu, Jong-Son; Lee, Choochon;

Statistically based feedback control of photoresist application

1991 / IEEE / 0-7803-0152-8
By: Leang, S.; Spanos, C.J.;

Planarized MIM active matrix for LCD addressing

1991 / IEEE / 0-7803-0213-3
By: Vorobjeva, A.; Usenok, A.; Smirnov, A.; Vysotsky, V.;

High definition front projector using poly-Si TFT LCD

1991 / IEEE / 0-7803-0213-3
By: Yoneno, K.; Okamoto, N.; Banda, S.; Miyazawa, Y.; Ogihara, M.; Nakayama, T.; Karasawa, J.; Yajima, A.; Nakamura, J.; Kamakura, H.;

On-line measurement and control of basis weight and thickness of rubber and plastic web products

1992 / IEEE / 0-7803-0543-4
By: Yowell, R.;

Control of CuInSe/sub 2/ film quality by substrate surface modifications in a two-stage process

1991 / IEEE / 0-87942-636-5
By: Matson, R.J.; Kapur, V.K.; Basol, B.M.;

A tunable over controlled oscillator for space application based on a thick film hermetic hybrid

1990 / IEEE
By: Revel, F.; Monichino, M.;

Frequency mode charts of rectangular AT-cut quartz plates

1990 / IEEE
By: Horiuchi, K.; Nakazawa, M.; Ito, H.;

Rectilinear phased array transducer using 2-2 ceramic-polymer composite

1990 / IEEE
By: Piel, J.E., Jr.; O'Donnell, M.; Engeler, W.E.; Smith, L.S.;

Piezoelectric sensors and actuators for active vibration damping using digital control

1990 / IEEE
By: Hong, S.-Y.; Varadan, V.K.; Varadan, V.V.;

Using a thermal simulation model to interpret test data (air cooling of circuit boards)

1992 / IEEE / 0-7803-0500-0
By: Azar, K.; Manno, V.P.;

Automatic frequency control in chemical etching of quartz crystal blanks

1990 / IEEE
By: Sauerland, F.L.;

Application strategies for AC rolling mill drives

1991 / IEEE / 0-7803-0453-5
By: Kurosawa, R.; Hakata, H.; Hosoda, H.; LeMone, C.P.; Tatara, S.;

Epitaxial regrowth in surface micromachining of GaAs

1992 / IEEE / 0-7803-0497-7
By: Janzen, E.; Kordina, O.; Andersson, S.; Schweitz, J.-A.; Hjort, K.;

Effects of N/sub 2/O anneal and reoxidation on thermal oxide characteristics

1992 / IEEE
By: Liu, Z.; Cheng, Y.C.; Hu, C.; Ko, P.K.; Wann, H.-J.;

Time-dependent dielectric breakdown characteristics of N/sub 2/O oxide under dynamic stressing

1992 / IEEE
By: Ahn, J.; Kwong, D.-L.; Lo, G.Q.; Joshi, A.;

Hot-carrier-induced degradation of gate dielectrics grown in nitrous oxide under accelerated aging

1992 / IEEE
By: Mathews, V.; Ditali, A.; Fazan, P.;

Run-by-run process control: performance benchmarks

1992 / IEEE / 0-7803-0680-5
By: Langer, P.; Ingolfsson, A.; Sachs, E.; Hu, A.;

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Topic: Thickness Control

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