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Topic: Thermal Effects
Results
2012 / IEEE
By: Gustavsson, J.S.; Baveja, P.P.; Westbergh, P.; Kogel, B.; Haglund, A.; Larsson, A.; Agrawal, G.P.; Maywar, D.N.;
By: Gustavsson, J.S.; Baveja, P.P.; Westbergh, P.; Kogel, B.; Haglund, A.; Larsson, A.; Agrawal, G.P.; Maywar, D.N.;
2012 / IEEE
By: Beebe, S.J.; Yu Jing; Kolb, J.F.; Jie Zhuang; Jiahui Song; Camp, J.T.; Schoenbach, K.H.; Shu Xiao; Joshi, R.P.;
By: Beebe, S.J.; Yu Jing; Kolb, J.F.; Jie Zhuang; Jiahui Song; Camp, J.T.; Schoenbach, K.H.; Shu Xiao; Joshi, R.P.;
2012 / IEEE
By: Jorgensen, M.M.; Alkeskjold, T.T.; Poli, F.; Coscelli, E.; Leick, L.; Selleri, S.; Cucinotta, A.; Broeng, J.;
By: Jorgensen, M.M.; Alkeskjold, T.T.; Poli, F.; Coscelli, E.; Leick, L.; Selleri, S.; Cucinotta, A.; Broeng, J.;
2011 / IEEE / 978-1-61284-878-5
By: Guillemoles, J.-F.; Le Bris, A.; Lombez, L.; Laribi, S.; Tea, E.; Aniel, F.;
By: Guillemoles, J.-F.; Le Bris, A.; Lombez, L.; Laribi, S.; Tea, E.; Aniel, F.;
2011 / IEEE / 978-1-4244-6051-9
By: Sano, M.B.; Neal, R.E.; Garcia, P.A.; Davalos, R.V.; Robertson, J.L.;
By: Sano, M.B.; Neal, R.E.; Garcia, P.A.; Davalos, R.V.; Robertson, J.L.;
2011 / IEEE / 978-1-4577-0479-6
By: Mata-Chavez, R.I.; Andrade-Lucio, J.A.; Alvarado-Mendez, E.; Trejo-Duran, M.; Vargas-Rodriguez, E.;
By: Mata-Chavez, R.I.; Andrade-Lucio, J.A.; Alvarado-Mendez, E.; Trejo-Duran, M.; Vargas-Rodriguez, E.;
2011 / IEEE / 978-1-4577-1389-7
By: Ying-Chih Lee; Chang-Lin Yeh; Yi-Shao Lai; Yau-Chang Lee; Bor-Tsuen Wang;
By: Ying-Chih Lee; Chang-Lin Yeh; Yi-Shao Lai; Yau-Chang Lee; Bor-Tsuen Wang;
2011 / IEEE / 978-1-4673-0759-8
By: Amalu, E.H.; Mallik, S.; Ekere, N.N.; Bhatti, R.S.; Otiaba, K.C.; Ekpu, M.;
By: Amalu, E.H.; Mallik, S.; Ekere, N.N.; Bhatti, R.S.; Otiaba, K.C.; Ekpu, M.;
2012 / IEEE / 978-80-214-4470-6
By: Wilfert, O.; Hudcova, L.; Poliak, J.; Ortega-Quijano, N.; Fanjul-Velez, F.; Salas-Garcia, I.; Arce-Diego, J.L.;
By: Wilfert, O.; Hudcova, L.; Poliak, J.; Ortega-Quijano, N.; Fanjul-Velez, F.; Salas-Garcia, I.; Arce-Diego, J.L.;
2012 / IEEE / 978-1-4577-1619-5
By: Zhe Wang; Zhehui Wang; Xuan Wang; Nikdast, M.; Jiang Xu; Weichen Liu; Wei Zhang; Xiaowen Wu; Yaoyao Ye;
By: Zhe Wang; Zhehui Wang; Xuan Wang; Nikdast, M.; Jiang Xu; Weichen Liu; Wei Zhang; Xiaowen Wu; Yaoyao Ye;
2012 / IEEE / 978-1-4673-1965-2
By: Jun So Pak; Joohee Kim; Jonghyun Cho; Manho Lee; Hyungdong Lee; Joungho Kim; Kunwoo Park; Junho Lee;
By: Jun So Pak; Joohee Kim; Jonghyun Cho; Manho Lee; Hyungdong Lee; Joungho Kim; Kunwoo Park; Junho Lee;
2012 / IEEE
By: Aigner, Robert; Collado, Carlos; Rocas, Eduard; Booth, James C.; Hueltes, Alberto; Mateu, Jordi;
By: Aigner, Robert; Collado, Carlos; Rocas, Eduard; Booth, James C.; Hueltes, Alberto; Mateu, Jordi;
2014 / IEEE
By: Cheng, B.; Alexander, C.; Nedjalkov, M.; Brown, A. R.; Wang, L.; Asenov, A.; Millar, C.;
By: Cheng, B.; Alexander, C.; Nedjalkov, M.; Brown, A. R.; Wang, L.; Asenov, A.; Millar, C.;
1990 / IEEE
By: Tur, M.; Cooper, J.M.; Chapuran, T.E.; Goldstein, E.L.; Zah, C.-E.; Vecchi, M.P.; Kobrinski, H.; Goodman, M.S.;
By: Tur, M.; Cooper, J.M.; Chapuran, T.E.; Goldstein, E.L.; Zah, C.-E.; Vecchi, M.P.; Kobrinski, H.; Goodman, M.S.;
1990 / IEEE
By: Montrosset, I.; Destefanis, G.; Bava, G.P.; Meliga, M.; Maio, I.; Goano, M.; Caponio, N.P.;
By: Montrosset, I.; Destefanis, G.; Bava, G.P.; Meliga, M.; Maio, I.; Goano, M.; Caponio, N.P.;