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Topic: Thermal Degradation

Results

Performance of GaAs/Mirror/Cu-Substrate Thin-Film Solar Cells

2011 / IEEE
By: Chih-Hung Wu; Fan-Lei Wu; Ray-Hua Horng; Ming-Chun Tseng; Min-De Yang;

Study of kinetic behavior of silicone rubber used on the cover of polymeric insulators

2011 / IEEE
By: Almirall, I.P.; Angelini, J.M.G.; Ferreira, C.A.; Coser, E.;

A Novel Method for Stripping Cladding Lights in High Power Fiber Lasers and Amplifiers

2012 / IEEE
By: Nasirabad, R.R.; Babazadeh, A.; Roohforouz, A.; Golshan, A.H.; Norouzy, A.; Jafari, N.T.; Amidian, A.; Alavian, A.; Poozesh, R.; Hejaz, K.; Heidariazar, A.;

Comparative study of the thermal degradation of synthetic and natural esters and mineral oil: effect of oil type in the thermal degradation of insulating kraft paper

2012 / IEEE
By: Gomes, A.R.; Martins, M.A.G.;

Modeling of Replacement Alternatives for Power Transformer Populations

2012 / IEEE
By: van Schijndel, A.; Wetzer, J.M.; Wouters, P.A.A.F.;

New test method to evaluate the thermal aging of aramid materials

2011 / IEEE / 978-1-4577-0279-2
By: Filliben, S.A.;

Root cause investigation of the inadvertent failure of unit 2 forced draft fan motor and the corrective actions implemented

2011 / IEEE / 978-1-4577-0279-2
By: Amoo-Otoo, J.K.;

Enhance the thermal stability of PMMA by predecomposing its defect structures in a continuous polymerization process

2011 / IEEE / 978-1-61284-774-0
By: Chunlei Cao; Huixuan Zhang; Zhenguo Liu; Zijian Zhang; Xiumei Zhang;

Fast algorithms for thermal constrained performance optimization in DAG scheduling on multi-core processors

2011 / IEEE / 978-1-4577-1221-0
By: Ahmad, I.; Sheikh, H.F.;

Thermal degradation characteristics of insulating paper and oils

2011 / IEEE / 978-1-4244-7355-7
By: Arazoe, S.; Saruhashi, D.; Kiyama, I.; Okabe, S.; Yanabu, S.;

Nanostructuration of Graphene Nanoribbons for thermoelectric applications

2011 / IEEE / 978-1-61284-418-3
By: Saint-Martin, J.; Mazzamuto, F.; Dollfus, P.; Chassat, C.; Apertet, Y.; Nguyen, V.H.;

Recent research in analog placement considering thermal gradient

2011 / IEEE / 978-1-4577-0618-9
By: Lin, M.P.-H.;

Cole-cole diagram as diagnostic tool for dielectric liquids

2011 / IEEE / 978-1-4244-7355-7
By: Josef, P.; Jiri, B.; Pavel, T.; Vaclav, M.; Martin, S.; Petr, M.;

Diagnostic criteria based on the correlation of the measurement of DGA, moisture contents with PD & tan d in MV oil-filled underground cable

2011 / IEEE / 978-1-4244-7355-7
By: Osman, H.; Majeed, J.A.; Zarim, Z.A.A.; Ghani, A.B.A.;

Study of trap levels by photo-stimulated discharge for nano-powder doping low density polyethylene

2011 / IEEE / 978-1-4577-1025-4
By: An, Z.L.; Zhang, Y.W.; Zhu, Z.E.; Zheng, F.H.;

Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application

2011 / IEEE / 978-0-9568086-0-8
By: Otiaba, K.C.; Amalu, E.H.; Mallik, S.; Bhatti, R.S.; Ekere, N.N.;

BER Analysis of Incoherent SAC-OCDMA System Using ZVCC in a Noisy Environment

2012 / IEEE / 978-1-4673-0471-9
By: Sharma, S.; Preeti;

Comparison of solar cell device thermal degradation and low-irradiance performance

2011 / IEEE / 978-1-4244-9965-6
By: Feist, R.; Ramesh, N.; Thompson, K.; Mills, M.;

Minority carrier lifetime of thermal degradation in organic light emitting diode

2012 / IEEE / 978-1-4673-0836-6
By: Byoung-Seon Choi; Hyun-Ae Park; Byoung-Deog Choi;

Use of temperature as a health monitoring tool for solder interconnect degradation in electronics

2012 / IEEE / 978-1-4577-1911-0
By: Qiang Yu; Pecht, M.; Osterman, M.; Chauhan, P.;

Calculation of the remaining lifetime of power transformers paper insulation

2012 / IEEE / 978-1-4673-1653-8
By: Notingher, P.V.; Gorgan, B.; Tanasescu, G.; van Schijndel, A.; Wouters, P.A.A.F.; Verhaart, H.F.A.; Wetzer, J.M.;

Self-heating and current degradation in 25 nm FD SOI devices with (100) and (110) crystallographic orientation

2012 / IEEE / 978-1-4673-0707-9
By: Raleva, K.; Goodnick, S.M.; Vasileska, D.;

Transformer rating for solar PV plants based on overloading capability as per guidelines

2014 / IEEE
By: K, Rajapandiyan; Rajender, Kasadi; Vallisaranya;

In situ oxidizing environment field emission study of Mo nanowall cold cathode

2014 / IEEE
By: Xu, N. S.; Shen, Yan; Chen, Jun; Liu, Fei; Zhang, Yu; Deng, S. Z.;

Security of Energy Supply With Change in Weather Conditions and Dynamic Thermal Limits

2014 / IEEE
By: Jayaweera, D.; Islam, S.;

Thermal Degradation Behavior of Silicon Dioxide-Coated Indium–Tin–Oxide Thin Films on Glass in a Storage Status Under Highly Accelerated Life Testing

2014 / IEEE
By: Ma, X.; Kang, R.; Lin, F.;

Influence of paper ageing on space charge dynamics in oil impregnated insulation paper under DC electric field

2014 / IEEE
By: Hao, Jian; Fu, Jin; Zhang, Wei; Cui, Huailiang; Li, Ke; Liu, Haibin;

Remaining antioxidant and thermal-radiation degradation in ethylene-propylene-diene rubber

2014 / IEEE
By: Kurihara, T.; Fuse, N.; Misaka, H.; Okamoto, T.; Homma, H.; Kanegami, M.;

Degradation mechanisms of silicone rubber (SiR) by accelerated ageing for cables of nuclear power plant

2014 / IEEE
By: Seguchi, T.; Tamura, K.; Kudoh, H.; Sugimoto, M.; Shimada, A.;

Failure analysis of thermal degradation of TIM during power cycling

2014 / IEEE
By: Longworth, H.; Rivera, K. C.; Sikka, K.; Pompeo, F.; Lian, C.; Liu, H.; Li, S.; Zhang, H.; Bunt, J.;

Carbon based Thermal Interface Material for high performance cooling applications

2014 / IEEE
By: Yajima, Michiaki; Jain, Syadwad; Yoshikawa, Toru; Culic-Viskota, Jelena; Yamamoto, Rei; Sauciuc, Ioan; Amoah-Kusi, Christian; Labanok, Nick;

Predicting thermo-mechanical degradation of first-level thermal interface materials (TIMs) in flip-chip electronic packages

2014 / IEEE
By: Sinha, Tuhin; Iruvanti, Sushumna; Wagner, Rebecca N.; Zitz, Jeffery A.;

Fabrication and characterization of room-temperature-bonded composite lasers

2013 / IEEE
By: Ishikawa, Takuya; Shoji, Ichiro; Matsumoto, Shinnosuke; Hara, Kenjiro; Yamauchi, Taiki;

A new MOSFET with large-tilt-angle implanted drain (LATID) structure

1988 / IEEE
By: Kurimoto, K.; Hori, T.;

Hot-electron degradation of n-channel polysilicon MOSFETs

1988 / IEEE
By: Shichijo, H.; Sundaresan, R.; Banerjee, S.; Malhi, S.;

Minimizing power dissipation in a disk file actuator

1988 / IEEE
By: Cooper, E.S.;

An investigation of magnesium rotors in motor operated valve actuators

1988 / IEEE
By: Kueck, J.D.;

EPR-based URD insulation: a question of confidence

1988 / IEEE
By: Brown, M.;

The effects of the thermal protection system on the Space Shuttle S-band quad antennas

1988 / IEEE
By: Lindsey, J.F., III;

High-field-induced degradation in ultra-thin SiO/sub 2/ films

1988 / IEEE
By: Nguyen, T.N.; Olivo, P.; Ricco, B.;

A comparison of sensitivity degradations for optical homodyne versus direct detection of on-off keyed signals

1988 / IEEE
By: Timor, U.; Linke, R.A.;

Accelerated life tests of ceramic capacitors

1988 / IEEE
By: Mogilevski, B.M.; Shirn, G.A.;

Reliability of multilayer ceramic capacitors after thermal shock

1988 / IEEE
By: McLaughlin, B.; Cooper, A.; Childs, M.; Rawal, B.S.;

Metal electromigration induced by solder flux residue in hybrid microcircuits

1988 / IEEE
By: Benson, R.C.; Weiner, J.A.; Charles, H.K., Jr.; Nall, B.H.; Romenesko, B.M.;

Error rate considerations for 256-QAM systems in presence of adjacent channel interference

1988 / IEEE
By: Mathiopoulos, P.; Feher, K.;

Evaluation criteria of the environmental degradation of organic insulation materials: sorption kinetics and electrical properties

1988 / IEEE
By: Egiziano, L.; Tucci, V.; Lupo, G.; Bozzo, R.;

Application of a sealed tube test to the study of degraded insulation resulting from thermal aging of cables with PVC jacket

1988 / IEEE
By: Exrin, M.; Bernstein, B.;

A one step annealing for dopants activation, silicide resistivity lowering and glass flow by rapid thermal processing

1988 / IEEE
By: Goffin, B.; Rivas, G.; Gloesener, D.; Van de Wiele, F.; Coppee, J.L.;

Thermal processing of labile materials: a kinetic approach

1988 / IEEE
By: Wolk, G.L.; Ziger, D.H.;

Digital characteristics of CMOS devices at cryogenic temperatures

1989 / IEEE
By: Deen, M.J.;

Solderability degradation models for fusible tin alloy coatings on copper substrates

1988 / IEEE
By: Kottke, M.; Geist, H.;

Accelerated life tests of ceramic capacitors

1988 / IEEE
By: Mogilevsky, B.M.; Shirn, G.A.;

Metal electromigration induced by solder flux residue in hybrid microcircuits

1988 / IEEE
By: Charles, H.K., Jr.; Nall, B.H.; Weiner, J.A.; Romenesko, B.M.; Benson, R.C.;

Differential thermal expansion in microelectronic systems

1988 / IEEE
By: Royce, B.S.H.;

Degradation of polymeric insulation due to photoemission caused by high electric fields

1989 / IEEE
By: Bulinski, A.T.; Bamji, S.S.; Densley, R.J.;

Tracking degradation and pyrolysis of EPDM insulators

1989 / IEEE
By: Galembeck, F.; Almeida, G.R.; Barbosa, S.P.; da Costa, R.A.; Nunes, S.P.;

Effect of high thermal stability mold material on the gold-aluminum bond reliability in epoxy encapsulated VLSI devices

1988 / IEEE
By: Delenia, E.; Romero, J.; Fatemi, H.; Khan, M.;

Mechanical performance of thermally aged trailing-cable insulation

1988 / IEEE
By: Yenchek, M.R.; Kovalchik, P.G.;

Hydrophobicity of organic insulating materials

1988 / IEEE
By: Komatsubara, M.; Ishii, M.;

Differential thermal expansion in microelectronic systems

1988 / IEEE
By: Royce, B.S.H.;

Improved transconductance under high normal field MOSFETs with ultrathin nitrided oxides

1989 / IEEE
By: Iwasaki, H.; Hori, T.;

Improved hot-carrier immunity in submicrometer MOSFETs with reoxidized nitrided oxides prepared by rapid thermal processing

1989 / IEEE
By: Iwasaki, H.; Hori, T.;

5 Gbit/s direct optical DPSK modulation of a 1530-nm DFB laser

1989 / IEEE
By: Vodhanel, R.S.;

Environmental impact on composite EPDM insulators

1988 / IEEE
By: Sherif, E.; Vlastos, A.E.;

Electrical properties of ZnO-Bi/sub 2/O/sub 3/ two-layer composites

1988 / IEEE
By: Ieda, M.; Mizutani, T.; Nakagawa, M.; Suzuoki, Y.;

Some observations on artificial cavities in a cross-linked polyethylene

1988 / IEEE
By: Garcia, G.; Mayoux, C.;

Study of rapid thermal evaluation for form-wound winding insulation systems

1988 / IEEE
By: Wanfa Sheng; Jingliang Li; Weixian Li;

The relationship between electro-chemical-tree ageing and charge relaxations behaviour of XLPE power cables

1988 / IEEE
By: Evers, E.; Kranz, H.-G.;

Development of automatic measurement system for growth and shape of tree by image processing

1988 / IEEE
By: Yanagiwara, M.; Noto, F.; Yoshimura, N.;

Correlation between charge injection and electroluminescence in polyethylene under prebreakdown AC field

1988 / IEEE
By: Laurent, C.; Lebey, T.;

Study of the compatibility of self-healing polypropylene capacitors with impulsive conditions met in power electronics applications

1988 / IEEE
By: Pirani, S.; Nucci, C.A.; Rinaldi, M.;

Electric polarization of polymers in metal-dielectric-metal systems

1988 / IEEE
By: Voronezhtsev, Y.; Pinchuk, L.; Goldade, V.;

Aging of multistressed polymeric insulators

1989 / IEEE
By: Agarwal, V.K.;

Gate bias polarity dependence of charge trapping and time-dependent dielectric breakdown in nitrided and reoxidized nitrided oxides

1989 / IEEE
By: Murali, V.; Wu, A.T.; Garner, M.; Fraser, D.B.; Triplett, B.; Nulman, J.;

Mechanical performance of thermally aged trailing-cable insulation

1989 / IEEE
By: Kovalchik, P.G.; Yenchek, M.R.;

Neutron/gamma induced damage mechanisms and synergistic effects in GaAs MESFETs

1989 / IEEE
By: Badawi, M.H.; Chang, J.Y.; DeCicco, A.;

Physico-chemical analysis of a failed cable

1989 / IEEE
By: Phillips, P.J.; Vatansever, A.;

The space performance of silicon vertical junction solar cells on the LIPS-III satellite

1989 / IEEE
By: Statler, R.L.; Walker, D.H.;

Stability of simulation of a population of chemical polymers on the massively parallel processor

1988 / IEEE / 0-8186-5892-4
By: Cohen, D.M.;

R&M through avionics/electronics integrity program

1989 / IEEE
By: Bhagat, W.W.;

Importance of accurate thermal analyses (computer reliability)

1989 / IEEE
By: Jacobson, D.W.;

Comments, with reply, on "Metallurgic and contact resistance studies of sleeve connectors in aluminum cable splices" by C. Dang and M. Braunovic

1990 / IEEE
By: Albertalli, C.F.;

Evaluation of polyimides as dielectric materials for multichip packages with multilevel interconnection structure

1990 / IEEE
By: Lin, A.W.;

Electrical properties of ZnO/Bi/sub 2/O/sub 3/ two-layer composites

1990 / IEEE
By: Suzuoki, Y.; Ieda, M.; Mizutani, T.; Nakagawa, M.;

On the very-high-current degradations on Si n-p-n transistors

1990 / IEEE
By: Tang, D.D.-L.; Chen, T.-C.; Hackbarth, E.;

Environmental aging of insulating materials

1990 / IEEE
By: Dixon, R.R.;

Degradation of electrical insulating paper monitored with high performance liquid chromatography

1990 / IEEE
By: Unsworth, J.; Mitchell, F.;

Sidelobe level performance of adaptive sidelobe canceller arrays with element reuse

1990 / IEEE
By: Ward, J.; Compton, R.T., Jr.;

Void free bonding of large silicon dice using gold-tin alloys

1990 / IEEE
By: Wang, C.Y.; Matijasevic, G.S.; Lee, C.C.;

Silicon interconnect-a critical factor in device thermal management

1990 / IEEE
By: Smith, K.; Witzman, S.; Metelski, G.;

Strength and reliability of ceramic modules soldered to flexible cables

1990 / IEEE
By: Yong, Y.-N.; Wang, A.T.; Prosser, J.F.; Panousis, N.T.;

Thermal degradation of electrical insulating materials and the thermokinetic background: theoretical basis

1990 / IEEE
By: Lebok, F.J.; Montanari, G.C.;

Thermal degradation of electrical insulating materials and the thermokinetic background: experimental data

1990 / IEEE
By: Lebok, F.J.; Montanari, G.C.;

Reliability aspects of thermally stable LaB/sub 6/-Au Schottky contacts to GaAs

1990 / IEEE
By: Hartnagel, H.L.; Singh, J.K.; Wurfl, J.;

TEM analysis of failed bits and improvement of data retention properties in megabit-DRAMS

1990 / IEEE
By: Ayukawa, A.; Onishi, S.; Sakiyama, K.; Tanaka, K.;

The modelling and design of composite piezoelectric arrays

1989 / IEEE
By: Hayward, G.; Gorfu, Y.; Hossack, J.;

Pulse withstand capability of self-healing metalized polypropylene capacitors in power applications

1991 / IEEE
By: Pirani, S.; Nucci, C.A.; Rinaldi, M.;

High temperature alloy and contact annealing with RTA on AlSi/TiW metallization

1989 / IEEE
By: Liou, J.C.; Su, W.-D.; Chou, H.M.; Tuan, H.C.;

Electrical ageing of polyethylene during constant AC stress

1989 / IEEE
By: Rose, W.; Nissen, K.W.; Rohl, P.;

Degradation and electrical behavior of aged XLPE cable models

1989 / IEEE
By: Sandrolini, F.; Motori, A.; Montanari, G.C.;

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