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Topic: Stimulated Emission
Results
2011 / IEEE
By: Freude, W.; Koos, C.; Bimberg, D.; Schmeckebier, H.; Leuthold, J.; Guetlein, J.; Vallaitis, T.; Bonk, R.; Meuer, C.;
By: Freude, W.; Koos, C.; Bimberg, D.; Schmeckebier, H.; Leuthold, J.; Guetlein, J.; Vallaitis, T.; Bonk, R.; Meuer, C.;
2012 / IEEE
By: Xuejun Xu; Narusawa, S.; Chiba, T.; Shiraki, Y.; Jinsong Xia; Usami, N.; Maruizumi, T.; Tsuboi, T.;
By: Xuejun Xu; Narusawa, S.; Chiba, T.; Shiraki, Y.; Jinsong Xia; Usami, N.; Maruizumi, T.; Tsuboi, T.;
2012 / IEEE
By: Weixia Lan; Xuebin Wan; Zhaojun Liu; Xingyu Zhang; Guofan Jin; Qingpu Wang; Fen Bai; Huaijin Zhang;
By: Weixia Lan; Xuebin Wan; Zhaojun Liu; Xingyu Zhang; Guofan Jin; Qingpu Wang; Fen Bai; Huaijin Zhang;
2012 / IEEE
By: Jaehyun Moon; Jin Woo Huh; Hye Yong Chu; Jeong-Ik Lee; Doo-Hee Cho; Joo Won Lee; Joohyun Hwang; Jun-Han Han; Jin-Wook Shin; Chul Woong Joo;
By: Jaehyun Moon; Jin Woo Huh; Hye Yong Chu; Jeong-Ik Lee; Doo-Hee Cho; Joo Won Lee; Joohyun Hwang; Jun-Han Han; Jin-Wook Shin; Chul Woong Joo;
2012 / IEEE
By: Buhl, L.L.; Cappuzzo, M.; Kimber, M.; Doerr, C.; Cusick, T.; Nakagawa, J.; Brinton, C.; Iannone, P.P.; Reichmann, K.C.; Spiekman, L.; Tokle, T.; Palsdottir, B.; Chang, Y.F.; Lentz, J.; Kanan, A.M.; Johnson, J.; Gomez, L.; Chen, E.Y.;
By: Buhl, L.L.; Cappuzzo, M.; Kimber, M.; Doerr, C.; Cusick, T.; Nakagawa, J.; Brinton, C.; Iannone, P.P.; Reichmann, K.C.; Spiekman, L.; Tokle, T.; Palsdottir, B.; Chang, Y.F.; Lentz, J.; Kanan, A.M.; Johnson, J.; Gomez, L.; Chen, E.Y.;
2012 / IEEE
By: Bouwmans, G.; Min Won Lee; Kudlinski, A.; Stiller, B.; Delque, M.; Sylvestre, T.; Maillotte, H.; Beugnot, J.-C.;
By: Bouwmans, G.; Min Won Lee; Kudlinski, A.; Stiller, B.; Delque, M.; Sylvestre, T.; Maillotte, H.; Beugnot, J.-C.;
2012 / IEEE
By: Hashizume, Y.; Suzuki, K.; Mizuno, T.; Ono, H.; Abe, Y.; Takara, H.; Matsuo, S.; Takenaga, K.; Takahashi, T.;
By: Hashizume, Y.; Suzuki, K.; Mizuno, T.; Ono, H.; Abe, Y.; Takara, H.; Matsuo, S.; Takenaga, K.; Takahashi, T.;
2012 / IEEE
By: Winzer, P.J.; Delbue, R.; Gnauck, A.H.; Schmidt, C.; Randel, S.; Mestre, M.A.; Ryf, R.; Lingle, R.; McCurdy, A.; Peckham, D.W.; Essiambre, R.-J.; Jiang, X.; Sun, Y.; Sureka, A.; Pupalaikis, P.;
By: Winzer, P.J.; Delbue, R.; Gnauck, A.H.; Schmidt, C.; Randel, S.; Mestre, M.A.; Ryf, R.; Lingle, R.; McCurdy, A.; Peckham, D.W.; Essiambre, R.-J.; Jiang, X.; Sun, Y.; Sureka, A.; Pupalaikis, P.;
1992 / IEEE / 000-0-0000-0000-0
By: Pechacek, R.E.; Myers, M.C.; Peyser, T.A.; Meger, R.A.; Antoniades, J.A.; Murphy, D.P.;
By: Pechacek, R.E.; Myers, M.C.; Peyser, T.A.; Meger, R.A.; Antoniades, J.A.; Murphy, D.P.;
2011 / IEEE / 978-1-4577-1226-5
By: de Aldana, J.R.V.; Romero, C.; Climent, V.; Lancis, J.; Mendoza-Yero, O.; Camino, A.; Roso, L.; Andres, P.; Minguez-Vega, G.; Borrego-Varillas, R.; Hernandez-Toro, J.;
By: de Aldana, J.R.V.; Romero, C.; Climent, V.; Lancis, J.; Mendoza-Yero, O.; Camino, A.; Roso, L.; Andres, P.; Minguez-Vega, G.; Borrego-Varillas, R.; Hernandez-Toro, J.;
2011 / IEEE / 978-1-61284-329-2
By: Sharypov, K.A.; Yalandin, M.I.; Ulmaskulov, M.R.; Reutova, A.G.; Shunailov, S.A.; Zotova, I.V.; Sergeev, A.S.; Ginzburg, N.S.;
By: Sharypov, K.A.; Yalandin, M.I.; Ulmaskulov, M.R.; Reutova, A.G.; Shunailov, S.A.; Zotova, I.V.; Sergeev, A.S.; Ginzburg, N.S.;
2011 / IEEE / 978-1-61284-329-2
By: Sosnin, E.A.; Skakun, V.S.; Shitz, D.V.; Lomaev, M.I.; Erofeev, M.V.; Avdeev, S.M.; Tarasenko, V.F.;
By: Sosnin, E.A.; Skakun, V.S.; Shitz, D.V.; Lomaev, M.I.; Erofeev, M.V.; Avdeev, S.M.; Tarasenko, V.F.;
2011 / IEEE / 978-1-61284-244-8
By: Huffaker, D.L.; Scherer, A.; Liang, B.L.; Lin, A.; Shapiro, J.N.; Kim, S.; Scofield, A.C.;
By: Huffaker, D.L.; Scherer, A.; Liang, B.L.; Lin, A.; Shapiro, J.N.; Kim, S.; Scofield, A.C.;
2011 / IEEE / 978-1-61284-329-2
By: Shin, K.S.; Kim, Y.J.; Baek, K.H.; Seong, G.J.; Park, S.W.; Kang, H.G.; Shin, Y.G.;
By: Shin, K.S.; Kim, Y.J.; Baek, K.H.; Seong, G.J.; Park, S.W.; Kang, H.G.; Shin, Y.G.;
2011 / IEEE / 978-1-4577-0752-0
By: Andriyanto, D.; Najib A, M.; Manaf, Z.; Zamzuri, M.; Ahmad, A.; Tarsono, D.;
By: Andriyanto, D.; Najib A, M.; Manaf, Z.; Zamzuri, M.; Ahmad, A.; Tarsono, D.;
2011 / IEEE / 978-986-02-8974-9
By: Hongtao Zhou; Ying Huang; Ming Tang; Eng Leong Tan; Feng Luan; Songnian Fu; Shum, P.P.;
By: Hongtao Zhou; Ying Huang; Ming Tang; Eng Leong Tan; Feng Luan; Songnian Fu; Shum, P.P.;
2011 / IEEE / 978-986-02-8974-9
By: Hagio, T.; Haisong Jiang; Chaen, Y.; Hinokuma, Y.; Hamamoto, K.; Tajima, A.;
By: Hagio, T.; Haisong Jiang; Chaen, Y.; Hinokuma, Y.; Hamamoto, K.; Tajima, A.;
2011 / IEEE / 978-986-02-8974-9
By: Mou-Tion Lee; Dejiang Zhang; Shengqian Zhong; Zhiqiang Chen; Jian Deng; Xiaodong Zhou; Huijian Zhang; Xiaoli Huo; Junjie Li; Chengliang Zhang; Shaofeng Qi;
By: Mou-Tion Lee; Dejiang Zhang; Shengqian Zhong; Zhiqiang Chen; Jian Deng; Xiaodong Zhou; Huijian Zhang; Xiaoli Huo; Junjie Li; Chengliang Zhang; Shaofeng Qi;
2011 / IEEE / 978-986-02-8974-9
By: Thi Thanh Thuy Nguyen; Katsuyama, Y.; Yamada, M.; Koyama, O.; Nooruzzaman, M.;
By: Thi Thanh Thuy Nguyen; Katsuyama, Y.; Yamada, M.; Koyama, O.; Nooruzzaman, M.;
2011 / IEEE / 978-986-02-8974-9
By: Bhujwalla, Z.; Kakkad, S.; Yongping Chen; Jiefeng Xi; Glunde, K.; Murari, K.; Xingde Li; Yuying Zhang; Ming-Jun Li;
By: Bhujwalla, Z.; Kakkad, S.; Yongping Chen; Jiefeng Xi; Glunde, K.; Murari, K.; Xingde Li; Yuying Zhang; Ming-Jun Li;
Impact of the silicon layer thickness to the optical property of sandwich photonic crystal structure
2011 / IEEE / 978-1-61284-777-1By: Xuyuan Chen; Haisheng San; Changzheng Li; Fangqiang Li;
2011 / IEEE / 978-1-4577-1207-4
By: Dang Van Liet; Le Nguyen Binh; Nguyen Huu Phuong; Nguyen Anh Vinh;
By: Dang Van Liet; Le Nguyen Binh; Nguyen Huu Phuong; Nguyen Anh Vinh;
2011 / IEEE / 978-1-61284-878-5
By: Di Carlo, A.; Pecchia, A.; Auf der Maur, M.; Sacconi, F.; Lopez, M.;
By: Di Carlo, A.; Pecchia, A.; Auf der Maur, M.; Sacconi, F.; Lopez, M.;
2011 / IEEE / 978-1-61284-878-5
By: Walczak, J.; Czyszanowski, T.; Mutter, L.; Lamothe, E.; Sarzala, R.P.; Dems, M.;
By: Walczak, J.; Czyszanowski, T.; Mutter, L.; Lamothe, E.; Sarzala, R.P.; Dems, M.;
2011 / IEEE / 978-1-4244-6051-9
By: Simon, C.; Lamy, H.; Brandstrom, U.; Sandahl, I.; Sergienko, T.; Gustavsson, B.;
By: Simon, C.; Lamy, H.; Brandstrom, U.; Sandahl, I.; Sergienko, T.; Gustavsson, B.;
2011 / IEEE / 978-1-4244-6051-9
By: Huber, R.; Manzoni, C.; Brida, D.; Cerullo, G.; Leitenstorfer, A.;
By: Huber, R.; Manzoni, C.; Brida, D.; Cerullo, G.; Leitenstorfer, A.;
2011 / IEEE / 978-1-4244-6051-9
By: Smith, H.I.; Barwicz, T.; Holzwarth, C.W.; Khilo, A.; Kartner, F.X.; Popovic, M.A.; Dahlem, M.S.; Ippen, E.P.;
By: Smith, H.I.; Barwicz, T.; Holzwarth, C.W.; Khilo, A.; Kartner, F.X.; Popovic, M.A.; Dahlem, M.S.; Ippen, E.P.;
2011 / IEEE / 978-1-4244-6051-9
By: Chan, S.; Tombet, S.A.B.; Otsuji, T.; Ryzhii, V.; Ryzhii, M.; Satou, A.; Watanabe, T.;
By: Chan, S.; Tombet, S.A.B.; Otsuji, T.; Ryzhii, V.; Ryzhii, M.; Satou, A.; Watanabe, T.;
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