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Topic: Stacking

Results

Computational Limits to Nonparametric Estimation for Ergodic Processes
2011 / IEEE
By: Takahashi, H.;
Evaluation of a Simple Lamination Stacking Method for the Teeth of an Axial Flux Permanent-Magnet Synchronous Machine With Concentrated Stator Windings
2012 / IEEE
By: Vansompel, H.; Van den Bossche, A.; Dupre, L.; Sergeant, P.;
Redox Molecules for a Resonant Tunneling Barrier in Nonvolatile Memory
2012 / IEEE
By: Tuo-Hung Hou; Rajwade, S.; Qianyin Xu; Shaw, T.; Kan, E.C.;
Spectral Analysis of Quantum-Dash Lasers: Effect of Inhomogeneous Broadening of the Active-Gain Region
2012 / IEEE
By: Schwingenschlogl, U.; Tien Khee Ng; Khan, M.Z.M.; Ooi, B.S.;
Analysis and Design of a Stacked Power Amplifier With Very High Bandwidth
2012 / IEEE
By: Ellinger, F.; Wolf, R.; Fritsche, D.;
Comparative Study of MOSFET and IGBT for High Repetitive Pulsed Power Modulators
2012 / IEEE
By: Sung-Roc Jang; Geun Hie Rim; Goussev, G.; Hong-Je Ryoo;
Technical Methodology for ASTER Global DEM
2012 / IEEE
By: Iwasaki, A.; Urai, M.; Fujisada, H.;
A Wideband RF Power Amplifier in 45-nm CMOS SOI Technology With Substrate Transferred to AlN
2012 / IEEE
By: Yukeun Sim; Pajouhi, H.; Helmi, S.R.; Jing-Hwa Chen; Mohammadi, S.;
A Weak Security Notion for Visual Secret Sharing Schemes
2012 / IEEE
By: Iwamoto, M.;
The 3-D Stacking Bipolar RRAM for High Density
2012 / IEEE
By: Yi-Chung Chen; Pino, R.E.; Wei Zhang; Hai Li;
Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology
2012 / IEEE
By: Giovannini, P.; Beanato, G.; Leblebici, Y.; Temiz, Y.; Zervas, M.; Athanasopoulos, P.; Cevrero, A.;
Understanding and Fabrication of 20% Efficient Cells Using Spin-on-Based Simultaneous Diffusion and Dielectric Passivation
2012 / IEEE
By: Rohatgi, A.; Das, A.; Meemongkolkiat, V.; Ramanathan, S.; Koehler, I.;
Structure Design Optimization and Reliability Analysis on a Pyramidal-Shape Three-Die-Stacked Package With Through-Silicon Via
2012 / IEEE
By: Xiaowu Zhang; Chai, T.C.; Lim, S.P.S.; Che, F.X.;
Intra-, Inter-, and Extra-Container Path Loss for Shipping Container Monitoring Systems
2012 / IEEE
By: Moerman, I.; Martens, L.; Ruckebusch, P.; Joseph, W.; Tanghe, E.;
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
2012 / IEEE
By: Wen-Hwa Chen; Tai-Hong Chen; Yu-Ming Tsai; Hsien-Chie Cheng; Jing-Ye Juang; Su-Tsai Lu;
Resistive Solenoid Development at the NHMFL Based on Irregular Stacking Method
2012 / IEEE
By: Bird, M.D.; Jingping Chen;
Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die
2012 / IEEE
By: Sun-Rak Kim; Lee, S.S.; Yoo, C.D.; Jun-Yeob Song; Jae-Hak Lee; Lee, P.;
Three-Dimensional Solenoids Realized via High-Density Deep Coil Stacking for MEMS Application
2012 / IEEE
By: Kwong, D.L.; Gao, S.; Chong, S.C.; Hirshberg, A.; Li, H.Y.; Baram, A.; Ong, L.G.; Xie, L.; Herer, I.;
Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects
2012 / IEEE
By: Kun-Woo Park; Hyung-Dong Lee; Junho Lee; Joungho Kim; Heegon Kim; Jun So Pak; Kyoungchoul Koo; Chulsoon Hwang; Kiyeong Kim; Jonghyun Cho;
Band-to-Band-Tunneling Leakage Suppression for Ultra-Thin-Body GeOI MOSFETs Using Transistor Stacking
2012 / IEEE
By: Ming-Long Fan; Hu, V.P.-H.; Ching-Te Chuang; Pin Su;
Parameterization of Decoupling Controllers in the Generalized Plant Model
2012 / IEEE
By: Kiheon Park;
A Comparative Study on Two Types of Automated Container Terminal Systems
2012 / IEEE
By: Ek Peng Chew; Loo Hay Lee; Lu Zhen; Zhi-Xiang Xu; Dao-Fang Chang;
SOS-based generator with output voltage of 200kV and repetition rate of 2000Hz
2004 / IEEE / 978-5-87911-088-3
By: Wenhua Huang; Jiancang Su; Zhenjie Ding; Yongzhong Ding; Guozhi Liu; Shi Qiu; Jian Sun; Chunliang Liu; Xiaoxin Song; Zhimin Song;
A new method of determining the partial coefficient in the limit state design of crane structure
2011 / IEEE / 978-1-61284-666-8
By: Huiqing Qiu; Dashan Dong; Yuanyuan Teng;
Model analysis of single stacker fork based on FEM
2011 / IEEE / 978-1-4244-9439-2
By: Yongji Sun; Jingfang Fang; Yuqiao Zheng; Rongzhen Zhao;
High-performance on-chip network platform for memory-on-processor architectures
2011 / IEEE / 978-1-4577-0642-4
By: Daneshtalab, M.; Tenhunen, H.; Plosila, J.; Liljeberg, P.; Ebrahimi, M.;
Formation of complexes of quantum dots InAs and nanoclusters as in matrix GaAs by molecular beam epitaxy
2011 / IEEE / 978-1-61284-795-5
By: Preobrazhenskii, V.V.; Semyagin, B.R.; Zaichenko, A.A.; Bert, N.A.; Chaldyshev, V.V.; Nevedomskii, V.N.; Putyato, M.A.;
3D Super chip technology to achieve low-power and high-performance system-on-a chip
2011 / IEEE / 978-1-61284-660-6
By: Koyanagi, M.;
Nonlinear control on steel pipes stacking electro-hydraulic servo system with four cylinders
2011 / IEEE / 978-988-17255-9-2
By: Chen Guojin; Peng Lihui; Ni Jing;
3-D scene analysis via sequenced predictions over points and regions
2011 / IEEE / 978-1-61284-385-8
By: Xuehan Xiong; Hebert, M.; Bagnell, J.A.; Munoz, D.;
The effect of plasma pre-cleaning on the Cu-Cu direct bonding for 3D chip stacking.
2011 / IEEE / 978-1-4577-0158-0
By: Young-Bae Park; Hee-yeon Kim; Hak-Joo Lee; Kwang-Seup Kim; Jae-Won Kim; Seungmin Hyun;
Post-Synthesis Circuit Techniques for Runtime Leakage Reduction
2011 / IEEE / 978-1-4577-0803-9
By: Potluri, S.; Kamakoti, V.; Chandrachoodan, N.;
2D Common-reflection-surface stacking workflow in seismic data processing
2011 / IEEE / 978-1-61284-486-2
By: Mei Xiao; Guohua Liu;
The tunable bandgap of AB-stacking bilayer graphene under the applied electric fields for power devices
2011 / IEEE / 978-1-4577-0536-6
By: Wenbo Wang; Liu Yan; Bin Yu; Kuang Sheng; Qing Guo; Tao Wan;
Video segmentation using BIC and stacked scanning
2011 / IEEE / 978-1-61284-350-6
By: Tam, King Yiu; Levy, David; Lay, Jose;
Exploring performance, power, and temperature characteristics of 3D systems with on-chip DRAM
2011 / IEEE / 978-1-4577-1221-0
By: Rossell, D.; Jie Meng; Coskun, A.K.;
On instability of the ergodic limit theorems with respect to small violations of algorithmic randomness
2011 / IEEE / 978-1-4577-0595-3
By: V'yugin, V.;
Efficient supercapacitor energy usage in mobile phones
2011 / IEEE / 978-1-4577-0234-1
By: Fonseca, R.; Garrido, N.; Monteiro, J.;
Leveraging on-chip DRAM stacking in an embedded 3D multi-core DSP system
2011 / IEEE / 978-1-61284-857-0
By: Tingting Hwang; Jen-Chieh Yeh; Chuan-Nan Liu; Yi-Ta Wu; Yuan Xie; Shau-Yin Tseng; Wei-Heng Lo; Po-Yang Hsu; Tao Zhang;
Stacker scheduling algorithm of turn-type and multiexport three-dimensional warehouse
2011 / IEEE / 978-1-61284-181-6
By: Yang-sen Zhang; Lin Wu;
A study on the properties of photoconductivity and photo voltage of buckpaper
2011 / IEEE / 978-1-61284-777-1
By: Liu, J.H.; Ciou, J.L.; Miao, H.Y.;
The image multiple secret sharing schemes without pixel expansion
2011 / IEEE / 978-1-4577-0308-9
By: Meng-Lin Chiang; Ching-Te Wang; Ching-Lin Wang;
Optically transparent ground planes with high order response using miniaturized element frequency selective surfaces
2011 / IEEE / 978-1-4244-6051-9
By: Sarabandi, K.; Kashanianfard, M.;
Coherent stacking of SAR images for efficient interferometric processing
2011 / IEEE / 978-1-4577-1005-6
By: Lopez-Dekker, P.; De Zan, F.;
Analyzing the performance and energy impact of 3D memory integration on embedded DSPs
2011 / IEEE / 978-1-4577-0801-5
By: Chang, D.W.; Schulte, M.J.; Kim, N.S.;
Test challenges for 3D integration (an invited paper for CICC 2011)
2011 / IEEE / 978-1-4577-0223-5
By: Bottoms, W.R.;
Compensation of externally applied mechanical stress by stacking of ultra-thin chips
2011 / IEEE / 978-1-4577-0708-7
By: Harendt, C.; Rempp, H.; Endler, S.; Burghartz, J.N.;
Characteristics of ASTER GDEM version 2
2011 / IEEE / 978-1-4577-1005-6
By: Kaku, M.; Hato, M.; Tachikawa, T.; Iwasaki, A.;
A Verifiable Visual Cryptography Scheme
2011 / IEEE / 978-1-4577-0817-6
By: Yi-Hui Chen; Chiao-Chih Huang; Ci-Wei Lan;
3D specific systems design and CAD
2011 / IEEE / 978-1-4577-0801-5
By: Davis, W.R.; Franzon, P.D.; Melamed, S.; Thorolfsson, T.;
Implementation of extraordinary transmission based devices in millimeter wave bands
2011 / IEEE / 978-1-61284-965-2
By: Illescas, J.; Estevez, A.; Navarro-Cia, M.; Beruete, M.; Sorolla, M.; Falcone, F.;
Process development of multi-layer stacked chip module
2011 / IEEE / 978-1-4577-1769-7
By: Shenglin Ma; Yufeng Jin; Jin Chen; Min Miao; Xin Sun; Qinghu Cui; Wenping Kang; Yunhui Zhu;
Multi-rates fuel cell emulation with spatial reduced real-time fuel cell modelling
2011 / IEEE / 978-1-4244-9500-9
By: Fei Gao; Miraoui, A.; Bouquain, D.; Blunier, B.; Chrenko, D.;
A Clonal Selection Algorithm for the container stacking problem
2011 / IEEE / 978-1-4577-1124-4
By: Carraro, L.A.; de Castro, L.N.;
Performance enhancement of annular ring antenna using air gaps in stacked substrate
2011 / IEEE / 978-1-4577-1497-9
By: Chakraborty, S.; Srivastava, S.;
A high step-up gain DC-DC converter based on the stacking of three conventional buck boost DC-DC converters
2011 / IEEE / 978-1-4577-1646-1
By: Barbi, I.; Tanca V, M.C.;
Development of workload models for CNC machines from 3 - Phase current consumption using ensemble method
2011 / IEEE / 978-1-4577-0246-4
By: Raktham, T.; Piromsopa, K.;
3D NoC using through silicon Via: An asynchronous implementation
2011 / IEEE / 978-1-4577-0170-2
By: Dutoit, D.; Vivet, P.; Clermidy, F.; Thonnart, Y.;
Application conditions of crooked line seismic survey and quality controlling of the key working procedures
2011 / IEEE / 978-1-4244-9306-7
By: Qing-dao Yang; Jian-hui Hu; Ji-bai Li; Wei-feng Wang;
An effective heuristic for yard template design in land-scarce container terminals
2011 / IEEE / 978-1-4577-0739-1
By: Mingkun Li; Shiying Li;
Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration
2011 / IEEE / 978-1-4673-0149-7
By: Lau, J.H.;
Classification by Clusters Analysis - An Ensemble Technique in a Semi-supervised Classification
2011 / IEEE / 978-1-4577-2068-0
By: Yaxin Bi; Jurek, A.; Nugent, C.; Shengli Wu;
Development of micro-bump-bonded processes for 3DIC stacking with high throughput
2011 / IEEE / 978-1-4577-1389-7
By: Jong-Shiou Peng; Yu-Lan Lu; Su-Mei Cheng; Su-Ching Chung; Su-Tsai Lu; Jing-Ye Juang; Tai-Hong Chen;
System-in-Packages with embedded components for modular systems
2011 / IEEE / 978-1-4577-1389-7
By: Manessis, D.; Bruehl, B.; Ostmann, A.; Lang, K.-D.; Seckel, M.;
Full wafer level stacking without TSV applications to memory-only and heterogeneous SiP
2011 / IEEE / 978-1-4577-1389-7
By: Noiray, P.C.J.; Val, C.; Boulay, N.;
High-speed electrical design study for 3D-IC packaging technology
2011 / IEEE / 978-1-4577-1389-7
By: Ma, M.; Lee, D.; Chiang, K.; Sung, R.;
Development of rubber tire gantry crane (prototype) obstacles avoidance method using a single sensor on microcontroller based
2011 / IEEE / 978-1-4577-1417-7
By: Bin Md Sani, Z.; Bin Bahar, M.B.;
Investigations of adhesion between Cu and Benzocyclobutene (BCB) polymer dielectric for 3D integration applications
2011 / IEEE / 978-1-4577-1389-7
By: Hu, S.H.; Ko, C.T.; Huang, W.C.; Chen, K.N.; Leu, J.;
A novel four layers package-on-package stacking technique
2011 / IEEE / 978-1-4673-0149-7
By: Xiao Yuanming; Shi Lingfeng; Lai Xinquan; Liu Chen; Jia Jun; Zhang Ke;
Structure analysis of CVD graphene films based on HRTEM contrast simulations
2011 / IEEE / 978-1-4577-1516-7
By: Solanki, R.; Rouvimov, S.; Plachinda, P.;
Simultaneous Prediction of RNA Secondary Structure and Helix Coaxial Stacking
2011 / IEEE / 978-1-4577-1799-4
By: Malmberg, R.; Yingfeng Wang; Shareghi, P.; Liming Cai;
Modular microelectronics by System-in-Packages with embedded components
2011 / IEEE / 978-0-9568086-0-8
By: Seckel, M.; Manessis, D.; Bruehl, B.; Ostmann, A.; Lang, K.-D.;
Novel authentication system using visual cryptography
2011 / IEEE / 978-1-4673-0126-8
By: Aggarwal, A.; Malik, S.; Jaya; Sardana, A.;
Maximizing all margins: Pushing face recognition with Kernel Plurality
2011 / IEEE / 978-1-4577-1102-2
By: Banerjee, A.; Kumar, R.; Pfister, H.; Vemuri, B.C.;
VVCS: Verifiable Visual Cryptography Scheme
2011 / IEEE / 978-1-4577-2008-6
By: Cheng Xiaoni; Yao Dong; Han Yanyan; He Wencai;
Distributed convex optimization with identical constraints
2011 / IEEE / 978-1-61284-801-3
By: Nikookhoy, S.; Choon Yik Tang; Jie Lu;
Vertical-channel stacked array (VCSTAR) for 3D NAND flash memory
2011 / IEEE / 978-1-4577-1756-7
By: Wandong Kim; Se Hwan Park; Yoon Kim; Byung-Gook Park; Joo Yon Seo;
3D Specific Systems: Design and CAD
2011 / IEEE / 978-1-4577-1984-4
By: Franzon, P.D.; Melamed, S.; Thorolfsson, T.; Davis, W.R.;
Testing and Design-for-Testability Techniques for 3D Integrated Circuits
2011 / IEEE / 978-1-4577-1984-4
By: Noia, B.; Chakrabarty, K.;
A Novel Technique for Secret Communication through Optimal Shares Using Visual Cryptography (SCOSVC)
2011 / IEEE / 978-1-4577-1880-9
By: Ghatak, S.; Mandal, J.K.;
Phase Map Generation for Phase Shift Moire Using CUDA
2011 / IEEE / 978-1-4577-1807-6
By: DaeHwa Jeong; KyoungSeop Chang; YoungJun Roh; Sah, S.;
An Empirical Investigation of Stacking for Music Tag Annotation
2011 / IEEE / 978-1-4577-2134-2
By: Tzanetakis, G.; Pierce, M.; Theocharis, A.;
Extended defects that affect carrier lifetime in high blocking voltage SiC epilayers
2011 / IEEE / 978-1-4577-1756-7
By: Caldwell, J.D.; Stahlbush, R.E.; Mahadik, N.A.; Burk, A.; O'Loughlin, M.;
Expansion of Shockley Stacking faults in high doped 4H-SiC epilayers
2011 / IEEE / 978-1-4577-1756-7
By: Eddy, C.R.; Myers-Ward, R.L.; Imhoff, E.A.; Hobart, K.D.; Gaskill, D.K.; Mahadik, N.A.; Stahlbush, R.E.; Kub, F.J.;
On modeling and optimizing cost in 3D Stacked-ICs
2011 / IEEE / 978-1-4673-0469-6
By: Taouil, M.; Marinissen, E.J.; Hamdioui, S.;
3D stacking approaches for mold embedded packages
2011 / IEEE / 978-0-9568086-0-8
By: Bader, V.; Kahle, R.; Fischer, T.; Voges, S.; Topper, M.; Thomas, T.; Bauer, J.; Piefke, K.; Becker, K.-F.; Braun, T.; Lang, K.-D.; Aschenbrenner, R.;
Computerized Analysis of Classification of Lung Nodules and Comparison between Homogeneous and Heterogeneous Ensemble of Classifier Model
2011 / IEEE / 978-1-4577-2102-1
By: Rao, A.; Vinay, K.; Kumar, G.H.;
Analysis of yield improvement techniques for CNFET-based logic gates
2011 / IEEE / 978-1-4577-1516-7
By: Narendra, S.G.; Chrzanowska-Jeske, M.; Ashraf, R.;
Determining an Optimal Visualization of Physically Realizable Symbol Maps
2011 / IEEE / 978-0-7695-4548-6
By: Rezende, P.; Kunigami, G.; Yunes, T.; Souza, C.;
Stacking of Known Good Reconstructed Wafer without TSV applications to memory-only and heterogeneous SiP
2011 / IEEE / 978-1-4577-1982-0
By: Val, C.; Noiray, P.C.J.; Boulay, N.;
Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging
2011 / IEEE / 978-1-4673-2290-4
By: Wu, Boping; Wang, Haogang;
Enhanced power gating schemes for low leakage low ground bounce noise in deep submicron circuits
2012 / IEEE / 978-1-4577-1546-4
By: Tiwari, R.K.; Pattanaik, M.; Saxena, C.;
Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs
2012 / IEEE / 978-1-4577-2145-8
By: Marinissen, E.J.;
A Novel Anti phishing framework based on visual cryptography
2012 / IEEE / 978-1-4673-0449-8
By: Philip, M.; James, D.;
Low power integrated circuit design with stacking technique
2012 / IEEE / 978-1-4577-1117-6
By: Zhuochao Sun; Siek, L.; Chongfei Jin;
Multi chip stacking & reliability challenges using TSV-micro C4 solder interconnection for FCCSP TSV package
2011 / IEEE / 978-1-4577-1982-0
By: Au, K.Y.; Beleran, J.D.; Yang, Y.B.; Zhang, Y.F.; Kriangsak, S.L.; Wilson, P.L.O.; Drake, Y.S.K.; Nathapong, S.;
Non-destructive inspection of through mould vias in stacked embedded packages by micro-CT
2011 / IEEE / 978-1-4577-1982-0
By: Roth, H.; Neubrand, T.;
2.5D/3D TSV processes development and assembly/packaging technology
2011 / IEEE / 978-1-4577-1982-0
By: Won Kyoung Choi; Duk Ju Na; Chang Bum Yong; Young Chul Kim; Marimuthu, P.C.; Keon Taek Kang; Seung Wook Yoon;
On test and repair of 3D random access memory
2012 / IEEE / 978-1-4673-0772-7
By: Shyue-Kun Lu; Cheng-Wen Wu; Jin-Fu Li;
Effect of compositional gradients on structural defects in Cu(In, Ga)Se2 thin films for solar cells
2011 / IEEE / 978-1-4244-9965-6
By: Dietrich, J.; Boit, C.; Schock, H.; Unold, T.; Rissom, T.; Abou-Ras, D.;

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