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Topic: Sintering
Results
2011 / IEEE
By: Huitema, L.; Mattei, J.-L.; Thakur, A.; Souriou, D.; Staraj, R.; Ferrero, F.; Jamnier, B.; Sharahia, A.; Minard, P.; Pintos, J.-F.; Queffelec, P.;
By: Huitema, L.; Mattei, J.-L.; Thakur, A.; Souriou, D.; Staraj, R.; Ferrero, F.; Jamnier, B.; Sharahia, A.; Minard, P.; Pintos, J.-F.; Queffelec, P.;
2011 / IEEE
By: Le Guen, E.; Chevalier, A.; Mattei, J.-L.; Thakur, A.; Tarot, A.-C.; Queffelec, P.; Souriou, D.; Grisart, B.;
By: Le Guen, E.; Chevalier, A.; Mattei, J.-L.; Thakur, A.; Tarot, A.-C.; Queffelec, P.; Souriou, D.; Grisart, B.;
2011 / IEEE
By: Titov, V.V.; Malitskaya, M.A.; Zakharov, Y.N.; Raevskaya, S.I.; Kubrin, S.P.; Zakharchenko, I.N.; Lutokhin, A.G.; Raevski, I.P.; Sitalo, E.I.; Blazhevich, A.V.;
By: Titov, V.V.; Malitskaya, M.A.; Zakharov, Y.N.; Raevskaya, S.I.; Kubrin, S.P.; Zakharchenko, I.N.; Lutokhin, A.G.; Raevski, I.P.; Sitalo, E.I.; Blazhevich, A.V.;
2012 / IEEE
By: Atassi, I.; Maric, A.; Blaz, N.; Smetana, W.; Homolka, H.; Zivanov, L.; Radosavljevic, G.;
By: Atassi, I.; Maric, A.; Blaz, N.; Smetana, W.; Homolka, H.; Zivanov, L.; Radosavljevic, G.;
2011 / IEEE
By: Schwaiger, A.; Hochstrasser, M.; Kowanda, C.; Grohs, C.; Plankensteiner, A.; Muller, F.E.H.;
By: Schwaiger, A.; Hochstrasser, M.; Kowanda, C.; Grohs, C.; Plankensteiner, A.; Muller, F.E.H.;
2012 / IEEE
By: Yanagida, T.; Fujimoto, Y.; Kamada, K.; Totsuka, D.; Yagi, H.; Nikl, M.; Futami, Y.; Yanagida, S.; Kurosawa, S.; Yokota, Y.; Yoshikawa, A.; Yanagitani, T.;
By: Yanagida, T.; Fujimoto, Y.; Kamada, K.; Totsuka, D.; Yagi, H.; Nikl, M.; Futami, Y.; Yanagida, S.; Kurosawa, S.; Yokota, Y.; Yoshikawa, A.; Yanagitani, T.;
2012 / IEEE
By: Nilsson, H.; Forsberg, S.; Lidenmark, C.; Unander, T.; Manuilskiy, A.; Andersson, H.;
By: Nilsson, H.; Forsberg, S.; Lidenmark, C.; Unander, T.; Manuilskiy, A.; Andersson, H.;
2012 / IEEE
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
2012 / IEEE
By: Manuilskiy, A.; Ortegren, J.; Ohlund, T.; Lidenmark, C.; Andersson, H.; Nilsson, H.-E.; Forsberg, S.;
By: Manuilskiy, A.; Ortegren, J.; Ohlund, T.; Lidenmark, C.; Andersson, H.; Nilsson, H.-E.; Forsberg, S.;
2004 / IEEE / 978-5-87911-088-3
By: Matsuura, K.; Hoshizuki, H.; Mitsudo, S.; Nishi, H.; Ishibashi, J.; Kitano, A.; Saji, T.; Iwai, Y.; Honda, T.; Eremeev, A.G.; Glyavin, M.Y.; Idehara, T.;
By: Matsuura, K.; Hoshizuki, H.; Mitsudo, S.; Nishi, H.; Ishibashi, J.; Kitano, A.; Saji, T.; Iwai, Y.; Honda, T.; Eremeev, A.G.; Glyavin, M.Y.; Idehara, T.;
2011 / IEEE / 978-1-4577-1163-3
By: Takagi, H.; Konoike, T.; Ogiso, K.; Hayashi, H.; Kimura, M.; Kawada, S.;
By: Takagi, H.; Konoike, T.; Ogiso, K.; Hayashi, H.; Kimura, M.; Kawada, S.;
Effects of high-pressure high-temperature sintering on the thermoelectric properties of Pb0.55 Te0.45
2011 / IEEE / 978-1-4577-0536-6By: Li Ming-Fa; Sun Zhen-Ya; Chen Bo; Fan Duan; Wang Shan-Yu;
2011 / IEEE / 978-90-75815-14-6
By: Hascoet, S.; Raynaud, C.; Morel, H.; Buttay, C.; Masson, A.; Gremillard, L.;
By: Hascoet, S.; Raynaud, C.; Morel, H.; Buttay, C.; Masson, A.; Gremillard, L.;
2011 / IEEE / 978-1-4244-8165-1
By: Wen-Liang Gao; Gu-Ling Zhang; Yi-Quan Wang; Wen-Zhong Wang; Ke Wang; Di Yang; Kai-Xiang Shen;
By: Wen-Liang Gao; Gu-Ling Zhang; Yi-Quan Wang; Wen-Zhong Wang; Ke Wang; Di Yang; Kai-Xiang Shen;
2011 / IEEE / 978-1-4577-0321-8
By: Li-gang Wu; Kun Bai; Fa-wei Zhang; Zhao-yong Zheng; Qiu-hua Nie; Xiang-jun Ma; Bo-you Zhou; Shi-xun Dai;
By: Li-gang Wu; Kun Bai; Fa-wei Zhang; Zhao-yong Zheng; Qiu-hua Nie; Xiang-jun Ma; Bo-you Zhou; Shi-xun Dai;
2011 / IEEE / 978-1-61284-172-4
By: Spanulescu, I.; Plavitu, C.; Trupina, L.; Miclea, C.T.; Mihailescu, M.; Cioangher, M.; Amarande, L.; Miclea, C.;
By: Spanulescu, I.; Plavitu, C.; Trupina, L.; Miclea, C.T.; Mihailescu, M.; Cioangher, M.; Amarande, L.; Miclea, C.;
Modification of interfacial properties between filler particles in electrically conductive adhesives
2011 / IEEE / 978-1-4577-1277-7By: Busek, D.; Mach, P.;
2011 / IEEE / 978-1-4577-0509-0
By: Marsden, D.; Collins, G.; Falce, L.R.; Ives, R.L.; Jensen, K.; Miram, G.;
By: Marsden, D.; Collins, G.; Falce, L.R.; Ives, R.L.; Jensen, K.; Miram, G.;
2011 / IEEE / 978-1-4673-0149-7
By: Hao Xue; Zhaoxian Xiong; Peng Hu; Xiaopeng Xiao; Qingjun Lu; Jie Pan;
By: Hao Xue; Zhaoxian Xiong; Peng Hu; Xiaopeng Xiao; Qingjun Lu; Jie Pan;
2011 / IEEE / 978-1-4673-0149-7
By: Xiaopeng Xiao; Zhibin Zheng; Peng Hu; Zhaoxian Xiong; Zhan Shi; Hao Xue; Qingjun Lu;
By: Xiaopeng Xiao; Zhibin Zheng; Peng Hu; Zhaoxian Xiong; Zhan Shi; Hao Xue; Qingjun Lu;
2011 / IEEE / 978-0-9568086-0-8
By: Thielen, M.; Reinhold, I.; Bohlmann, H.; Gotzen, R.; Zapka, W.; Voit, W.;
By: Thielen, M.; Reinhold, I.; Bohlmann, H.; Gotzen, R.; Zapka, W.; Voit, W.;
2011 / IEEE / 978-0-9568086-0-8
By: Moscicki, A.; Piasecki, T.; Platek, B.; Felba, J.; Falat, T.; Smolarek, A.;
By: Moscicki, A.; Piasecki, T.; Platek, B.; Felba, J.; Falat, T.; Smolarek, A.;
2011 / IEEE / 978-1-4577-2037-6
By: Yadav, K.L.; Kumar, A.; Singh, H.; Rawat, M.; Adhlakha, N.; Rani, J.; Patel, P.K.;
By: Yadav, K.L.; Kumar, A.; Singh, H.; Rawat, M.; Adhlakha, N.; Rani, J.; Patel, P.K.;
2011 / IEEE / 978-1-4577-0657-8
By: Ibrar-ul-Haque, M.; Willander, M.; Usman Ali, S.M.; Hashim, U.; Kashif, M.;
By: Ibrar-ul-Haque, M.; Willander, M.; Usman Ali, S.M.; Hashim, U.; Kashif, M.;
2011 / IEEE / 978-1-4577-1516-7
By: Kueck, H.; Eberhardt, W.; Willeck, H.; Keck, J.; Matic, V.; Schoen, F.; Polzinger, B.;
By: Kueck, H.; Eberhardt, W.; Willeck, H.; Keck, J.; Matic, V.; Schoen, F.; Polzinger, B.;
2011 / IEEE / 978-1-4577-1884-7
By: Tolouei, R.; Lai, S.K.L.; Tan, C.Y.; Lee, S.K.Y.; Ramesh, S.; Yap, B.K.; Amiriyan, M.;
By: Tolouei, R.; Lai, S.K.L.; Tan, C.Y.; Lee, S.K.Y.; Ramesh, S.; Yap, B.K.; Amiriyan, M.;