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Topic: Scanning Electron Microscope Examination Of Materials

Results

Enhanced field emission from molybdenum disulfide

1988 / IEEE
By: Fischer, O.; Sankarraman, N.; Niedermann, P.;

Metallurgical study of Ag-Cd and Ag-CdO alloy electrical contacts

1988 / IEEE
By: Antunes da Silveira, V.L.; Furtado, H.C.;

Waveform measurements in high-speed silicon bipolar circuits using a picosecond photoelectron scanning electron microscope

1988 / IEEE
By: May, P.; Li, G.P.; Chuang, C.T.; Halbout, J.-M.;

Characterization of electron-irradiated biaxially-oriented polypropylene films

1988 / IEEE
By: Krishnakumar, B.; Laghari, J.R.; Hammoud, A.N.;

Effect of Zr additions on the microstructural and magnetic properties of NdFeB based magnets

1988 / IEEE
By: Pollard, R.J.; Lord, D.G.; Parker, S.F.H.; Grundy, P.J.;

Magnetic and morphological characterization of SrMe/sub 2/-W and SrZn-X hexaferrites prepared by chemical coprecipitation method

1988 / IEEE
By: Leccabue, F.; Leo, G.; ALbanese, G.; Almodvar, N.S.; Salviati, G.;

Microstructural characteristics of ternary rare earth-iron alloys

1988 / IEEE
By: Abell, J.S.; Westood, P.; Pitman, K.C.;

Characterization of a silicone gel as a coating use for corrosion protection

1988 / IEEE
By: Ishida, H.; Otsuka, K.; Nakata, K.;

Copper/titanium dioxide thick film and application for through-hole

1988 / IEEE
By: Taniguchi, Y.; Tsukada, T.; Yoshihara, T.;

Observation of lithium drifted silicon detectors using SEM

1988 / IEEE
By: Watanabe, E.; Ohkawa, S.; Miyachi, T.; Husimi, K.; Ikeda, T.; Kuwata, M.; Taira, M.;

Effects of Ti-containing underlayers on planarization and microstructure of magnetron sputtered Al-Cu thin films

1988 / IEEE
By: Ahn, K.Y.; Lin, T.; Chaloux, P.N.; Harper, J.M.E.;

A comparison of planarization properties of TEOS and SiH/sub 4/ PECVD oxides

1988 / IEEE
By: Magnella, C.G.; Fleck, E.; Ingwersen, T.;

Fretting corrosion of tin at elevated temperatures

1988 / IEEE
By: Mao, A.; Lee, A.; Mamrick, M.S.;

Effect of surface structure on the contact resistance measurements of electrodeposits

1988 / IEEE
By: Crane, G.R.; Law, H.H.; Holden, C.A.;

Beryllium copper/palladium alloy electron beam welded sliding contacts

1988 / IEEE
By: Raykhtsaum, G.; Kaiser, J.G.;

Noncontact internal waveform measurements with picosecond time resolution on a 0.5- mu m CMOS SRAM

1988 / IEEE
By: Halbout, J.-M.; Pastol, Y.; Compeau, G.; May, P.;

A method for determining fiber direction in soft tissues

1988 / IEEE
By: Grigg, P.; Hoffman, A.H.; Ault, H.K.;

A new reliability problem associated with Ar ion sputter cleaning of interconnect vias

1989 / IEEE
By: Tomioka, H.; Mizukami, K.; Tanabe, S.-i.;

Degradation mechanism of Al-doped ZnO elements

1988 / IEEE
By: Hengkun Xie; Zhiqing Chen;

Chemical, physical and microstructural properties of thermally aged XLPE cable models

1988 / IEEE
By: Motori, A.; Montanari, G.C.; Sandrolini, F.;

AC poling of solution cast films of polyvinylidene fluoride/lead zirconate composites

1988 / IEEE
By: Sinham, D.; Pillai, P.K.C.;

Improved coating for amorphous alloy with low loss deterioration

1989 / IEEE
By: Okazaki, Y.; Sakuma, E.; Kanno, H.;

Domain wall pinning by fine precipitates

1989 / IEEE
By: Ohmori, K.; Hamada, Y.; Ishikawa, T.;

Auger spectroscopy of rare earth-transition metal-boron magnets in relation to the mechanism of coercivity

1989 / IEEE
By: Korablev, V.; Wallace, W.E.; Elbicki, J.M.;

Effect of the variation in Sm/Cu/Zr content on phase stability of an Sm(Co,Fe,Cu,Zr)/sub 7.4/ permanent magnet alloy

1989 / IEEE
By: Chang, R.T.; Chang, W.C.; Chin, T.S.; Lee, H.T.; Hung, M.P.;

Scanning electron microscopy with polarization analysis studies of Ni-Fe magnetic memory elements

1989 / IEEE
By: Scheinfein, M.R.; Unguris, J.; Pierce, D.T.; Celotta, R.J.;

Microstructure and properties of Ni-Zn ferrites sintered from slip cast colloidally precipitated particles

1989 / IEEE
By: Lin, J.C.; Tseng, T.Y.;

Self-aligned chemically assisted ion-beam-etched GaAs/(Al,Ga)As turning mirrors for photonic applications

1990 / IEEE
By: Levy, J.; Appelman, H.; Zediker, M.; Harding, C.; Krebs, D.; Pion, M.;

Deposition of CuInSe/sub 2/ films by a two-stage process utilizing E-beam evaporation

1990 / IEEE
By: Kapur, V.K.; Basol, B.M.;

Stripe and bubble domains in CoCr films

1990 / IEEE
By: Gemperle, R.; Simsova, J.; Lodder, J.C.; Kaczer, J.;

DC-magnetron sputtered CoNiTa for high density longitudinal recording

1990 / IEEE
By: Fisher, R.D.; Khan, M.R.; Heiman, N.;

Effect of media properties on side erase bands

1990 / IEEE
By: Lin, K.C.; Thomas, G.;

Effect of grain isolation on media noise in thin-film longitudinal media

1990 / IEEE
By: Ranjan, R.; Ravipati, D.P.; Christner, J.A.;

Backscattered electron imaging and energy-dispersive X-ray studies of water-treed polymeric insulation

1990 / IEEE
By: Bamji, S.S.; Bulinski, A.; Timbrell, P.Y.; Densley, J.;

Effect of fretting in aluminum-to-tin connections

1990 / IEEE
By: Braunovic, M.;

Deposition of plasma-polymerized acetylene by an intense pulsed RF plasma source

1990 / IEEE
By: Nasiruddin, A.M.; Pedrow, P.D.; Mahalingam, R.;

New screen printable polyimide for IC devices

1990 / IEEE
By: Satou, H.; Kikuchi, T.; Suzuki, K.; Nishizawa, H.;

Electrical strength and chemical surface analysis of polypropylene after exposure to external partial discharges

1990 / IEEE
By: Gedde, U.W.; Gustafsson, A.; Rodehed, C.;

Effect of heat and moisture on thick positive photoresist

1989 / IEEE
By: Mani, B.;

Gallium arsenide on insulator by electrostatic bonding

1989 / IEEE
By: Qin-Yi Tong; Shi-Ji Lu; Qing-An Huang;

Three-dimensional numerical simulation of local oxidation of silicon

1991 / IEEE
By: Odanaka, S.; Umimoto, H.;

Modification in the microstructure of materials with air-break switching at high currents

1991 / IEEE
By: Bourda, C.; Ambier, J.; Ramoni, P.; Pinard, J.; Jeannot, D.;

Gold removal from component terminations via solder dipping

1989 / IEEE
By: Hong, J.; Chason, M.;

Switching performance of AgW-Ag(Sn,In)O and AgW-AgSnO/sub 2/ contact pairs

1989 / IEEE
By: Chien, Y.K.; Slade, P.G.; Bindas, J.A.;

Effect of fretting in aluminium-to-tin connections

1989 / IEEE
By: Braunovic, M.;

Metallurgic and contact resistance studies of sleeve connectors in aluminium cable splices

1989 / IEEE
By: Dang, C.; Braunovic, M.;

Microstructural effect on the electromigration of aluminum interconnects

1989 / IEEE
By: Wu, K.; Baerg, W.; Jupiter, P.;

Modeling the bending of probes used in semiconductor industry

1991 / IEEE
By: Nadeau, N.; Comeau, A.R.;

Electrode-induced nonuniformities in the sweeping of alpha quartz

1991 / IEEE
By: Gualtieri, J.G.; Kosinski, J.A.;

Fretting in Ni-coated aluminum conductors

1991 / IEEE
By: Braunovic, M.;

The influence of deposition conditions on the magnetic properties in PtMnSb films

1988 / IEEE
By: Kunimoto, A.; Ohnuma, S.; Masumoto, T.;

Analysis and design of a metal-in-gap head for rigid disk files

1988 / IEEE
By: Mukasa, K.; Sengoku, M.; Abe, T.; Kanai, Y.; Iizuka, M.;

Carbon overcoat and the process dependence on its microstructure and wear characteristics

1988 / IEEE
By: Siekhaus, W.; Salmeron, M.; Ogletree, D.F.; Marchon, B.; Veirs, K.; Khan, M.R.; Smallen, M.; Smith, S.; Fisher, R.D.; Heiman, N.; Hughes, G.F.;

Surface oxidation of CoCr evaporated films

1988 / IEEE
By: Murakami, Y.; Sakamoto, Y.; Echigo, N.; Sugita, R.; Honda, K.;

A study on thin-film-media noise by magnetic domain observation

1988 / IEEE
By: Matsuyama, H.; Shiroishi, Y.; Tsuchiya, R.; Aoi, H.;

Domain structures in multi-layered Co-Ni-Fe-Pd films observed by spin-polarized SEM

1988 / IEEE
By: Sano, M.; Sudo, S.; Mitsuoka, K.; Sugita, Y.; Narishige, S.; Nishioka, K.;

SEMPA domain observation compared to three other methods

1988 / IEEE
By: Judy, J.H.; Cameron, G.P.;

High T/sub c/ thin film and device development

1989 / IEEE
By: McCubbin, J.; McKenzie, D.; Kubik, P.R.; Fife, A.A.; Cragg, A.; Burbank, M.B.; Betts, K.; Irwin, J.C.; Chrzanowski, J.; Heinrich, B.; Roemer, G.; Lee, S.; Chaklader, A.C.D.; Vrba, J.; Tran, H.; Taylor, B.; Tillotson, M.;

Characterization of YBaCuO and ErBaCuO thin films deposited on silicon and gallium arsenide substrates

1989 / IEEE
By: Lee, S.Y.; Stickle, W.F.; Yu, K.M.; Hansen, W.L.; Van Duzer, T.; Chin, D.K.; Murdock, B.;

Characteristics of high-transmission-probability tunnel junctions for use as particle detectors

1989 / IEEE
By: Johnson, R.T.; Gagnon, P.; Dignan, T.G.; Dickson, S.C.; Bland, R.W.; Seneclauze, C.M.; Anderson, C.C.; Alba, G.P.; Stricker, D.A.; Bing, D.D.;

Spatial resolution limit for the investigation of high-T/sub c/ films by low temperature scanning electron microscopy

1989 / IEEE
By: Gross, R.; Koelle, D.; Kober, F.; Huebener, R.P.; Hipler, K.; Hartmann, M.;

ARXPS, SEM, and SAM studies of highly textured YBa/sub 2/Cu/sub 3/O/sub x/ films

1989 / IEEE
By: Hauser, B.; Halbritter, J.; Rogalla, H.; Walk, P.; Mathes, H.-J.; Keim, E.G.;

Thin film growth of oxide superconductor materials

1989 / IEEE
By: Campisi, G.G.; Singer, A.H.; Qadri, S.B.; Cukauskas, E.J.; Henry, R.L.;

The fabrication and characterization of high temperature superconducting magnetic shields

1989 / IEEE
By: Clem, T.R.; Purpura, J.W.;

Are there two distinct morphologies in human and bovine bone mineral?

1988 / IEEE / 0-7803-0785-2
By: Isaac, D.H.; Green, M.; Mackie, I.G.;

Complement activation and SEM studies of membrane oxygenators

1988 / IEEE / 0-7803-0785-2
By: Lautier, A.; Dehe, T.; Sargentini, J.C.;

Contamination performance of silicone rubber cable terminations

1991 / IEEE
By: Johnson, L.A.; Gorur, R.S.; Hervig, H.C.;

New thin film fabrication technique using a substrate excited by SAW

1990 / IEEE
By: Yamada, J.; Wakiyama, T.; Shimatsu, T.; Fujita, A.; Takahashi, M.; Shiba, T.;

High coercivity Nd-Fe-B sintered magnet containing vanadium with new microstructure

1990 / IEEE
By: Hiraga, K.; Vial, F.; Tenaud, P.; Sagawa, M.;

Effects of grain size and frequency on eddy current loss in Si-Fe sheets

1990 / IEEE
By: Shimazu, T.; Shiozaki, M.;

Stroboscopic observation of domain motion on coated Si-Fe sheet using scanning electron microscope

1990 / IEEE
By: Porter, C.H.; Horrocks, D.H.; Beckley, P.; Mivehchi, E.;

MIG mini composite head using single crystal Mn-Zn ferrite

1990 / IEEE
By: Iwata, H.; Nishiyama, T.; Suwabe, S.; Noguchi, K.;

Magnetization versus heat treatment in rapidly solidified NdFeB alloys

1990 / IEEE
By: Baro, M.D.; Clavaguera-Mora, M.T.; Clavaguera, N.; Diego, J.A.; Surinch, S.;

Correlations of magnetic microstructure and anisotropy with noise spectra for CoNi and CoCrTa thin film media

1990 / IEEE
By: Fisher, R.D.; Duan, S.L.; Williams, D.; Pressesky, J.L.; Lee, S.Y.; Scheinfein, M.R.; Heiman, N.; Speliotis, D.E.; Celotta, R.J.; Pierce, D.T.; Unguris, J.; Khan, M.R.;

Composite solders

1991 / IEEE
By: Lucey, G.; Sees, J.; Calderon, J.; Marshall, J.L.; Hwang, J.S.;

Advanced ceramic substrates for multichip modules with multilevel thin film interconnects

1991 / IEEE
By: Occhionero, M.A.; Tormey, E.S.; Bachner, F.J.; Foster, B.C.; White, P.A.;

Brittle cracks induced in AlSi wire by the ultrasonic bonding tool vibration

1991 / IEEE
By: Miller, C.E.; Fitzsimmons, R.T.;

Die punch test study and relationship to delta VBE

1991 / IEEE
By: Murphy-Arteaga, R.S.; Paredes-Casillas, L.; Aceves-Mijares, M.;

Preparation of high quality and tunable band gap hydrogenated amorphous silicon by homogeneous-CVD (HOMOCVD)

1988 / IEEE
By: Mertens, R.; Nijs, J.; Van Ammel, A.; Michiel, H.; Qian, Z.M.;

Structure and morphology of evaporated bilayer and selenized CuInSe/sub 2/ films

1988 / IEEE
By: Dittrich, H.; Dimmler, B.; Schock, H.W.;

Electrical and microstructural properties of screenprinted CdS layers for CdS-CdTe solar cells

1988 / IEEE
By: Demeyere, A.; Burgelman, M.; Vervaet, A.; Clemminck, I.;

Epitaxial growth of beta -SiC on Si by RTCVD with C/sub 3/H/sub 8/ and SiH/sub 4/

1992 / IEEE
By: Steckl, A.J.; Li, J.P.;

Vacuum arc deposition of carbon thin films in a low pressure of hydrogen

1991 / IEEE
By: Meunier, J.-L.; Douyon de Azevedo, M.;

Impact of process characteristics on submicron defect effects

1990 / IEEE
By: Smith, B.W.; Hirschman, K.;

Silicon carbon alloy thin film depositions using electron cyclotron resonance microwave plasmas

1990 / IEEE
By: Pool, F.S.; Shing, Y.H.;

Heavily cold worked high-purity Ta as a reinforcing stabilizer

1992 / IEEE
By: Matsuura, N.; Katagiri, K.; Noto, K.; Matsukawa, M.; Ikebe, M.; Watanabe, K.; Fukutsuka, T.; Takahashi, C.;

Fabrication of high quality Nb/AlO/sub x/-Al/Nb Josephson junctions. I. Sputtered Nb films for junction electrodes

1992 / IEEE
By: Shiota, T.; Imamura, T.; Hasuo, S.;

Evaluation of laser planarized second aluminum for semiconductor devices

1990 / IEEE
By: Boeck, B.A.; Chu, H.; Chen, S.; Crain, N.; Pintchovski, F.; Fu, K.Y.;

A via failure mode in electromigration of multilevel interconnect

1990 / IEEE
By: Wollesen, D.L.; Yue, J.T.; Pham, V.H.; Bui, N.D.;

Properties of aluminum films deposited by low energy and high density ion bias sputtering method using cusp magnetic field electrode

1990 / IEEE
By: Okutani, K.; Sasaki, S.; Tateishi, H.; Kurogome, M.; Horiuchi, M.;

Electromigration performance of laser planarized aluminum alloy films

1990 / IEEE
By: Ramaswami, S.; Yue, J.T.; Pham, V.;

Characterization of polysilicon-encapsulated local oxidation

1992 / IEEE
By: Ray, W.J.; Roth, S.S.; Ko, J.; Gunderson, C.D.; Kirsch, H.C.; Cooper, K.; Mazure, C.;

Structural characteristics of grain boundaries in superconducting Bi/sub 2/Sr/sub 2/Ca/sub 1/Cu/sub 2/O/sub x/ fibers

1991 / IEEE
By: Sanders, S.C.; Chumbley, L.S.; Kramer, M.J.; Miller, T.A.;

In-situ epitaxial growth study of Bi/sub 2/(Sr,Ca)/sub 3/Cu/sub 2/O/sub x/ films by ion beam sputtering on cleaved MgO substrates

1991 / IEEE
By: Ichihashi, T.; Satoh, T.; Yoshitake, T.; Fujita, J.; Igarashi, H.;

Preparation of the textured Bi-based oxide tapes by partial melting process

1991 / IEEE
By: Dietderich, D.R.; Kumakura, H.; Togano, K.; Morimoto, T.; Kase, J.; Maeda, H.;

Growth of C-axis oriented YBaCuO films on oxidized textured Ni sheets and on

1991 / IEEE
By: Ginsbach, A.; Grabe, G.; Grueninger, H.W.; Schneider, R.;

Superconducting properties of Tl-Ba-Ca-Cu-O films on silver substrates

1991 / IEEE
By: Dye, R.C.; Reeves, G.; Elliott, N.; Hubbard, K.M.; Martin, J.A.; Arendt, P.N.;

Properties of epitaxially grown A-axis oriented YBa/sub 2/Cu/sub 3/O/sub 7-x/-PrBa/sub 2/Cu/sub 3/O/sub 7-y/ heterostructures

1991 / IEEE
By: Barner, J.; Hart, D.; Remschnig, K.; Wilkens, B.; Rogers, C.T.; Ramesh, R.; Inam, A.;

Oxygenation of silver clad YBa/sub 2/Cu/sub 3/O/sub 7- delta /

1991 / IEEE
By: Neal, M.J.; Pathare, V.M.;

Electrical tree and deteriorated region in polyethylene

1992 / IEEE
By: Uchida, K.; Shimizu, N.; Rasikawan, S.;

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Topic: Scanning Electron Microscope Examination Of Materials

Results

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