Your Search Results
Use materials about this topic in your textbook!
AcademicPub holds over eight million pieces of educational content - such as case studies and journal articles - for you to mix-and-match your way.
Experience the freedom of customizing your course pack with AcademicPub!

Topic: Rf Fields
Results
2011 / IEEE / 978-1-61284-329-2
By: Jamroz, B.; Sessions, W.; Verboncoeur, J.; Freund, H.P.; Bui, T.; Ives, L.; Jhurani, C.;
By: Jamroz, B.; Sessions, W.; Verboncoeur, J.; Freund, H.P.; Bui, T.; Ives, L.; Jhurani, C.;
1989 / IEEE
By: Langley, R.A.; Hoffman, D.J.; Ruzic, D.N.; Caughman, J.B.O., II; Ryan, P.M.; Lewis, M.B.;
By: Langley, R.A.; Hoffman, D.J.; Ruzic, D.N.; Caughman, J.B.O., II; Ryan, P.M.; Lewis, M.B.;
1997 / IEEE / 0-7803-4213-5
By: Elizondo, J.M.; Trimble, D.O.; Stoddard, R.; Sanders, D.M.; Caporaso, G.J.; Sampayan, S.E.; Wright, S.N.; Stoltz, D.; Smith, D.; Krogh, M.L.;
By: Elizondo, J.M.; Trimble, D.O.; Stoddard, R.; Sanders, D.M.; Caporaso, G.J.; Sampayan, S.E.; Wright, S.N.; Stoltz, D.; Smith, D.; Krogh, M.L.;
2000 / IEEE / 0-7803-5982-8
By: Charles, C.; Lieberman, M.; Boswell, R.; Harris, J.; Sheridan, T.; Degeling, A.;
By: Charles, C.; Lieberman, M.; Boswell, R.; Harris, J.; Sheridan, T.; Degeling, A.;
2000 / IEEE
By: Calame, J.P.; Blank, M.; Botton, M.; Antonsen, T.M., Jr; Levush, B.; Nguyen, K.T.; Danly, B.G.;
By: Calame, J.P.; Blank, M.; Botton, M.; Antonsen, T.M., Jr; Levush, B.; Nguyen, K.T.; Danly, B.G.;
2001 / IEEE / 0-7803-7141-0
By: Kitsanov, S.A.; Korovin, S.D.; Tarakanov, V.P.; Rostov, V.V.; Klimov, A.I.; Polevin, S.D.; Pegel, I.V.; Kurkan, I.K.;
By: Kitsanov, S.A.; Korovin, S.D.; Tarakanov, V.P.; Rostov, V.V.; Klimov, A.I.; Polevin, S.D.; Pegel, I.V.; Kurkan, I.K.;
2003 / IEEE
By: Pinzhong Du; Yong Luo; Wenxiang Wang; Zhong-Lian Xie; Hongfu Li; Xue Den; Li Wang; Shenggang Liu; Xinjian Niu; Sheng Yu; Huajun Wang;
By: Pinzhong Du; Yong Luo; Wenxiang Wang; Zhong-Lian Xie; Hongfu Li; Xue Den; Li Wang; Shenggang Liu; Xinjian Niu; Sheng Yu; Huajun Wang;
2004 / IEEE / 0-7803-8334-6
By: Lopez, M.R.; Lau, Y.Y.; Gilgenbach, R.M.; Neculaes, V.B.; Jones, M.C.; Pengvanich, P.; White, W.M.; Price, D.; Spencer, T.A.; Jordan, N.; Hidaka, Y.;
By: Lopez, M.R.; Lau, Y.Y.; Gilgenbach, R.M.; Neculaes, V.B.; Jones, M.C.; Pengvanich, P.; White, W.M.; Price, D.; Spencer, T.A.; Jordan, N.; Hidaka, Y.;
2007 / IEEE / 978-1-4244-0916-7
By: Long, J.; Chemerisov, S.; Gai, W.; Jonah, C.D.; Liu, W.; Wang, H.;
By: Long, J.; Chemerisov, S.; Gai, W.; Jonah, C.D.; Liu, W.; Wang, H.;
2007 / IEEE / 978-1-4244-0916-7
By: Hirshfield, J.L.; Shegolkov, D.Yu.; Plotkin, M.E.; Vikharev, A.A.; Kuzikov, S.V.; Yakovlev, V.P.;
By: Hirshfield, J.L.; Shegolkov, D.Yu.; Plotkin, M.E.; Vikharev, A.A.; Kuzikov, S.V.; Yakovlev, V.P.;
2010 / IEEE / 978-1-4244-7099-0
By: Botton, M.; Chernyavskiy, I.A.; Levush, B.; Cooke, S.J.; Antonsen, T.M.;
By: Botton, M.; Chernyavskiy, I.A.; Levush, B.; Cooke, S.J.; Antonsen, T.M.;
2011 / IEEE / 978-1-4577-0507-6
By: Ciupa, R.V.; Rafiroiu, D.; Craciunescu, T.; Tiseanu, I.; Lazar, A.; Iancu, A.;
By: Ciupa, R.V.; Rafiroiu, D.; Craciunescu, T.; Tiseanu, I.; Lazar, A.; Iancu, A.;