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Topic: Packaging

Results

Introducing iteration into the Pure Lisp theorem prover

1975 / IEEE
By: Moore, J.S.;

High-speed, low-crosstalk chip holder for Josephson integrated circuits

1982 / IEEE
By: Hamilton, C.A.;

Effect of Temperature on Water Molecules in a Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach

2011 / IEEE
By: Wonsang Koh; Ji Il Choi; Seung Geol Lee; Gene Kim; Jongman Kim; Seung Soon Jang;

Impact of Organic Substrate Warp on C4 Non-Wets

2011 / IEEE
By: Sri-Jayantha, S.M.; Khanna, V.D.;

Influence of Bosch Etch Process on Electrical Isolation of TSV Structures

2011 / IEEE
By: Liu Youhe; Da Yong Lee; Ranganathan, N.; Pey, K.L.; Prasad, K.; Guo-Qiang Lo;

Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking

2011 / IEEE
By: Theogarajan, L.; Chin-Hsuan Chen; Milaninia, K.; Uddin, A.;

Advanced Surface Laminar Circuits Using Newly Developed Resins

2011 / IEEE
By: Yamanaka, K.; Hayashi, K.; Fukui, M.; Hosoi, Y.; Kobayashi, K.;

Microwave Nanopackaging and Interconnects [From the Guest Editor's Desk]

2011 / IEEE
By: Coccetti, F.; Pierantoni, L.;

Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise

2011 / IEEE
By: Dawei Xiang; Mawby, P.; Shaoyong Yang; Bryant, A.; Tavner, P.; Li Ran;

Parylene Interposer as Thin Flexible 3-D Packaging Enabler for Wireless Applications

2011 / IEEE
By: Chappell, W.J.; Dohyuk Ha; Byungguk Kim; Jimin Maeng;

Non-Newtonian Flow Formulation of the Underfill Process in Flip-Chip Packaging

2011 / IEEE
By: Wen-Bin Young;

Self-Assembly Process for Array Interconnects Pattern Using Solder/Polymer Hybrid Materials

2011 / IEEE
By: Yasuda, K.;

Inductive Power Link for a Wireless Cortical Implant With Two-Body Packaging

2011 / IEEE
By: Silay, K.M.; Declercq, M.; Dehollain, C.;

CMOS Amperometric Instrumentation and Packaging for Biosensor Array Applications

2011 / IEEE
By: Qureshi, W.A.; Xiaowen Liu; Lin Li; Mason, A.J.;

Study on the Optical Properties of Conformal Coating Light-Emitting Diode by Monte Carlo Simulation

2011 / IEEE
By: Sheng Liu; Xiaobing Luo; Run Hu;

A Seamless Integration of 3-D Vertical Filters With Highly Efficient Slot Antennas

2011 / IEEE
By: Yusuf, Y.; Xun Gong; Haitao Cheng;

Battery Cell Identification and SOC Estimation Using String Terminal Voltage Measurements

2012 / IEEE
By: Mi, C.C.; Yuhong Fu; Wen Chen; Yin, G.G.; Polis, M.P.; Le Yi Wang;

A Modular Heat-Shrink-Packaged Check Valve With High Pressure Shutoff

2011 / IEEE
By: Lo, R.; Meng, E.;

Millimeter-Wave Technology for Automotive Radar Sensors in the 77 GHz Frequency Band

2012 / IEEE
By: Weigel, R.; Zwick, T.; Schnabel, R.; Topak, E.; Hasch, J.; Waldschmidt, C.;

An Automotive Onboard 3.3-kW Battery Charger for PHEV Application

2012 / IEEE
By: Dunford, W.G.; Eberle, W.; Edington, M.; Musavi, F.; Gautam, D.S.;

Practical issues for installing instrumentation outdoors Part 2: Part 37 in a series of tutorials on instrumentation and measurement

2012 / IEEE
By: Gard, M.F.; Fowler, K.;

Set It and Forget It: Innovations in Implantable Medical Technology

2012 / IEEE
By: McLaughlin, G.; Imran, M.;

Design, Qualification, Calibration and Alignment of Position Sensing Detector for the NuSTAR Space Mission

2012 / IEEE
By: Sedaka, J.; Scholz, C.; Cooper, M.; Miyasaka, H.; Meras, P.; Mao, P.; Liebe, C.C.; Madsen, K.K.; Kecman, B.; Cook, R.; Clark, G.R.; Bauman, B.W.;

New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components

2012 / IEEE
By: Pucci, E.; Kildal, P.-S.; Rajo-Iglesias, E.;

A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging Inductors

2012 / IEEE
By: Hyunseok Nam; Youngkook Ahn; Jeongjin Roh;

24-GHz Directly Modulated DFB Laser Modules for Analog Applications

2012 / IEEE
By: Jiang Wei Man; Liang Xie; Wei Wang; Ning Hua Zhu; Yu Liu; Bao Jun Wang; Ling Juan Zhao; Hai Qing Yuan; Xin Wang; Hong Liang Zhu;

Coplanar 122-GHz Antenna Array With Air Cavity Reflector for Integration in Plastic Packages

2012 / IEEE
By: Rusch, C.; Gulan, H.; Beer, S.; Zwick, T.;

Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate

2012 / IEEE
By: Lourenco, N.E.; Philips, S.D.; Bhattacharya, S.K.; Patterson, C.E.; Poh, C.H.J.; Papapolymerou, J.; Cressler, J.D.;

Effect of Epoxy Molding Compound on the Electrical Performance of Microelectronic Devices

2012 / IEEE
By: Herbsommer, J.A.;

Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package

2012 / IEEE
By: Matsunaga, K.; Okamoto, Y.; Nakayama, T.; Ando, Y.; Miyamoto, H.; Tanomura, M.; Wakejima, A.; Kuroda, N.; Ota, K.;

Thermal Analysis and Packaging Optimization of Collector-Up HBTs Using an Enhanced Genetic-Algorithm Methodology

2012 / IEEE
By: Hsien-Cheng Tseng; Jhin-Yuan Chen;

Novel Chip-Last Method for Embedded Actives in Organic Packaging Substrates

2012 / IEEE
By: Baik-Woo Lee; Tummala, R.; Baars, D.; Kennedy, S.; Sundaram, V.;

Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven

2012 / IEEE
By: Bailey, C.; Eicher, F.; Muller, G.; Adamietz, R.; Pavuluri, S.K.; Desmulliez, M.P.Y.; Goussetis, G.; Ferenets, M.; Tilford, T.;

Enhanced Thermal Performance of InGaP/GaAs Collector-Up HBTs With a Miniaturized Backside Heat-Dissipation Structure

2012 / IEEE
By: Jer-Li Lin; Hsien-Cheng Tseng;

Silicon Platform With Vertically Aligned Carbon Nanotubes for Enhancing Thermal Conduction in Hybrid Optoelectronic Integration

2012 / IEEE
By: Yung-Jr Hung; Hsinyi Lo; San-Liang Lee; Szu-Chieh Chen; Kuei-Yi Lee; Ram, R.J.; Yen-Ting Pan; Charng-Gan Tu;

CUSUM Charts for Monitoring Bivariate Zero-Inflated Poisson Processes With an Application in the LED Packaging Industry

2012 / IEEE
By: Zhen He; Shuguang He; Wang, G.A.;

Development of a 3-D Process Technology for Wafer-Level Packaging of MEMS Devices

2012 / IEEE
By: Hyun-Jin Choi; Woo-Chang Choi;

Design of Planar Complex Impedance Transformers With the Modified Coupled Line

2012 / IEEE
By: Ming-Guang Chen; Ching-Wen Tang; Teng-Bang Hou;

Ultracompact UHF Tunable Filter Embedded Into Multilayered Organic Packaging Substrate

2012 / IEEE
By: Seong-Jong Cheon; Tae-Chang Lee; Jae-Yeong Park;

DRAM Data Retention and Cell Transistor Threshold Voltage Reliability Improved by Passivation Annealing Prior to the Deposition of Plasma Nitride Layer

2012 / IEEE
By: Wang, D.H.-L.; Chia-Ming Yang; Chao-Sung Lai; Chung-Yuan Lee;

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

2012 / IEEE
By: Lee, S.W.R.; Lo, J.C.C.; Rong Zhang;

Packaging Considerations for a Surface Acoustic Wave Strain Sensor

2012 / IEEE
By: Geraghty, D.; Donohoe, B.; Stoney, R.; O'Donnell, G.E.;

Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps

2012 / IEEE
By: Guoqiang Wu; Yuelin Wang; Bin Xiong; Dehui Xu;

Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack

2012 / IEEE
By: Kripesh, V.; Premchandran, C.S.; Tai Chong Chai; Xiaowu Zhang; Seung Wook Yoon; Kumar, A.; Lu Shen; Sekhar, V.N.; Lau, J.H.;

Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range

2012 / IEEE
By: Kishk, A.; Zaman, A.U.; Kildal, P.-S.; Rajo-Iglesias, E.;

Self-Packaged Millimeter-Wave Substrate Integrated Waveguide Filter With Asymmetric Frequency Response

2012 / IEEE
By: Ke Wu; Xiao-Ping Chen;

Board-Folding Method for Fabrication of 3-D System in Package Devices

2012 / IEEE
By: Barrett, J.; Moore, L.;

Reliability of liquid crystal polymer air cavity packaging

2012 / IEEE
By: Aihara, K.; Pham, A.-V.H.; Cheng Chen; Chen, M.J.;

Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging

2012 / IEEE
By: Boroyevich, D.; Guo-Quan Lu; Zheng Chen; Yiying Yao; Ngo, K.D.T.;

Effect of Nano-Particles on Heterogeneous Void Nucleation in No-Flow Underfill Materials

2012 / IEEE
By: Baldwin, D.; Myung Jin Yim; Lee, S.;

Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding

2012 / IEEE
By: Soueidan, M.; Mouawad, B.; Martin, C.; Morel, H.; Bley, V.; Allard, B.; Buttay, C.; Fabregue, D.;

Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

2012 / IEEE
By: Zirath, H.; Chee-Way Oh; Chang, E.Y.; Wei-Cheng Wu; Chin-Te Wang; Li-Han Hsu; Yueh-Chin Lin; Wee-Chin Lim; Szu-Ping Tsai;

Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device

2012 / IEEE
By: Lau, J.H.; Kripesh, V.; Khan, N.; Kumar, A.; Rao, V.S.; Dim-Lee Kwong; Selvanayagam, C.S.; Rajoo, R.; Xiaowu Zhang; Tummala, R.R.; Sundaram, V.;

Influence of Package Structure on the Performance of the Single Emitter Diode Laser

2012 / IEEE
By: Pu Zhang; Yanxin Zhang; Lingling Xiong; Jingwei Wang; Zhiqiang Nie; Xiaoning Li; Xingsheng Liu; Hui Liu; Zhenfu Wang;

Review of test methods used for the measurement of hermeticity in packages containing small cavities

2012 / IEEE
By: McCracken, S.; Desmulliez, M.P.Y.; Costello, S.;

System Integration of Electronic Functions in Smart Packaging Applications

2012 / IEEE
By: Gulliksson, M.; Hummelgard, M.; Manuilskiy, A.; Andersson, H.; Siden, J.; Unander, T.; Nilsson, H.;

Fabrication of 3-D Metamaterials Using LTCC Techniques for High-Frequency Applications

2012 / IEEE
By: In Kwang Kim; Varadan, V.V.;

Improved Microstrip Filters Using PMC Packaging by Lid of Nails

2012 / IEEE
By: Zaman, A.U.; Brazalez, A.A.; Kildal, P.;

Investigation of the Packaging-Induced RF Attenuations and Resonances in a Broadband Optoelectronic Modulator Module

2012 / IEEE
By: Xin Wang; Rensing, M.; Wei Han; O'Brien, P.; Peters, F.H.; Hua Yang;

Uniform White Emission of WLEDs Realized by Multilayer Phosphor With Pyramidal Shape and Inversed Concentration Distribution

2012 / IEEE
By: Yu, B.-H.; Li, C.; Liu, Z.-Y.; Niu, H.-B.; Wang, Y.-H.;

Choice Prediction With Semidefinite Optimization When Utilities are Correlated

2012 / IEEE
By: Chung-Piaw Teo; Hua Tao; Natarajan, K.; Mishra, V.K.;

Circular/Linear Polarization Reconfigurable Antenna on Simplified RF-MEMS Packaging Platform in K-Band

2012 / IEEE
By: Hyeon, I.-J.; Jung, T. J.; Lim, S.; Baek, C.-W.;

Batch-Fabricated High-Power RF Microrelays With Direct On-PCB Packages

2012 / IEEE
By: Sarabandi, K.; Sangjo Choi; Ozkeskin, F.M.; Gianchandani, Y.B.;

Mechanical Design and Characterization for MEMS Thin-Film Packaging

2012 / IEEE
By: Sarro, P.M.; Creemer, J.F.; Mele, L.; Huerta, V.G.; Zaal, J.J.M.; Santagata, F.;

Parallel Heterogeneous Integration of Chip-Scale Parts by Self-Assembly

2012 / IEEE
By: Baskaran, R.; Ji Hao Hoo; Kwang Soon Park; Bohringer, K.F.;

Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices

2012 / IEEE
By: Anand, S.; Sutanto, J.; Muthuswamy, J.; Patel, C.;

Poly-SiGe-Based MEMS Thin-Film Encapsulation

2012 / IEEE
By: Bin Guo; Bo Wang; Severi, S.; Tanaka, S.; De Wolf, I.; Puers, R.; Osman, H.; Decoutere, S.; Tilmans, H.A.C.; Witvrouw, A.; Haspeslagh, L.; Vereecke, G.; Van Hoof, R.; Verbist, A.; Du Bois, B.; De Coster, J.; Claes, G.; Helin, P.; Lianggong Wen;

Sensitivity Improvement of Micromachined Convective Accelerometers

2012 / IEEE
By: Leung, A.M.; Jones, J.D.; Bahari, J.;

Development simulation and experiment study on UHF Partial Discharge Sensor in GIS

2012 / IEEE
By: Chen Zheng; Mingzhe Rong; Tianhui Li; Xiaohua Wang;

Rapid Silicon-to-Steel Bonding by Induction Heating for MEMS Strain Sensors

2012 / IEEE
By: Sosnowchik, B.D.; Liwei Lin; Pisano, A.P.; Chan, M.W.; Myers, D.R.; Azevedo, R.G.;

Split-Frame Gimbaled Two-Dimensional MEMS Scanner for Miniature Dual-Axis Confocal Microendoscopes Fabricated by Front-Side Processing

2012 / IEEE
By: Jae-Woong Jeong; Solgaard, O.; Sunwoo Kim;

Effects of YAG: Ce Phosphor Particle Size on Luminous Flux and Angular Color Uniformity of Phosphor-Converted White LEDs

2012 / IEEE
By: Han-Ben Niu; Yao-Hao Wang; Bin-Hai Yu; Cheng Li; Zong-Yuan Liu;

Analysis of simulation of fleshy food company logistics system based on Flexsim

2011 / IEEE / 978-1-61284-666-8
By: Zhiqiang He; Weiyu Chen;

Designing demand chain of milk products in China for European dairies and milk farms

2011 / IEEE / 978-1-4244-9666-2
By: Haitao Wen; Schramm, H.-J.; Jian Tong;

Establishment of buffer dynamic model for polyethylene foam cushion

2011 / IEEE / 978-1-4244-9439-2
By: De Gao; Xiliang Chen; Jun Li; Zhenlin Wang;

Wire bonding, bumping & assembly related failures & improvements

2011 / IEEE / 978-1-4577-0158-0
By: Hua, Y.N.; Yeo, A.; Tan, J.B.; Yuan, S.; Lim, Y.K.; Siah, S.Y.; Rao, N.R.;

The thought of the optimization algorithm for the commodity hard-packaging size

2011 / IEEE / 978-1-4244-9439-2
By: Cheng Ji-li; Wang Dong-ai; Wang Ling-song; Ni Hui-na;

The three-dimensional virtual design technique based on AutodeskInventor2010 of food packaging rigid container

2011 / IEEE / 978-1-4244-9439-2
By: Songbai Ma;

Optical and near-infrared photon detection with superconducting devices

2011 / IEEE / 978-1-4244-5731-1
By: Stevens, M.; Baek, B.; Calkins, B.; Lita, A.; Sae Woo Nam; Mirin, R.;

Input shaping based vibration reduction for the flexible bonding arm of a LED die bonder

2011 / IEEE / 978-988-17255-9-2
By: Huang Ruining; Lou Yunjiang; Chen Junheng;

Study of blend films from methacryloyl guar gum and sodium alginate

2011 / IEEE / 978-1-4244-9439-2
By: Litao Dong; Wenfa Xiao;

An integrated algorithm for 3D-IC TSV assignment

2011 / IEEE / 978-1-4503-0636-2
By: Yeap, G.; Yifan Zhang; Xiaodong Liu; Xuan Zeng;

Study on the derived food safety management information system based on AJAX and Portal

2011 / IEEE / 978-1-61284-774-0
By: Shiming Dai; Chengping Ruan; Chengshen Ruan;

Explicit federal relationship management to support semantic integration

2011 / IEEE / 978-1-4244-9221-3
By: O'Sullivan, D.; Thomas, H.; Walsh, B.; Feeney, K.; Brennan, R.;

The safety management of railway dangerous goods stations

2011 / IEEE / 978-1-4244-9439-2
By: Ping Guo;

Development of a high speed die bonding system

2011 / IEEE / 978-988-17255-9-2
By: Huang Hsing-Hsin; Wu, J.; Chen Tsong-Shi;

Numerical analysis for load-bearing capacity of large-scaled molded pulp pallet

2011 / IEEE / 978-1-4244-9439-2
By: Jiao Wang; Huaiwen Wang; Hongwei Ji; Jinlong Chen;

A study on design ethics based on package design

2011 / IEEE / 978-1-4577-0358-4
By: Du Juan; Tong XiaoHong; Yu Peng;

Progressive network-flow based power-aware broadcast addressing for pin-constrained digital microfluidic biochips

2011 / IEEE / 978-1-4503-0636-2
By: Hong-Yan Su; Tsung-Wei Huang; Tsung-Yi Ho;

The study on electrical control system of machine for supplementing the traditional Chinese medicinal pills based on PLC

2011 / IEEE / 978-1-4244-9439-2
By: Donghua Jiang; Guifu Wu; Dongwei Shao;

An improved DRM authentication approach for mobile journals publishing

2011 / IEEE / 978-1-61284-088-8
By: Chen Wang; Liang Wang;

Simulation of three-dimensional floc growth using improved DLA model

2011 / IEEE / 978-1-4244-9600-6
By: Dongjing Liu; Zumin Qiu; Yanfen Wu; Zongjian He;

Comparison of press-pack IGBT at hard switching and clamp operation for medium voltage converters

2011 / IEEE / 978-90-75815-14-6
By: Bernet, S.; Filsecker, F.; Alvarez, R.;

Characterization of a new 1.2 kV IGBT 3L-NPC phase-leg module for low voltage applications

2011 / IEEE / 978-90-75815-14-6
By: Alvarez, R.; Sprenger, M.; Bernet, S.; Staudt, I.;

Adaption of MOSFETs current slope by systematic adjustment of common source stray inductance and gate resistance

2011 / IEEE / 978-90-75815-14-6
By: Fuchs, F.W.; Muehlfeld, O.; Wittig, B.;

Research on the image data system used in printing quality inspection

2011 / IEEE / 978-1-61284-486-2
By: Mingqi Li;

Research on Food Proper-Packaging via Fuzzy Comprehensive Evaluation

2011 / IEEE / 978-1-4244-6581-1
By: Ma Shuang; Qian Xing-san;

Sustainable development, sustainable software, and sustainable software engineering: An integrated approach

2011 / IEEE / 978-1-4577-0265-5
By: Dick, M.; Johann, T.; Naumann, S.; Kern, E.;

Research on collaborative mechanism of manufacturing cluster network based on service-package

2011 / IEEE / 978-1-4577-0536-6
By: Xiaoming Zuo;

The Design and Analysis of Automatic Egg Packing Manipulator

2011 / IEEE / 978-1-4577-0860-2
By: Hong Jiang; Zhang Cong; Huang Dingshi; Tang Ning;

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