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Topic: Multipath Component
Results
2004 / IEEE / 0-7803-8255-2
By: Aghvami, H.; Ghavami, M.; McGregor, S.; Armogida, A.; Allen, B.; Dohler, M.;
By: Aghvami, H.; Ghavami, M.; McGregor, S.; Armogida, A.; Allen, B.; Dohler, M.;
2008 / IEEE / 978-89-5519-135-6
By: Sun Yong Kim; Euihyoung Lee; Sanghun Kim; Dahae Chong; Seokho Yoon;
By: Sun Yong Kim; Euihyoung Lee; Sanghun Kim; Dahae Chong; Seokho Yoon;
2009 / IEEE / 978-1-4244-2948-6
By: Rahman, M.A.; Kato, S.; Harada, H.; Funada, R.; Wang, J.; Baykas, T.; Sasaki, S.; Sum, C.S.;
By: Rahman, M.A.; Kato, S.; Harada, H.; Funada, R.; Wang, J.; Baykas, T.; Sasaki, S.; Sum, C.S.;
2010 / IEEE / 978-1-4244-5155-5
By: Keusgen, W.; Wisotzki, M.; Peter, M.; Kortke, A.; Mahler, K.; Paschalidis, P.;
By: Keusgen, W.; Wisotzki, M.; Peter, M.; Kortke, A.; Mahler, K.; Paschalidis, P.;