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Topic: Microwave Devices
Results
2011 / IEEE
By: Matveev, I.B.; Esakov, I.I.; Ravaev, A.A.; Lavrov, P.B.; Lavrov, B.P.; Kirchuk, E.Y.;
By: Matveev, I.B.; Esakov, I.I.; Ravaev, A.A.; Lavrov, P.B.; Lavrov, B.P.; Kirchuk, E.Y.;
2011 / IEEE
By: Liping Jiang; Yajie Chen; Fitchorov, T.; Harris, V.G.; Vittoria, C.; Zengqi Zhao; Guangrui Zhang;
By: Liping Jiang; Yajie Chen; Fitchorov, T.; Harris, V.G.; Vittoria, C.; Zengqi Zhao; Guangrui Zhang;
2012 / IEEE
By: Cross, A.W.; Rowlands, D.H.; Robertson, C.W.; He, W.; Young, A.R.; Ronald, K.; Whyte, C.G.;
By: Cross, A.W.; Rowlands, D.H.; Robertson, C.W.; He, W.; Young, A.R.; Ronald, K.; Whyte, C.G.;
2012 / IEEE
By: Carrubba, V.; Tasker, P.J.; Cripps, S.C.; Benedikt, J.; Lees, J.; Quay, R.; Akmal, M.;
By: Carrubba, V.; Tasker, P.J.; Cripps, S.C.; Benedikt, J.; Lees, J.; Quay, R.; Akmal, M.;
2012 / IEEE
By: Faci, S.; Tripon-Canseliet, C.; Chazelas, J.; Decoster, D.; Formont, S.; Magnin, V.; Pagies, A.;
By: Faci, S.; Tripon-Canseliet, C.; Chazelas, J.; Decoster, D.; Formont, S.; Magnin, V.; Pagies, A.;
2012 / IEEE
By: Morgan, B.; Polcawich, R.G.; Mirabelli, M.; Meyer, C.D.; Pulskamp, J.S.; Bedair, S.S.;
By: Morgan, B.; Polcawich, R.G.; Mirabelli, M.; Meyer, C.D.; Pulskamp, J.S.; Bedair, S.S.;
2012 / IEEE
By: Wei Zhang; Jinghui Liu; Rui He; Jian Qiao; Hang Lv; Zhihua Wang; Bo Zhou; Yongming Li; Woogeun Rhee;
By: Wei Zhang; Jinghui Liu; Rui He; Jian Qiao; Hang Lv; Zhihua Wang; Bo Zhou; Yongming Li; Woogeun Rhee;
1992 / IEEE / 000-0-0000-0000-0
By: Levine, J.; Harteneck, B.; Cooksey, N.; Benford, J.; Price, D.; Willey, M.; Aiello, N.; Sprehn, D.; Smith, R.;
By: Levine, J.; Harteneck, B.; Cooksey, N.; Benford, J.; Price, D.; Willey, M.; Aiello, N.; Sprehn, D.; Smith, R.;
1992 / IEEE / 000-0-0000-0000-0
By: Fayne, W.R.; Hendricks, K.J.; Lemke, R.W.; Clark, M.C.; Bowers, L.A.; Platt, R.C.; Haworth, M.D.; Davis, C.E.;
By: Fayne, W.R.; Hendricks, K.J.; Lemke, R.W.; Clark, M.C.; Bowers, L.A.; Platt, R.C.; Haworth, M.D.; Davis, C.E.;
2011 / IEEE / 978-1-61284-244-8
By: Medjdoub, F.; Rolland, P.A.; Rolland, N.; Ducatteau, D.; Zegaoui, M.;
By: Medjdoub, F.; Rolland, P.A.; Rolland, N.; Ducatteau, D.; Zegaoui, M.;
2011 / IEEE / 978-1-61284-329-2
By: Vlasov, A.N.; Chernin, D.; Chernyavskiy, I.A.; Legarra, J.; Antonsen, T.M.; Levush, B.;
By: Vlasov, A.N.; Chernin, D.; Chernyavskiy, I.A.; Legarra, J.; Antonsen, T.M.; Levush, B.;
2011 / IEEE / 978-966-335-357-9
By: Gagarin, A.G.; Gaidukov, M.M.; Tumarkin, A.V.; Kozyrev, A.B.; Altynikov, A.G.; Razumov, S.V.;
By: Gagarin, A.G.; Gaidukov, M.M.; Tumarkin, A.V.; Kozyrev, A.B.; Altynikov, A.G.; Razumov, S.V.;
2011 / IEEE / 978-966-335-357-9
By: Shmachilin, P.A.; Kondrateva, S.G.; Ovchinnikova, E.V.; Voskresenskiy, D.I.;
By: Shmachilin, P.A.; Kondrateva, S.G.; Ovchinnikova, E.V.; Voskresenskiy, D.I.;
2011 / IEEE / 978-1-4577-1997-4
By: Jin Dong-yue; Zhang Wan-rong; Chen Liang; Lu Zhi-yi; Zhang Yu-jie; Ding Chun-bao;
By: Jin Dong-yue; Zhang Wan-rong; Chen Liang; Lu Zhi-yi; Zhang Yu-jie; Ding Chun-bao;
2011 / IEEE / 978-1-4577-1756-7
By: Siyuan Gu; Lingquan Wang; Wei Lu; Asbeck, P.M.; Yu, P.K.L.; Aplin, D.P.R.;
By: Siyuan Gu; Lingquan Wang; Wei Lu; Asbeck, P.M.; Yu, P.K.L.; Aplin, D.P.R.;
2011 / IEEE / 978-0-85825-974-4
By: Ichiguchi, S.; Nakajima, R.; Hasegawa, T.; Okada, T.; Koshino, M.; Wada, T.;
By: Ichiguchi, S.; Nakajima, R.; Hasegawa, T.; Okada, T.; Koshino, M.; Wada, T.;
2011 / IEEE / 978-1-4577-1664-5
By: Maicon, F.; Hernandez-Figueroa, Hugo.E.; Zady, C.S.; Da Silva Santos, C.; Adriano, F.;
By: Maicon, F.; Hernandez-Figueroa, Hugo.E.; Zady, C.S.; Da Silva Santos, C.; Adriano, F.;
2011 / IEEE / 978-0-85825-974-4
By: Dussauby, M.P.; Neveu, G.; Crunteanu, A.; Pothier, A.; Rebernak, W.; Blondy, P.; Gasseling, T.; Gatard, E.;
By: Dussauby, M.P.; Neveu, G.; Crunteanu, A.; Pothier, A.; Rebernak, W.; Blondy, P.; Gasseling, T.; Gatard, E.;
2012 / IEEE / 978-3-9812668-4-9
By: Figur, S.A.; Schoenlinner, B.; Prechtel, U.; Vietzorreck, L.; Ziegler, V.;
By: Figur, S.A.; Schoenlinner, B.; Prechtel, U.; Vietzorreck, L.; Ziegler, V.;
2012 / IEEE / 978-3-9812668-4-9
By: Hettstedt, F.; Quandt, E.; Knochel, R.; von Hofe, T.; Stellmach, W.;
By: Hettstedt, F.; Quandt, E.; Knochel, R.; von Hofe, T.; Stellmach, W.;
2011 / IEEE / 978-1-4577-1664-5
By: Silva, P.V.S.; Fechine, P.B.A.; Melo, L.F.L.; Rocha, G.N.; Sombra, A.S.B.; da Silva, M.A.S.;
By: Silva, P.V.S.; Fechine, P.B.A.; Melo, L.F.L.; Rocha, G.N.; Sombra, A.S.B.; da Silva, M.A.S.;
2011 / IEEE / 978-1-4577-1664-5
By: Costa, L.C.; Graca, M.P.F.; Sombra, A.S.B.; Girao, H.T.; Saboia, K.D.A.; Valente, M.A.; Amaral, F.;
By: Costa, L.C.; Graca, M.P.F.; Sombra, A.S.B.; Girao, H.T.; Saboia, K.D.A.; Valente, M.A.; Amaral, F.;