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Topic: Liquid Cooling

Results

Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures
2011 / IEEE
By: Atienza, D.; Coskun, A.K.; Sabry, M.M.; Brunschwiler, T.; Rosing, T.S.;
Modeling and dynamic management of 3D multicore systems with liquid cooling
2009 / IEEE / 978-1-4577-0236-5
By: Coskun, A.K.; Rosing, T.S.; Atienza, D.; Ayala, J.L.;
Development of one-side actuating liquid cooling diaphragm micropump for a multimedia system
2011 / IEEE / 978-1-61284-774-0
By: Luo, W.F.; Ma, H.K.; Su, H.C.;
Liquid cooling for 3D-ICs
2011 / IEEE / 978-1-4577-1221-0
By: Srivastava, A.; Bing Shi;
Liquid cooling system for the vibro-tactile threshold device
2011 / IEEE / 978-1-4577-1589-1
By: Bamberg, S.J.M.; Tuckett, R.P.; Gandhi, M.S.; Redd, C.; Parsons, E.M.;
High-power 95 GHz pulsed magnetrons
2011 / IEEE / 978-966-335-357-9
By: Moiseenko, A.E.; Suvorov, A.N.; Naumenko, V.D.;
Design of experimental device used for heat transfer research of single-phase and two-phase spray cooling
2011 / IEEE / 978-1-4577-1043-8
By: Peng Zhang; Guobiao Gu; Lin Ruan;
System-level thermal-aware design of 3D multiprocessors with inter-tier liquid cooling
2011 / IEEE / 978-2-35500-016-4
By: Sabry, M.M.; Sridhar, A.; Atienza, D.;
Cooling of 3D-IC using non-uniform micro-channels and sensor based dynamic thermal management
2011 / IEEE / 978-1-4577-1818-2
By: Bing Shi; Srivastava, A.;
Development of a flexible chip infrared (IR) thermal imaging system for product qualification
2012 / IEEE / 978-1-4673-1111-3
By: Chenzhou Lian; Weger, A.J.; Xiaojin Wei; Sikka, K.; Knox, M.;
Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal
2012 / IEEE / 978-1-4673-1111-3
By: Yazawa, K.; Joshi, Y.; Fedorov, A.G.; Sahu, V.; Shakouri, A.; Ziabari, A.;
Tutorial T7A: New Modeling Methodologies for Thermal Analysis of 3D ICs and Advanced Cooling Technologies of the Future
2012 / IEEE / 978-1-4673-0438-2
By: Atienza, D.; Shridhar, A.;
Passivation coatings for micro-channel coolers
2012 / IEEE / 978-1-4577-1216-6
By: Lu, K.; Fleming, E.; Weyant, J.; Bonner, R.W.; Reist, D.;
Novel hybrid photovoltaic and thermoelectric panel
2012 / IEEE / 978-1-4673-0662-1
By: Daud, M.M.M.; Ibrahim, T.; Bin Mohd Nor, N.;
High-capacity thermoelectric heat exchanger
2012 / IEEE / 978-1-4244-9532-0
By: Fleming, E.; Bonner, R.; Pellicone, D.; Lu, K.S.; Walker, J.N.; Reber, G.L.; Reist, D.;
Cooling power optimization for hybrid solid-state and liquid cooling in integrated circuit chips with hotspots
2012 / IEEE / 978-1-4244-9532-0
By: Shakouri, A.; Yee Rui Koh; Ziabari, A.; Yazawa, K.; Joshi, Y.; Fedorov, A.G.; Sahu, V.;
Thermal management systems for data centers with liquid cooling technique of CPU
2012 / IEEE / 978-1-4244-9532-0
By: Abe, Y.; Ouchi, M.; Iimura, K.; Sato, M.; Shinmoto, Y.; Ohta, H.; Fukagaya, M.;
Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels
2012 / IEEE / 978-1-4244-9532-0
By: Varsamopoulos, G.; Phelan, P.; Sherbeck, J.; Haywood, A.; Gupta, S.K.S.;
Multi-design variable optimization for a fixed pumping power of a water-cooled cold plate for high power electronics applications
2012 / IEEE / 978-1-4244-9532-0
By: Schmidt, R.; Kamath, V.; Agonafer, D.; Ghalambor, S.; Fernandes, J.;
Two-phase flow and heat transfer in pin-fin enhanced micro-gaps
2012 / IEEE / 978-1-4244-9532-0
By: Yue Zhang; Joshi, Y.; McNamara, A.J.; Yoon Jo Kim; Isaacs, S.A.; Bakir, M.S.;
Parametric study on thermal performance of a hybrid double-side micro-jet cooling system
2014 / IEEE
By: Kim, Kwang-Yong; Kim, Sun-min;
Effect of warm water cooling for an isolated hybrid liquid cooled server
2015 / IEEE
By: Addagatla, A.; Mulay, V.; Agonafer, D.; Mani, D.; Fernandes, J.;
Local thermal measurements of a confined array of impinging liquid jets for power electronics cooling
2015 / IEEE
By: Maddox, J.F.; Bhavnani, S.H.; Knight, R.W.;
Placement optimization of liquid-cooled servers for power minimization in data centers
2014 / IEEE
By: Zheng, Wenli; Li, Li; Wang, Xiaorui; Wang, Xiaodong;
Modeling and simulation of a thermoelectric Energy Harvesting System for control design purposes
2014 / IEEE
By: Felgner, Felix; Nesarajah, Marco; Frey, Georg;
Direct liquid cooling For IGBT power module
2014 / IEEE
By: Liu, Chun-Kai; Chao, Yu-Lin; Liao, C K; Yen, M H; Lin, Amy; Tu, Jack; Han, Wei-Kuo; Fang, Rong-Chang; Yang, Shu-Jung;
Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms
2015 / IEEE
By: Liu, X.; Yu, W.; Tan, S.X.; He, K.; Liu, Z.; Zhai, K.;
Cooling Systems of Large-Capacity Adjustable-Speed Drive Systems
2015 / IEEE
By: Phares, D.; Verma, M.; Nanney, J.; Grinbaum, I.;
Thermal performance modeling of hybrid liquid-air cooled servers
2014 / IEEE
By: Coles, Henry; Saunders, Winston A.; Zeighami, Roy; Branton, Steve;
Experimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center
2014 / IEEE
By: Parida, Pritish; Gaynes, Michael; Schultz, Mark; Chainer, Timothy;
A review of challenging issues in the integration of absorption refrigeration and organic Rankine Cycle into a data center cooling system
2014 / IEEE
By: Fleischer, Amy; Jones, Gerard; Ebrahimi, Khosrow;
A corrosion and erosion protection coating for complex microchannel coolers used in high power laser diodes
2014 / IEEE
By: Chin, Aland; Chin, Richard; Lang, Keith; Eppich, Henry; Weyant, Jens; Fan, Angie; Flannery, Matthew; Desai, Tapan G.;
Thermal management of silicon carbide power module for military hybrid vehicles
2014 / IEEE
By: Cai, Steve Q.; Gould, Kyle; Bhunia, Avijit; Neft, Charles;
High performance air cooled heat sinks for integrated circuits
1990 / IEEE
By: Herrell, D.J.; Gupta, O.; Sommerfeldt, S.; Hilbert, C.;
A 200-MFLOPS 100-MHz 64-b BiCMOS vector-pipelined processor (VPP) ULSI
1991 / IEEE
By: Hagihara, Y.; Ohkubo, C.; Nishi, N.; Yamada, H.; Enomoto, T.; Okamoto, F.;
Thermal design space prediction in direct liquid cooling
1991 / IEEE / 0-87942-664-0
By: Mahalingam, M.; Lee, T.Y.T.;
Re-entrant cavity heat sinks formed by anisotropic etching and silicon direct wafer bonding
1992 / IEEE / 0-7803-0500-0
By: Phadke, N.K.; Ellis, C.D.; Bhavnani, S.H.; Jaeger, R.C.; Goyal, A.; Goodling, J.S.; Azimi-Rashti, M.;
Compact liquid cooling system for small, moveable electronic equipment
1992 / IEEE / 0-7803-0500-0
By: Chow, P.; Andrews, J.; Lee, T.Y.T.; Saums, D.;
Liquid cooled approaches for high density avionics
1991 / IEEE
By: LeVasseur, R.;
Thermal design space prediction in two-phase direct liquid cooling
1992 / IEEE
By: Mahalingam, M.; Lee, T.Y.T.;
Compact liquid cooling system for small, moveable electronic equipment
1992 / IEEE
By: Andrews, J.A.; Lee, T.Y.T.; Saums, D.; Chow, P.;
Heat sink optimization with application to microchannels
1992 / IEEE
By: Goodling, J.S.; Hall, D.J.; Knight, R.W.; Jaeger, R.C.;
Thermal management control without overshoot using combinations of boiling liquids
1992 / IEEE / 0-7803-0503-5
By: Normington, P.J.C.; Lee, T.Y.T.; Mahalingam, M.;
Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages
1992 / IEEE / 0-7803-0503-5
By: Bhavnani, S.H.; Phadke, N.K.; Goodling, J.S.; Jaeger, R.C.; Goyal, A.;
Formation of silicon reentrant cavity heat sinks using anisotropic etching and direct wafer bonding
1993 / IEEE
By: Azimi-Rashti, M.; Phadke, N.K.; Ellis, C.D.; Bhavnani, S.H.; Jaeger, R.C.; Goyal, A.; Goodling, J.S.;
Cooling for high heat flux VLSI systems
1991 / IEEE / 0-7803-0036-X
By: Goodling, J.S.; Jaeger, R.C.;
Liquid cooling performance for a 3-dimensional multichip module and miniature heat sink
1994 / IEEE / 0-7803-1852-8
By: Vogel, M.R.;
Advanced micro air-cooling systems for high density packaging
1994 / IEEE / 0-7803-1852-8
By: Gromoll, B.;
Integrated water cooled transformer and work coil for middle frequency induction heating applications
1993 / IEEE / 0-7803-1462-X
By: Swart, S.M.; Ferreira, J.A.;
Thermal and mechanical analysis of flip-chips on a liquid-cooled multichip module
1993 / IEEE / 0-7803-0794-1
By: Hall, P.M.; Narayanan, R.; Chanchani, R.;
Liquid cooling performance for a 3-D multichip module and miniature heat sink
1995 / IEEE
By: Vogel, M.R.;
Development of large-capacity gas-insulated transformer
1996 / IEEE
By: Tanaka, K.; Takahashi, E.; Yanari, T.; Inaba, M.; Teranishi, T.; Ikeda, M.; Toda, K.;
Advances in turbogenerator technology
1996 / IEEE
By: Gott, B.E.B.;
Dual-voltage high power converter for a distributed power system in heavy traction, using high-voltage IGBT's
1996 / IEEE / 0-7803-3500-7
By: Giannini, G.; Fratelli, L.;
An active phased array antenna packaging scheme
1996 / IEEE / 0-7803-3216-4
By: Agrawal, A.K.; Landry, N.R.; Mattioli, J.A.;
Testing of the cannon caliber rapid fire railgun
1997 / IEEE
By: Kitzmiller, J.R.; Hotz, T.J.; Werst, M.D.; Telander, R.M.; Penney, C.E.;
New Class of Multiple Wavelength High Efficiency Solid State Lasers
1996 / IEEE / 0-7803-3169-9
By: Kostanian, R.B.;
Crystalline Air Cooled CW Laser
1996 / IEEE / 0-7803-3169-9
By: Gevorgian, G.A.; Kosheverskii, E.V.; Koslmrimr, R.B.; Kahramanian, K.E.;
L-band high power solid state transmitter for modern radar system
1996 / IEEE / 0-7803-2914-7
By: Hong Dingzhu; Qian Hongbing; Chen Zhencheng; Chen Qijie;
Analysis And Performance Of A 12-pulse High Power Regulator
1994 / IEEE
By: Silva, A.; Daeges, J.;
Development of a man-portable microclimate adsorption cooling device
1997 / IEEE / 0-7803-4515-0
By: Grryll, L.R.; Balderson, W.C.;
Feasibility study of thermally integrated mechanical configuration for a novel 3-D flex MCM
1998 / IEEE / 0-7803-4850-8
By: Lenihan, T.G.; Morrison, W.B.; Railkar, T.A.; Malshe, A.P.; Brown, W.D.;
Experimental study on the liquid cooling of a test MCM using paraffin slurry
1998 / IEEE / 0-7803-4475-8
By: Choi, M.G.; Cho, K.;
Combined effects of sub-cooling and operating pressure on the performance of a two-chamber thermosyphon
1998 / IEEE / 0-7803-4475-8
By: Ramaswamy, C.; Johnson, W.I.; Nakayama, W.; Joshi, Y.;
Integration of micro heat sink in silicon technology
1998 / IEEE / 0-7803-5033-2
By: Boussey, J.; Schaeffer, C.; Perret, C.;
Integral liquid cooled (ILC) high power module for efficient heat extraction
1998 / IEEE / 0-7803-5033-2
By: Calmels, A.; Bontemps, S.; Zardini, C.;
A review of IBM sponsored research and development projects for computer cooling
1999 / IEEE / 0-7803-5264-5
By: Chu, R.C.;
Internet based instruction for thermal design of electronic products-making a global impact
1999 / IEEE / 0-7803-5231-9
By: Joshi, Y.; Bhavnani, S.; Bar-Cohen, A.;
Advanced cooling technology for leading-edge computer products
1998 / IEEE / 0-7803-4306-9
By: Chu, R.C.;
Broadband multibeam pulse klystrons of moderate output power with a special control electrode
1999 / IEEE / 5-7422-0083-8
By: Zhary, E.V.; Borisov, L.M.;
Design optimization of an integrated liquid-cooled IGBT power module using CFD technique
2000 / IEEE
By: Tien-Yu Lee;
Combined effects of sub-cooling and operating pressure on the performance of a two-chamber thermosyphon
2000 / IEEE
By: Johnson, W.B.; Nakayama, W.; Joshi, Y.K.; Ramaswamy, C.;
Packaging technology for high performance CMOS server Fujitsu GS8900
2000 / IEEE / 0-7803-5908-9
By: Suzuki, M.; Fujisaki, A.; Yamamoto, H.;
IGBT module setup with integrated micro-heat sinks
2000 / IEEE / 0-7803-6269-1
By: Steiner, T.; Sittig, R.;
Active cooling of integrated circuits and optoelectronic devices using a micro configured thermoelectric and fluidic system
2000 / IEEE / 0-7803-5912-7
By: DeMing Wang; Enchao Yu; Przekwas, A.; Sura Kim;
Numerical and experimental thermal characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins
2000 / IEEE / 0-7803-5912-7
By: Schiroky, G.; Joshi, Y.K.; Moores, K.A.;
DBC substrates as a base for power MCM's
2000 / IEEE / 0-7803-6644-1
By: Schulz-Harder, J.;
Heat transfer and cooling
2001 / IEEE
By: Fowler, K.;
Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics
2001 / IEEE / 0-7803-6649-2
By: Johnson, S.T.;
Micro thermal management of high-power diode laser bars
2001 / IEEE
By: Grellmann, M.; Schmidt, H.; Rolke, S.; Muller, D.; Unger, K.; Lorenzen, D.; Koidl, P.; Worner, E.; Kaulfersch, E.; Fahrner, W.R.; Bonhaus, J.;
Investigation on an integrated liquid cooling system in LTCC-multilayer
2001 / IEEE / 0-7803-7111-9
By: Bauer, R.; Svasta, P.; Leonescu, D.; Sauer, W.; Wolter, K.-J.; Strickert, V.;
Design of high efficiency and high density switched reluctance motor for vehicle propulsion
2001 / IEEE / 0-7803-7114-3
By: Schulz, S.E.; Rahman, K.M.;
Numerical procedure for liquid cooling optimisation
2001 / IEEE / 966-553-079-8
By: Raj, E.; Lisik, Z.; Langer, M.;
A high-power Ka-band quasi-optical amplifier array
2002 / IEEE
By: Mirth, L.; Hubert, J.; Ortiz, S.C.; Mortazawi, A.; Schlecht, E.;
Air cooled heat sinks integrated with synthetic jets
2002 / IEEE / 0-7803-7152-6
By: Mahalingam, R.; Glezer, A.;
Smart, low-cost, pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces
2002 / IEEE / 0-7803-7152-6
By: Mudawar, I.; Mukherjee, S.;
Temperature control during test and burn-in
2002 / IEEE / 0-7803-7152-6
By: Gardell, D.;
Design of high-efficiency and high-torque-density switched reluctance motor for vehicle propulsion
2002 / IEEE
By: Rahman, K.M.; Schulz, S.E.;
Stimulated emission at 5445 Å in Tb3+: YLF
1973 / IEEE
By: Gabbe, D.; Castleberry, D.; Jenssen, H.; Linz, A.;
A Precision Analog Duplexing Phase Shifter
1972 / IEEE
By: Klein, G.; Boyd, C.R.;
A Novel Design of an X-Band High-Power Ferrite Phase Shifter (Short Papers)
1972 / IEEE
By: Hering, K.H.;
Packaging Technology for the NEC SX Supercomputer
1985 / IEEE
By: Murano, H.; Watari, T.;
Design and performance evaluation of a compact thermosyphon
2002 / IEEE
By: Wenger, T.M.; Patel, C.D.; Beitelmal, M.H.; Joshi, Y.K.; Pal, A.;
Direct liquid cooling of a stacked multichip module
2002 / IEEE / 0-7803-7435-5
By: Pinjala, D.; Chai, J.C.; Toh, K.C.; Chen, X.Y.;
Heat-transfer advances for submerged oceanographic systems
2002 / IEEE / 0-7803-7534-3
By: Naiman, M.; McDonald, G.;
Lumped capacity thermal circuit diagram of active chip cooling schemes
2003 / IEEE / 0-7803-7793-1
By: Sabounchi, P.; Heydari, A.;
Micro cooling application on high density memory module
2003 / IEEE / 0-7803-7793-1
By: Joonghyun Baek; Minha Kim; Hyejung Cho; Yunhyeok Im;
Practical design of a 1000 W/cm/sup 2/ cooling system [high power electronics]
2003 / IEEE / 0-7803-7793-1
By: Faulkner, D.; Shekarriz, R.; Khotan, M.;
Components of a highly integrated DBF terminal antenna for mobile Ka-band satellite communications
2003 / IEEE / 0-7803-7695-1
By: Holzwarth, S.; Dreher, A.; Pawlak, H.; Stange, L.C.; Thiel, M.; Litschke, O.; Jacob, A.F.;
Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages
2003 / IEEE / 0-7803-7791-5
By: Wong, T.N.; Joshi, Y.K.; Pinjala, D.; Zhang, H.Y.; Toh, K.C.;

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