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Topic: Heat Sinks

Results

Improvements to a Method for Estimating the Maximum Radiated Emissions From PCBs With Cables
2011 / IEEE
By: Changyi Su; Hubing, T.H.;
Electrical Design and Techniques for an Embedded High-Pin-Count LSI Chip Package
2011 / IEEE
By: Fujimura, Y.; Mori, K.; Sasaki, H.; Ohshima, D.; Yamamichi, S.; Miki, R.; Kikuchi, K.; Enomoto, M.; Murakami, T.; Nishiyama, T.; Funaya, T.; Nakashima, Y.;
Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
2011 / IEEE
By: Ken Kuang; Liyong Diao; Guosheng Jiang;
GPU-based Real-Time Approximation of the Ablation Zone for Radiofrequency Ablation
2011 / IEEE
By: Rieder, C.; Kroeger, T.; Schumann, C.; Hahn, H.K.;
Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise
2011 / IEEE
By: Dawei Xiang; Mawby, P.; Shaoyong Yang; Bryant, A.; Tavner, P.; Li Ran;
Widely Tunable High-Power Semiconductor Disk Laser With Nonresonant AR-Assisted Gain Element on Diamond Heat Spreader
2011 / IEEE
By: Larsson, A.; Fallahi, M.; Bengtsson, J.; Hessenius, C.; Borgentun, C.;
Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling
2011 / IEEE
By: Mizunuma, H.; Chia-Lin Yang; Yi-Chang Lu;
Experimental Research on a Honeycomb Microchannel Cooling System
2011 / IEEE
By: Xiaobing Luo; Yonglu Liu; Wei Liu;
Reset Current Scaling in Phase-Change Memory Cells: Modeling and Experiments
2012 / IEEE
By: Borghi, M.; Bergonzoni, C.; Palumbo, E.;
On the Measurement of the Thermal Resistance of Vertical-External-Cavity Surface-Emitting Lasers (VECSELs)
2012 / IEEE
By: Stolz, W.; Koch, M.; Kunert, B.; Sparenberg, M.; Fan Zhang; Heinen, B.;
Novel Dual-Band Out-of-Phase Power Divider With High Power-Handling Capability
2012 / IEEE
By: Er-Ping Li; Xing-Chang Wei; Gao-Le Dai; Ming-Yao Xia;
Analysis of Temperature Distribution in Power Converter for Switched Reluctance Motor Drive
2012 / IEEE
By: Xu, Y.; Chen, H.; Iu, H.H.;
A Closed-Form Expression for Estimating the Maximum Radiated Emissions From a Heatsink on a Printed Circuit Board
2012 / IEEE
By: Xinbo He; Hubing, T.H.;
Thermoelectric Powered Wireless Sensors for Spent Fuel Monitoring
2012 / IEEE
By: Blanchard, J. P.; Corradini, M. L.; Carstens, T. A.; Ma, Z.;
A Study on LED Retrofit Solutions for Low-Voltage Halogen Cycle Lamps
2012 / IEEE
By: Gacio, D.; Alonso, J.M.; Corominas, E.L.; Ribas, J.; Calleja, A.J.;
Effects of Hypervapotron Geometry on Thermalhydraulic Performance
2012 / IEEE
By: Bullock, J.H.; Ulrickson, M.A.; Youchison, D.L.;
Efficient and Reliable High-Power Laser Diode Bars With Low-Smile Implementation
2012 / IEEE
By: Nagakura, T.; Torii, K.; Takauji, M.; Morita, T.; Maeda, J.; Kageyama, N.; Yoshida, H.; Miyajima, H.;
Wetting-Layer-Pumped Continuous-Wave Surface-Emitting Quantum-Dot Laser
2012 / IEEE
By: Quarterman, A.H.; Kbashi, H.J.; Wilcox, K.G.; Tropper, A.C.; Henini, M.; Apostolopoulos, V.; Morris, O.J.;
Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs
2012 / IEEE
By: Jing liu; Hui Zhu; Shiwei Feng; Guangchen Zhang; Chunsheng Guo; Jingwan Li;
Thermal Performance of the SunPower Alpha-2 PV Concentrator
2012 / IEEE
By: Dawson, M.J.; Shoecraft, M.; Judkins, Z.S.; Linderman, R.J.;
Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package
2012 / IEEE
By: Matsunaga, K.; Okamoto, Y.; Nakayama, T.; Ando, Y.; Miyamoto, H.; Tanomura, M.; Wakejima, A.; Kuroda, N.; Ota, K.;
Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics
2012 / IEEE
By: Glezer, A.; Joshi, Y.; Hidalgo, P.; Kota, K.;
Heat Transfer Characteristics of a Heat Sink in Presence of a Synthetic Jet
2012 / IEEE
By: Chaudhari, M.B.; Agrawal, A.; Puranik, B.;
Design and Construction of a <7�Low-Concentration Photovoltaic System Based on Compound Parabolic Concentrators
2012 / IEEE
By: Shell, K. A.; Schuetz, M. A.; Davis, R. J.; French, R. H.; Reinbolt, G. S.; Brown, S. A.;
Improved Continuous-Wave Performance of Two-Section Quantum-Dot Superluminescent Diodes by Using Epi-Down Mounting Process
2012 / IEEE
By: Xinkun Li; Zhanguo Wang; Ju Wu; Jian Wu; Heng Wei; Xueqin Lv; Zuocai Wang; Qi An; Peng Jin;
Increase of Cooling Performance of Conduction Cooled Superconducting Coils Using High Thermal Conduction Plastic
2012 / IEEE
By: Goto, T.; Yuhara, T.; Asano, S.; Hachisuka, D.; Takao, T.; Nishimura, A.; Yamanaka, A.;
Development of a Heat Sink With Periodic Asymmetric Structures Using Grayscale Lithography and Deep Reactive Ion Etching
2012 / IEEE
By: Ellis, C.D.; Bhavnani, S.H.; Narayanan, V.; Kapsenberg, F.; Thiagarajan, N.;
Characterization of Gas Conductance of a Thermal Device With a V-Groove Cavity
2012 / IEEE
By: Chung-Nan Chen;
Numerical and Experimental Study of a Hybrid Thermoelectric Cooler Thermal Management System for Electronic Cooling
2012 / IEEE
By: Ching, C.Y.; Ewing, D.; Russel, M.K.;
Improving SiC JFET Switching Behavior Under Influence of Circuit Parasitics
2012 / IEEE
By: Josifovic, I.; Ferreira, J.A.; Popovic-Gerber, J.;
Thermal Performance Assessment and Validation of High-Concentration Photovoltaic Solar Cell Module
2012 / IEEE
By: Zun-Hao Shih; Tsung-Lin Chou; Kou-Ning Chiang; Cheng-Nan Han; Hwen-Fen Hong;
Design of Complex Structured Monolithic Heat Sinks for Enhanced Air Cooling
2012 / IEEE
By: Hernon, D.; Krishnan, S.; Lyons, A.M.; Mullins, J.; Hodes, M.;
Power density of piezoelectric transformers improved using a contact heat transfer structure
2012 / IEEE
By: Li Juan Chen; Wei Wei Shao; Zhi Hua Feng; Yong Bin Liu; Cheng Liang Pan;
Determination of Electrical Contact Resistivity in Thermoelectric Modules (TEMs) From Module-Level Measurements
2012 / IEEE
By: Kolodner, P.; Salamon, T.; Annapragada, S.R.; Garimella, S.V.; Hodes, M.;
Numerical Analysis of Novel Micro Pin Fin Heat Sink With Variable Fin Density
2012 / IEEE
By: Hernandez-Guerrero, A.; Kandlikar, S.G.; Rubio-Jimenez, C.A.;
Transient Frequency-Domain Thermal Measurements With Applications to Electronic Packaging
2012 / IEEE
By: Master, R.; Yizhang Yang; Touzelbaev, M.; Refai-Ahmed, G.;
Optimization of Phase Change Material Heat Sinks for Low Duty Cycle High Peak Load Power Supplies
2012 / IEEE
By: Drofenik, U.; Stupar, A.; Kolar, J.W.;
Thermal Management of Electronics Using PCM-Based Heat Sink Subjected to Cyclic Heat Load
2012 / IEEE
By: Saha, S.K.; Dutta, P.;
Heat Transport in Graphene Interconnect Networks With Graphene Lateral Heat Spreaders
2012 / IEEE
By: Subrina, S.;
Design of Contoured Thermomechanical Actuators and Pulsing Actuation to Enhance Dynamic Performance
2012 / IEEE
By: Culpepper, M.L.; Shih-Chi Chen;
State of the art fully water cooled plasma DC generator with ultra fast arc quenching circuit for photovoltaic applications
2011 / IEEE / 978-1-4244-9312-8
By: Zyskowski, L.; Sobczuk, D.; Gedroyc, K.; Jasinski, M.; Zelechowski, M.;
Electromigration-based deposition enabled by nanorobotic manipulation inside a transmission electron microscope
2011 / IEEE / 978-1-61284-385-8
By: Xudong Fan; Xudong Cui; Xinyong Tao; Zheng Fan; Lixin Dong; Xiaobin Zhang;
Viability of complementary sun concentrated based power plants for offshore structures
2011 / IEEE / 978-1-4577-0088-0
By: Garcia, R.F.; Casado, M.H.;
Heat-mapping: A robust approach toward perceptually consistent mesh segmentation
2011 / IEEE / 978-1-4577-0395-9
By: Ramani, K.; Minhyong Kim; Mengtian Sun; Yi Fang;
Electro-thermal simulations of a power electronic inverter for a hybrid car
2011 / IEEE / 978-1-4577-0061-3
By: Ottosson, J.; Hagstedt, D.; Alakula, M.;
Thermal Analysis of Advanced 3D Stacked Systems
2011 / IEEE / 978-1-4577-0803-9
By: Plosila, J.; Liljeberg, P.; Latif, K.; Rahmani, A.; Vaddina, K.R.;
Thermal performance of a plate-fin heat sink with a shield
2011 / IEEE / 978-1-61284-486-2
By: Hung-Yi Li; Shung-Ming Chao; Go-Long Tsai; Yi-Feng Yen;
Power Sandwich industrial drive with SiC JFETs
2011 / IEEE / 978-90-75815-14-6
By: Josifovic, I.; Ferreira, J.A.; Popovic-Gerber, J.;
Adaptive cooling of power modules for reduced power and thermal cycling
2011 / IEEE / 978-90-75815-14-6
By: Zanchetta, P.; Castellazzi, A.; Choy, W.J.;
Research on the cooling effect of semiconductor refrigeration chip
2011 / IEEE / 978-1-4577-0536-6
By: Huiqiang Wang; Weilian Sun; Zhijun Ji; Bo Sun;
Cooling mechanisms in 3D ICs: Thermo-mechanical perspective
2011 / IEEE / 978-1-4577-1221-0
By: Rubio-Jimenez, C.A.; Kudithipudi, D.; Kandlikar, S.G.;
Liquid cooling for 3D-ICs
2011 / IEEE / 978-1-4577-1221-0
By: Srivastava, A.; Bing Shi;
Air-cooling optimization at system level
2011 / IEEE / 978-90-75815-14-6
By: Gradinger, T.B.;
Introduction of a hybrid MOSFET-IGBT power switching device utilising a novel Schottky biased minority carrier injector
2011 / IEEE / 978-90-75815-14-6
By: Mawby, P.A.; Ward, P.J.; Westmoreland, M.;
ENEA's activities on C-PV technology
2011 / IEEE / 978-1-4244-8930-5
By: Privato, C.; Graditi, G.; Cancro, C.; Fucci, R.;
Investigation of tradeoffs between efficiency, power density and switching frequency in three-phase two-level PWM boost rectifier
2011 / IEEE / 978-90-75815-14-6
By: Boroyevich, D.; Bo Wen; Mattavelli, P.;
Demonstration of 25 W/cm3 class all-SiC three phase inverter
2011 / IEEE / 978-90-75815-14-6
By: Takao, K.; Shinohe, T.;
Electromagnetics-thermal co-analysis of real-life 3-D ICs using non-conformal domain decomposition method
2011 / IEEE / 978-1-4577-0811-4
By: Yang Shao; Jin-Fa Lee; Zhen Peng;
Dynamic approach to the reliability analysis for the Service Water System of a Candu 6 nuclear power plant
2011 / IEEE / 978-989-95055-7-5
By: Benvenuto, F.; Pistelli, S.; Mazzini, M.; Mazzini, D.;
Pre-sizing optimization of an inverter and the passive components
2011 / IEEE / 978-90-75815-14-6
By: Larouci, C.; Lefranc, P.; Ledoux, C.;
Design and implementation of a digital LED desk lamp using the halftone method and a touch pad
2011 / IEEE / 978-1-4244-9789-8
By: Ren-Yi Tsai; Ying-Wen Bai; Chi-Huang Hung;
Simulation study of soil direct cooling air-conditioning system
2011 / IEEE / 978-1-4577-0399-7
By: Lianjing Niu; Hui Dong; Ruiqian Guo; Fang Wang; Yuejun Liu;
Electro - thermal analogies for temperature calculation
2011 / IEEE / 978-1-4577-2112-0
By: Man, E.; Man, L.;
Thermal and optical simulation of high-power LED array based on silicon heatsink
2011 / IEEE / 978-1-4577-0321-8
By: Dongmei Zhong; Jing Zhang;
PCB thermal performance for power LEDs
2011 / IEEE / 978-1-4577-2112-0
By: Gyoch, B.; Pencheva, T.; Mashkov, P.;
Lamp with rigid LED strip - Design and thermal management
2011 / IEEE / 978-1-4577-2112-0
By: Pencheva, T.; Mashkov, P.; Gyoch, B.;
Multi-physics analysis of high-power ICs using non-conformal domain decomposition method
2011 / IEEE / 978-1-61284-978-2
By: Jin-Fa Lee; Zhen Peng; Yang Shao;
Thermal Analysis of Job Allocation and Scheduling Schemes for 3D Stacked NoC's
2011 / IEEE / 978-1-4577-1048-3
By: Liljeberg, P.; Latif, K.; Rahmani, A.; Vaddina, K.R.; Plosila, J.;
Thermal simulation and optimization of high-power white LED lamps
2011 / IEEE / 978-1-4577-0321-8
By: Li-gang Wu; Kun Bai; Fa-wei Zhang; Zhao-yong Zheng; Qiu-hua Nie; Xiang-jun Ma; Bo-you Zhou; Shi-xun Dai;
Thermal analysis for high-power LED down-light
2011 / IEEE / 978-1-4577-0321-8
By: Ligang Wu; Xiangjun Ma; Zhaoyong Zheng; Boyou Zhou; Kun Bai; Shixun Dai;
Elimination of high temperature and high humidity effects on three-level high power PWM power electronics converter
2011 / IEEE / 978-1-4577-1043-8
By: Yousif, H.A.; Ting Lu; Zhengming Zhao;
Experimental and Numerical Study of the Effect of Geometric Parameters on Liquid Single-Phase Pressure Drop in Micro-Scale Pin-Fin Arrays
2011 / IEEE / 978-1-4577-1355-2
By: Pezzullo, V.; Voinier, S.;
Thermalhydraulic optimization of hypervapotron geometries for first wall applications
2011 / IEEE / 978-1-4577-0668-4
By: Bullock, J.H.; Ulrickson, M.A.; Youchison, D.L.;
Thermal management of compact SMT multilayer power converters
2011 / IEEE / 978-1-4577-0541-0
By: Popovic-Gerber, J.; Josifovic, I.; Ferreira, J.A.;
Filter design for the reduction of heat sink noise currents in power electronics
2011 / IEEE / 978-0-9541146-3-3
By: Kulanayagam, J.; Dickmann, S.; Hoffmann, K.F.; Kut, T.;
Analysis of thermal spreading resistance in high power LED package and its design optimization
2011 / IEEE / 978-1-4577-1769-7
By: Qiang Zhou; Shaojie Dong; Jianyi Yang; Xiaoqing Jiang; Minghua Wang;
Novel cooling solutions for LED solid state lighting
2011 / IEEE / 978-1-4577-1769-7
By: Yuen, M.M.F.; Zhaoli Gao; Haibo Fan; Xiaohua Zhang; Xiao, D.G.W.; Kai Zhang;
Research on heat dissipation of high heat flux multi-chip GaN-based white LED lamp
2011 / IEEE / 978-1-4577-1769-7
By: Dongjing Liu; Zhang, G.Q.; Daoguo Yang; Fengze Hou;
Weight optimisation of a surface mount permanent magnet synchronous motor using genetic algorithms and a combined electromagnetic-thermal co-simulation environment
2011 / IEEE / 978-1-4577-0541-0
By: Hamiti, T.; Rottach, M.; Gerada, C.;
An Efficient Approach of Power Reducing for Scratch-Pad Memory Based Embedded Systems
2011 / IEEE / 978-1-4577-1337-8
By: Yanqin Yang; Zili Shao; Minyi Guo; Wenchao Xu;
A novel cooling structure for electronic package
2011 / IEEE / 978-1-4577-1769-7
By: Lixi Wan; Liqiang Cao; Jing Zhang; Xueping Guo; Jun Li;
Optimisation of heatsink design for a ruggedised LCD display
2011 / IEEE / 978-1-4577-1769-7
By: Hua Lu; Bailey, C.;
Geometric optimization of carbon nanotubes (CNTs) microchannel with liquid flow
2011 / IEEE / 978-1-4577-1769-7
By: He Jiameng; Wang Dianxiao; Li Zongshuo; Wang Jia; Wang Xiaojing;
Analysis of temperature field of Embedded Multi-Chip Module
2011 / IEEE / 978-1-4577-1769-7
By: Wei Hegeng; Li Tianming; Wang Bin; Huang Chunyue;
A study on LED retrofit solutions for low-voltage halogen cycle lamps
2011 / IEEE / 978-1-4244-9500-9
By: Calleja, A.J.; Gacio, D.; Alonso, J.M.; Lopez, E.; Ribas, J.;
Loss and thermal analysis of semiconductor devices applied to an electric circuit simulator
2011 / IEEE / 978-1-4577-1646-1
By: Figueira, H.H.; Krug, R.P.; Cazakevicius, F.E.; Hey, H.L.; Beltrame, R.C.;
System-level thermal-aware design of 3D multiprocessors with inter-tier liquid cooling
2011 / IEEE / 978-2-35500-016-4
By: Sabry, M.M.; Sridhar, A.; Atienza, D.;
Cooling of next generation computer chips: Parametric study for single- and two-phase cooling
2011 / IEEE / 978-2-35500-016-4
By: Madhour, Y.; Poulikakos, D.; Michel, B.; Thome, J.; Olivier, J.; Zimmermann, S.;
Experimental characterization regarding two types of phosphor-converted white high-brightness LEDs: Low power and high power devices
2011 / IEEE / 978-1-4577-1646-1
By: Soares, G.M.; Almeida, P.S.; Rodrigues, C.R.B.S.; Braga, H.A.C.; Pinto, D.P.; Jorge, J.M.;
Thermal control mechanism with in-situ temperature sensor for TSV 3D-ICs
2011 / IEEE / 978-2-35500-016-4
By: Po-Tsang Huang; Wei Hwang; Herming Chiueh; Tzu-Ting Chiang;
Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials
2011 / IEEE / 978-2-35500-016-4
By: Wunderle, B.; Schacht, R.; May, D.; Monory-Plantier, C.; Winkler, T.; Haug, R.; AboRas, M.; Michel, B.;
A static converter comparative study taking into account semiconductor tecnologies and swicth auxiliary circuits: Optimized design
2011 / IEEE / 978-1-4577-1646-1
By: Pinheiro, J.R.; Beltrame, F.; Sartori, H.C.;
A new generation of power modules with sinter-technology for the automotive industry
2011 / IEEE / 978-1-4577-1370-5
By: Steger, J.;
High current PCBs - system integration of busbars and electronics
2011 / IEEE / 978-1-4577-1370-5
By: Lehnberger, C.;
Surge withstand capability of metal oxide varistors for 10/350 � s waveform
2011 / IEEE / 978-1-4577-1897-7
By: Tsukamoto, N.;
A 1kW-class S-band compact waveguide combiner unit with GaN HPAs for WPT and space communication
2011 / IEEE / 978-2-87487-022-4
By: Yamamoto, Z.-I.; Moriguchi, Y.; Furuta, S.; Ishizaki, T.; Kobayashi, Y.; Kawasaki, S.; Isono, K.; Shibuya, Y.; Noji, H.; Hori, M.;
Investigations on cooling of cavity for power combiner
2011 / IEEE / 978-1-4577-0603-5
By: Jia Wei Yu; Yong Fan; Zhong Bo Zhu; Xian Qi Lin; Yuan Jiang;
Influence of the heat sink orientation and fins arrangement on the thermal behavior of high power LED
2011 / IEEE / 978-1-4577-0144-3
By: Dinash, K.; Anithambigai, P.; Teeba, N.; Mutharasu, D.;
Thermal performance of oxide-free lithographic VCSELs
2011 / IEEE / 978-1-4244-8939-8
By: Zhao, G.; Deppe, D.G.;
Fluidic aligned, dense SWNTs arrays as potential die adhesive and thermal interface material
2011 / IEEE / 978-1-4673-0149-7
By: Baoming Wang; Hao Rong; Miao Lu;

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