Your Search Results
Use materials about this topic in your textbook!
AcademicPub holds over eight million pieces of educational content - such as case studies and journal articles - for you to mix-and-match your way.
Experience the freedom of customizing your course pack with AcademicPub!

Topic: Frequency 10 Hz
Results
2011 / IEEE / 978-1-4577-0167-2
By: Yung-Lan Yeh; Ya-Hsien Lai; Ying-Chi Huang; Lin, C.E.; Wei-Chi Huang;
By: Yung-Lan Yeh; Ya-Hsien Lai; Ying-Chi Huang; Lin, C.E.; Wei-Chi Huang;
2011 / IEEE / 978-0-9775657-8-8
By: Lei Li; Zhenhua Zhang; Xiaojin Cheng; Jianlei Wang; Weibiao Chen; Xiaolei Zhu; Xiangchun Shi;
By: Lei Li; Zhenhua Zhang; Xiaojin Cheng; Jianlei Wang; Weibiao Chen; Xiaolei Zhu; Xiangchun Shi;
2012 / IEEE / 978-1-4577-2190-8
By: Mensing, J.P.; Watthanawisuth, N.; Donkrajang, W.; Kerdcharoen, T.;
By: Mensing, J.P.; Watthanawisuth, N.; Donkrajang, W.; Kerdcharoen, T.;
2007 / IEEE
By: Vladimirova, N.M.; Vedernikov, G.P.; Starikov, A.Yu.; Shikov, A.K.; Potanina, L.V.; Nikitaev, P.I.; Agapov, N.N.; Kuznetsov, G.L.; Kovalenko, A.D.; Fischer, E.; Drobin, V.M.; Bartenev, V.D.; Khodzhibagiyan, H.G.;
By: Vladimirova, N.M.; Vedernikov, G.P.; Starikov, A.Yu.; Shikov, A.K.; Potanina, L.V.; Nikitaev, P.I.; Agapov, N.N.; Kuznetsov, G.L.; Kovalenko, A.D.; Fischer, E.; Drobin, V.M.; Bartenev, V.D.; Khodzhibagiyan, H.G.;
Novel sensor architecture for high-throughput and high-sensitivity biomolecular interaction analysis
2007 / IEEE / 1-4244-0926-8By: Jefferson, S.; Thrush, E.; VanWiggeren, G.D.; Bynum, M.A.; Killeen, K.; Baney, D.M.; Robotti, K.;
2007 / IEEE / 978-1-4244-1599-1
By: Klein, C.; Mai, H.; Beifuss, U.; Ondrus, V.; Henne, U.; Egami, Y.; Engler, R.H.; Sachs, W.E.;
By: Klein, C.; Mai, H.; Beifuss, U.; Ondrus, V.; Henne, U.; Egami, Y.; Engler, R.H.; Sachs, W.E.;
2007 / IEEE / 978-1-4244-0930-3
By: Nakatsuka, M.; Kawanaka, J.; Yoshida, H.; Kan, H.; Miyamoto, M.; Matsumoto, O.; Izawa, Y.; Kawashima, T.; Ikegawa, T.; Sekine, T.; Yasuhara, R.; Kurita, T.; Kanabe, T.;
By: Nakatsuka, M.; Kawanaka, J.; Yoshida, H.; Kan, H.; Miyamoto, M.; Matsumoto, O.; Izawa, Y.; Kawashima, T.; Ikegawa, T.; Sekine, T.; Yasuhara, R.; Kurita, T.; Kanabe, T.;
2007 / IEEE / 978-1-4244-0930-3
By: Karsch, S.; Wandt, C.; Siebold, M.; Beyertt, S.-S.; Krausz, F.; Bonati, G.; Wolff, D.; Hein, J.;
By: Karsch, S.; Wandt, C.; Siebold, M.; Beyertt, S.-S.; Krausz, F.; Bonati, G.; Wolff, D.; Hein, J.;
2007 / IEEE / 978-1-4244-0930-3
By: Vozzi, C.; Stagira, S.; Nisoli, M.; De Silvestri, S.; Benedetti, E.; Cerullo, G.; Sansone, G.; Gasilov, S.; Calegari, F.;
By: Vozzi, C.; Stagira, S.; Nisoli, M.; De Silvestri, S.; Benedetti, E.; Cerullo, G.; Sansone, G.; Gasilov, S.; Calegari, F.;
2007 / IEEE / 978-1-4244-1173-3
By: Du Hyun Beak; Jin Woo Yoon; Jin Kong; Hong Jin Kong; Jae Sung Shin;
By: Du Hyun Beak; Jin Woo Yoon; Jin Kong; Hong Jin Kong; Jae Sung Shin;
2007 / IEEE / 978-1-55752-834-6
By: Petros, M.; Trieu, B.; Jirong Yu; Reithmaier, K.; Singh, U.N.; Petzar, P.;
By: Petros, M.; Trieu, B.; Jirong Yu; Reithmaier, K.; Singh, U.N.; Petzar, P.;
2007 / IEEE / 978-1-4244-0847-4
By: Codreanu, I.; Voccia, S.; Tibeica, C.; Morelle, J.-L.; Nedelcu, O.T.; Dahms, S.;
By: Codreanu, I.; Voccia, S.; Tibeica, C.; Morelle, J.-L.; Nedelcu, O.T.; Dahms, S.;
2008 / IEEE / 978-1-4244-1487-1
By: Chapsky, J.; Bartman, R.K.; Abramovici, A.; Liebe, C.C.; Lam, R.; Coste, K.; Chapsky, L.;
By: Chapsky, J.; Bartman, R.K.; Abramovici, A.; Liebe, C.C.; Lam, R.; Coste, K.; Chapsky, L.;
2008 / IEEE / 978-1-55752-859-9
By: Schenkel, N.; Telford, S.J.; Peterson, N.L.; Kent, R.A.; Lanning, R.K.; Schaffers, K.I.; Freitas, B.L.; Ebbers, C.A.; Dawson, J.W.; Campbell, R.W.; Bayramian, A.J.; Armstrong, J.P.; Barty, C.P.J.; Caird, J.A.; Utterback, E.J.;
By: Schenkel, N.; Telford, S.J.; Peterson, N.L.; Kent, R.A.; Lanning, R.K.; Schaffers, K.I.; Freitas, B.L.; Ebbers, C.A.; Dawson, J.W.; Campbell, R.W.; Bayramian, A.J.; Armstrong, J.P.; Barty, C.P.J.; Caird, J.A.; Utterback, E.J.;
2008 / IEEE / 978-1-4244-1929-6
By: Ryc, L.; Rosinski, M.; Parys, P.; Czarnecka, A.; Laska, L.; Krasa, J.; Wolowski, J.;
By: Ryc, L.; Rosinski, M.; Parys, P.; Czarnecka, A.; Laska, L.; Krasa, J.; Wolowski, J.;
2009 / IEEE
By: Inoue, M.; Kiss, T.; Matsekh, A.; Shiohara, Y.; Izumi, T.; Sutoh, Y.; Yoshizumi, M.;
By: Inoue, M.; Kiss, T.; Matsekh, A.; Shiohara, Y.; Izumi, T.; Sutoh, Y.; Yoshizumi, M.;
2009 / IEEE
By: Xibo Zhang; Jiancang Su; Zhenjie Ding; Jianchang Peng; Guozhi Liu; Limin Wang; Yafeng Pan; Xiaoxin Song;
By: Xibo Zhang; Jiancang Su; Zhenjie Ding; Jianchang Peng; Guozhi Liu; Limin Wang; Yafeng Pan; Xiaoxin Song;
2009 / IEEE / 978-1-4244-3296-7
By: Jimbo, Y.; Noshiro, M.; Jong-Kook Lee; Miwa, K.; Kotani, K.; Moriguchi, H.; Takeuchi, A.;
By: Jimbo, Y.; Noshiro, M.; Jong-Kook Lee; Miwa, K.; Kotani, K.; Moriguchi, H.; Takeuchi, A.;
2010 / IEEE
By: Jian Cui; Xuesong Liu; Xiaozhu Chi; Longtao Lin; Kraft, M.; Haitao Ding; Guizhen Yan; Zhenchuan Yang;
By: Jian Cui; Xuesong Liu; Xiaozhu Chi; Longtao Lin; Kraft, M.; Haitao Ding; Guizhen Yan; Zhenchuan Yang;
2010 / IEEE / 978-1-4244-5342-9
By: Matin, A.; Ishida, M.; Sawada, K.; Akai, D.; Kawazu, N.; Sugai, T.;
By: Matin, A.; Ishida, M.; Sawada, K.; Akai, D.; Kawazu, N.; Sugai, T.;
2011 / IEEE
By: Sharma, A.; Chakravarthy, D.P.; Nagesh, K.V.; Menon, R.; Roy, A.; Patel, A.; Sharma, V.; Mitra, S.; Kumar, S.;
By: Sharma, A.; Chakravarthy, D.P.; Nagesh, K.V.; Menon, R.; Roy, A.; Patel, A.; Sharma, V.; Mitra, S.; Kumar, S.;
2011 / IEEE / 978-1-4577-0156-6
By: Jiang, Y.G.; Fujita, T.; Toyonaga, T.; Fujii, K.; Maenaka, K.; Higuchi, K.;
By: Jiang, Y.G.; Fujita, T.; Toyonaga, T.; Fujii, K.; Maenaka, K.; Higuchi, K.;