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2011 / IEEE
By: Dengler, R.J.; Cooper, K.B.; Siegel, P.H.; Chattopadhyay, G.; Thomas, B.; Llombart, N.;
By: Dengler, R.J.; Cooper, K.B.; Siegel, P.H.; Chattopadhyay, G.; Thomas, B.; Llombart, N.;
2012 / IEEE
By: Hayat, M.M.; Beach, R.J.; Pepin, M.; Qi Wang; Dunkel, R.; Doerry, A.W.; Gerstle, W.; Santhanam, B.; Atwood, T.;
By: Hayat, M.M.; Beach, R.J.; Pepin, M.; Qi Wang; Dunkel, R.; Doerry, A.W.; Gerstle, W.; Santhanam, B.; Atwood, T.;
2012 / IEEE / 978-1-4577-2190-8
By: Masada, Y.; Sato, A.; Torii, T.; Iramina, K.; Iwahashi, M.; Nakahara, Y.;
By: Masada, Y.; Sato, A.; Torii, T.; Iramina, K.; Iwahashi, M.; Nakahara, Y.;
2012 / IEEE / 978-4-88552-263-5
By: Takeshita, H.; Namiki, S.; Kurumida, J.; Tajima, A.; Nakamura, S.; Hino, T.;
By: Takeshita, H.; Namiki, S.; Kurumida, J.; Tajima, A.; Nakamura, S.; Hino, T.;
2012 / IEEE / 978-1-4673-2343-7
By: Ling Pei; Ruotsalainen, L.; Liang Chen; Kuusniemi, H.; Bhuiyan, M.Z.H.; Ruizhi Chen; Guinness, R.;
By: Ling Pei; Ruotsalainen, L.; Liang Chen; Kuusniemi, H.; Bhuiyan, M.Z.H.; Ruizhi Chen; Guinness, R.;
2007 / IEEE / 978-1-4244-0915-0
By: Sumini, M.; Rocchi, F.; Mannucci, S.; Angeli, E.; Tartari, A.; Mostacci, D.;
By: Sumini, M.; Rocchi, F.; Mannucci, S.; Angeli, E.; Tartari, A.; Mostacci, D.;
2007 / IEEE / 978-1-4244-1077-4
By: Urushihara, R.; Murase, N.; Kaji, R.; Rothwell, J.C.; Murayama, N.; Shibasaki, H.; Sakata-Igasaki, M.; Igasaki, T.;
By: Urushihara, R.; Murase, N.; Kaji, R.; Rothwell, J.C.; Murayama, N.; Shibasaki, H.; Sakata-Igasaki, M.; Igasaki, T.;
2007 / IEEE / 978-1-4244-0916-7
By: Nielsen, J.S.; Boland, M.J.; Moller, S.P.; Madsen, S.; Hertel, N.; Kruse, L.; Kristensen, J.; Hauge, N.; Bodker, F.; Bach, H.; Weber, S.V.; Tan, Y.E.; Spencer, M.J.; LeBlanc, G.S.; Dowd, R.;
By: Nielsen, J.S.; Boland, M.J.; Moller, S.P.; Madsen, S.; Hertel, N.; Kruse, L.; Kristensen, J.; Hauge, N.; Bodker, F.; Bach, H.; Weber, S.V.; Tan, Y.E.; Spencer, M.J.; LeBlanc, G.S.; Dowd, R.;
2007 / IEEE / 978-1-55752-834-6
By: Myers, M.C.; Giuliani, J.L.; Sethian, J.D.; Wolford, M.F.; Obenschain, S.P.;
By: Myers, M.C.; Giuliani, J.L.; Sethian, J.D.; Wolford, M.F.; Obenschain, S.P.;
2008 / IEEE / 978-1-4244-1621-9
By: Tanimoto, M.; Nakamichi, Y.; Konishi, T.; Morita, G.; Ishikawa, H.; Ohki, Y.;
By: Tanimoto, M.; Nakamichi, Y.; Konishi, T.; Morita, G.; Ishikawa, H.; Ohki, Y.;
2008 / IEEE / 978-1-4244-2809-0
By: Wei Luo; Xiaojun Liao; Zhidong Jia; Zhicheng Guan; Liming Wang; Ruobing Zhang;
By: Wei Luo; Xiaojun Liao; Zhidong Jia; Zhicheng Guan; Liming Wang; Ruobing Zhang;
2009 / IEEE / 978-1-4244-2902-8
By: Yu-Xian Yan; Xi-Zheng Zhang; Yan Wei; Yong Guo; Chun Guo; Qiang-Cheng Zeng; Bo Ning; Rui-Xin Li;
By: Yu-Xian Yan; Xi-Zheng Zhang; Yan Wei; Yong Guo; Chun Guo; Qiang-Cheng Zeng; Bo Ning; Rui-Xin Li;
2009 / IEEE / 978-1-4244-4102-0
By: Wang Jian-jun; Li Ming-zhong; Deng Ying; Zhang Rui; Lin Hong-huan; Xu Dang-peng;
By: Wang Jian-jun; Li Ming-zhong; Deng Ying; Zhang Rui; Lin Hong-huan; Xu Dang-peng;
2009 / IEEE / 978-1-4244-4190-7
By: van Herwaarden, A.W.; Finoulst, I.M.O.; Iervolino, E.; Sarro, P.M.; Verhaert, P.D.E.M.; Wien, W.;
By: van Herwaarden, A.W.; Finoulst, I.M.O.; Iervolino, E.; Sarro, P.M.; Verhaert, P.D.E.M.; Wien, W.;
2009 / IEEE / 978-1-4244-4548-6
By: Edelstein, A.; Shu Fan Cheng; Egelhoff, W.E.; Burnette, J.E.; Fischer, G.A.;
By: Edelstein, A.; Shu Fan Cheng; Egelhoff, W.E.; Burnette, J.E.; Fischer, G.A.;
2009 / IEEE / 978-1-4244-4548-6
By: Yuan, L.; Pappas, D.P.; Moreland, J.; Da Silva, F.C.S.; Shen, J.; Russek, S.E.; Sellmyer, D.; Liou, S.H.; Heindl, R.;
By: Yuan, L.; Pappas, D.P.; Moreland, J.; Da Silva, F.C.S.; Shen, J.; Russek, S.E.; Sellmyer, D.; Liou, S.H.; Heindl, R.;
2009 / IEEE / 978-1-4244-4548-6
By: Preusser, J.; Griffith, W.C.; Knappe, S.; Kitching, J.; Gerginov, V.; Jimenez-Martinez, R.; Shah, V.; Schwindt, P.;
By: Preusser, J.; Griffith, W.C.; Knappe, S.; Kitching, J.; Gerginov, V.; Jimenez-Martinez, R.; Shah, V.; Schwindt, P.;
2010 / IEEE / 978-1-55752-890-2
By: Martz, D.H.; Alessi, D.; Wang, Y.; Rocca, J.J.; Luther, B.M.; Berrill, M.;
By: Martz, D.H.; Alessi, D.; Wang, Y.; Rocca, J.J.; Luther, B.M.; Berrill, M.;
2011 / IEEE
By: Willering, G.; Sikler, G.; Salmi, T.; Richter, D.; Peiro, G.; Bonasia, A.; Oberli, L.; Le Naour, S.; Gaertner, W.; Borgnolutti, F.; Bottura, L.;
By: Willering, G.; Sikler, G.; Salmi, T.; Richter, D.; Peiro, G.; Bonasia, A.; Oberli, L.; Le Naour, S.; Gaertner, W.; Borgnolutti, F.; Bottura, L.;
2011 / IEEE / 978-1-4577-0532-8
By: Loeser, M.; Siebold, M.; Schramm, U.; Hein, J.; Korner, J.; Kroll, F.; Roeser, F.;
By: Loeser, M.; Siebold, M.; Schramm, U.; Hein, J.; Korner, J.; Kroll, F.; Roeser, F.;
2011 / IEEE / 978-1-4577-0188-7
By: Ling Pei; Ruotsalainen, L.; Liang Chen; Kuusniemi, H.; Ruizhi Chen; Yuwei Chen;
By: Ling Pei; Ruotsalainen, L.; Liang Chen; Kuusniemi, H.; Ruizhi Chen; Yuwei Chen;