Your Search Results
Use materials about this topic in your textbook!
AcademicPub holds over eight million pieces of educational content - such as case studies and journal articles - for you to mix-and-match your way.
Experience the freedom of customizing your course pack with AcademicPub!

Topic: Dielectric Losses
Results
2011 / IEEE
By: Huitema, L.; Mattei, J.-L.; Thakur, A.; Souriou, D.; Staraj, R.; Ferrero, F.; Jamnier, B.; Sharahia, A.; Minard, P.; Pintos, J.-F.; Queffelec, P.;
By: Huitema, L.; Mattei, J.-L.; Thakur, A.; Souriou, D.; Staraj, R.; Ferrero, F.; Jamnier, B.; Sharahia, A.; Minard, P.; Pintos, J.-F.; Queffelec, P.;
2011 / IEEE
By: Shih, W.Y.; Youngsoo Chung; Wei Wu; Xiang Li; Shung, K.K.; Qifa Zhou; Wei-Heng Shih;
By: Shih, W.Y.; Youngsoo Chung; Wei Wu; Xiang Li; Shung, K.K.; Qifa Zhou; Wei-Heng Shih;
2011 / IEEE
By: Shung, K.K.; Qifa Zhou; Sien-Ting Lau; Xi Yao; Xiaoqing Wu; Hongfen Ji; Peng Shi; Lingyan Wang; Wei Ren; Xiaofeng Chen;
By: Shung, K.K.; Qifa Zhou; Sien-Ting Lau; Xi Yao; Xiaoqing Wu; Hongfen Ji; Peng Shi; Lingyan Wang; Wei Ren; Xiaofeng Chen;
2011 / IEEE
By: Panina, L.V.; Peng, H.X.; Qin, F.X.; Gonzalez, J.; Zhukov, A.; Zhukova, V.; Ipatov, M.;
By: Panina, L.V.; Peng, H.X.; Qin, F.X.; Gonzalez, J.; Zhukov, A.; Zhukova, V.; Ipatov, M.;
2011 / IEEE
By: Sutinjo, A.; Belostotski, L.; Burgess, T.; Petursson, M.A.; Okoniewski, M.; Johnston, R.H.;
By: Sutinjo, A.; Belostotski, L.; Burgess, T.; Petursson, M.A.; Okoniewski, M.; Johnston, R.H.;
2012 / IEEE
By: Shelton, D.J.; Ginn, J.C.; Elsherbeni, A.Z.; Nayeri, P.; Fan Yang; Rahmat-Samii, Y.; Boreman, G.D.;
By: Shelton, D.J.; Ginn, J.C.; Elsherbeni, A.Z.; Nayeri, P.; Fan Yang; Rahmat-Samii, Y.; Boreman, G.D.;
2012 / IEEE
By: Fusco, V.F.; Buchanan, N.B.; Cahill, R.; Christie, S.; Maxwell-Cox, G.; Munro, Y.V.; Mitchell, N.;
By: Fusco, V.F.; Buchanan, N.B.; Cahill, R.; Christie, S.; Maxwell-Cox, G.; Munro, Y.V.; Mitchell, N.;
2012 / IEEE
By: Azhdar, B.; Hillborg, H.; Nawaz, S.; Nordell, P.; Edin, H.; Javerberg, N.; Gedde, U.W.;
By: Azhdar, B.; Hillborg, H.; Nawaz, S.; Nordell, P.; Edin, H.; Javerberg, N.; Gedde, U.W.;
2011 / IEEE / 978-1-4577-1163-3
By: Dongmei Deng; Yun Zhou; Jincang Zhang; Shixun Cao; Shujuan Yuan; Zhenjie Feng;
By: Dongmei Deng; Yun Zhou; Jincang Zhang; Shixun Cao; Shujuan Yuan; Zhenjie Feng;
2011 / IEEE / 978-1-4244-7355-7
By: Abdelmalik, A.A.; Harris, R.C.; Abbott, A.P.; Dodd, S.J.; Fothergill, J.C.;
By: Abdelmalik, A.A.; Harris, R.C.; Abbott, A.P.; Dodd, S.J.; Fothergill, J.C.;
2011 / IEEE / 978-1-4577-0399-7
By: Xiaohui Gao; Hui Shi; Xingsong Zhu; Weiwei Cui; Lizhu Liu; Ling Weng;
By: Xiaohui Gao; Hui Shi; Xingsong Zhu; Weiwei Cui; Lizhu Liu; Ling Weng;
2011 / IEEE / 978-1-61284-978-2
By: Miyamoto, K.; Hidaka, N.; Sugama, H.; Tsuchiya, A.; Hashimoto, O.; Tsujino, S.;
By: Miyamoto, K.; Hidaka, N.; Sugama, H.; Tsuchiya, A.; Hashimoto, O.; Tsujino, S.;
2011 / IEEE / 978-1-4244-6051-9
By: Stang, J.; Clarkson, S.; van Nieuwstadt, L.; Haynes, M.; Moghaddam, M.; Ward, C.;
By: Stang, J.; Clarkson, S.; van Nieuwstadt, L.; Haynes, M.; Moghaddam, M.; Ward, C.;
2011 / IEEE / 978-966-335-357-9
By: Tatarchuk, D.D.; Machulyansky, A.V.; Borisova, A.V.; Yakimenko, Y.I.;
By: Tatarchuk, D.D.; Machulyansky, A.V.; Borisova, A.V.; Yakimenko, Y.I.;
Choice of maximum number of internal reflections for transmission through a lossless dielectric slab
2011 / IEEE / 978-1-4577-0048-4By: Uguen, B.; Plouhinec, E.;
2011 / IEEE / 978-0-9541146-3-3
By: Kantartzis, N.V.; Dimitriadis, A.I.; Kollatou, T.M.; Antonopoulos, C.S.;
By: Kantartzis, N.V.; Dimitriadis, A.I.; Kollatou, T.M.; Antonopoulos, C.S.;
2011 / IEEE / 978-1-4577-0509-0
By: Sanchez-Escuderos, D.; Baquero-Escudero, M.; Berenguer, A.; Ferrando-Bataller, M.;
By: Sanchez-Escuderos, D.; Baquero-Escudero, M.; Berenguer, A.; Ferrando-Bataller, M.;
Low loss zero-level packaging for high frequency RF applications by using PerMX dry film photoresist
2011 / IEEE / 978-2-87487-022-4By: Seonho Seok; Janggil Kim; Rolland, P.-A.; Rolland, N.; Sharma, P.;
2011 / IEEE / 978-1-4577-2037-6
By: Surendra, M.; Sannamma, T.V.; Vasanthkumar, M.S.; Shruthi, B.; Kavya, M.; Banu, S.R.; Madhu, B.J.;
By: Surendra, M.; Sannamma, T.V.; Vasanthkumar, M.S.; Shruthi, B.; Kavya, M.; Banu, S.R.; Madhu, B.J.;
2011 / IEEE / 978-1-4577-0167-2
By: Brezina, V.; Soukalova, J.; Vanek, J.; Hason, S.; Cvrcek, L.; Vetterl, V.; Silvennoinen, M.; Penttinen, N.; Silvennoinen, R.;
By: Brezina, V.; Soukalova, J.; Vanek, J.; Hason, S.; Cvrcek, L.; Vetterl, V.; Silvennoinen, M.; Penttinen, N.; Silvennoinen, R.;
2011 / IEEE / 978-1-4577-2149-6
By: Jayaramudu, J.; Clarke, W.; Ramana, C.V.V.; Ray, S.S.; Sadiku, R.;
By: Jayaramudu, J.; Clarke, W.; Ramana, C.V.V.; Ray, S.S.; Sadiku, R.;
2011 / IEEE / 978-1-4577-0255-6
By: Sapawi, R.; Pokharel, R.K.; Mat, D.A.A.; Yoshida, K.; Kanaya, H.;
By: Sapawi, R.; Pokharel, R.K.; Mat, D.A.A.; Yoshida, K.; Kanaya, H.;