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Topic: Ceramics
Results
2011 / IEEE
By: Sin Ming Loo; Lee, C.; Shawver, S.; Plumlee, D.; Yates, M.; Browning, J.; Taff, J.; McCrink, M.;
By: Sin Ming Loo; Lee, C.; Shawver, S.; Plumlee, D.; Yates, M.; Browning, J.; Taff, J.; McCrink, M.;
2011 / IEEE
By: Huitema, L.; Mattei, J.-L.; Thakur, A.; Souriou, D.; Staraj, R.; Ferrero, F.; Jamnier, B.; Sharahia, A.; Minard, P.; Pintos, J.-F.; Queffelec, P.;
By: Huitema, L.; Mattei, J.-L.; Thakur, A.; Souriou, D.; Staraj, R.; Ferrero, F.; Jamnier, B.; Sharahia, A.; Minard, P.; Pintos, J.-F.; Queffelec, P.;
Tem analyses of the local crystal and domain structures in (na1-xkx)0.5bi0.5tio3 perovskite ceramics
2011 / IEEEBy: Skapin, S.D.; Otonicar, M.; Jancar, B.;
2011 / IEEE
By: Sheng-Yuan Chu; Bing-Jing Li; Cheng-Shong Hong; Yi-Cheng Liou; Cheng-Che Tsai; Song-Ling Yang;
By: Sheng-Yuan Chu; Bing-Jing Li; Cheng-Shong Hong; Yi-Cheng Liou; Cheng-Che Tsai; Song-Ling Yang;
2011 / IEEE
By: Shuting Chen; Kui Yao; Li Lu; Sritharan, T.; Tay, F.E.H.; Shuhui Yu; Mirshekarloo, M.S.; Rahimabady, M.;
By: Shuting Chen; Kui Yao; Li Lu; Sritharan, T.; Tay, F.E.H.; Shuhui Yu; Mirshekarloo, M.S.; Rahimabady, M.;
Electromechanical coupling and temperature-dependent polarization reversal in piezoelectric ceramics
2011 / IEEEBy: Cain, M.G.; Weaver, P.M.; Stewart, M.; Correia, T.M.;
2011 / IEEE
By: Titov, V.V.; Malitskaya, M.A.; Zakharov, Y.N.; Raevskaya, S.I.; Kubrin, S.P.; Zakharchenko, I.N.; Lutokhin, A.G.; Raevski, I.P.; Sitalo, E.I.; Blazhevich, A.V.;
By: Titov, V.V.; Malitskaya, M.A.; Zakharov, Y.N.; Raevskaya, S.I.; Kubrin, S.P.; Zakharchenko, I.N.; Lutokhin, A.G.; Raevski, I.P.; Sitalo, E.I.; Blazhevich, A.V.;
2012 / IEEE
By: Atassi, I.; Maric, A.; Blaz, N.; Smetana, W.; Homolka, H.; Zivanov, L.; Radosavljevic, G.;
By: Atassi, I.; Maric, A.; Blaz, N.; Smetana, W.; Homolka, H.; Zivanov, L.; Radosavljevic, G.;
2012 / IEEE
By: Baird, J.; Shkuratov, S.I.; Altgilbers, L.L.; Stults, A.H.; Hackenberger, W.S.; Alberta, E.F.; Talantsev, E.F.;
By: Baird, J.; Shkuratov, S.I.; Altgilbers, L.L.; Stults, A.H.; Hackenberger, W.S.; Alberta, E.F.; Talantsev, E.F.;
2012 / IEEE
By: Yanagida, T.; Fujimoto, Y.; Kamada, K.; Totsuka, D.; Yagi, H.; Nikl, M.; Futami, Y.; Yanagida, S.; Kurosawa, S.; Yokota, Y.; Yoshikawa, A.; Yanagitani, T.;
By: Yanagida, T.; Fujimoto, Y.; Kamada, K.; Totsuka, D.; Yagi, H.; Nikl, M.; Futami, Y.; Yanagida, S.; Kurosawa, S.; Yokota, Y.; Yoshikawa, A.; Yanagitani, T.;
2012 / IEEE
By: Jing-Lin Kuo; Huei Wang; Ting-Yi Huang; Yi-Long Chang; Yi-Keng Hsieh; Pen-Jui Peng; I-Chih Chang; Tzung-Chuen Tsai; Kun-Yao Kao; Wei-Yuan Hsiung; Wang, J.; Hsu, Y.A.; Kun-You Lin; Hsin-Chia Lu; Yi-Cheng Lin; Liang-Hung Lu; Tian-Wei Huang; Ruey-Beei Wu; Yi-Fong Lu;
By: Jing-Lin Kuo; Huei Wang; Ting-Yi Huang; Yi-Long Chang; Yi-Keng Hsieh; Pen-Jui Peng; I-Chih Chang; Tzung-Chuen Tsai; Kun-Yao Kao; Wei-Yuan Hsiung; Wang, J.; Hsu, Y.A.; Kun-You Lin; Hsin-Chia Lu; Yi-Cheng Lin; Liang-Hung Lu; Tian-Wei Huang; Ruey-Beei Wu; Yi-Fong Lu;
2012 / IEEE
By: Jansons, J.; Elsts, E.; Rogulis, U.; Kundzins, K.; Stunda, A.; Doke, G.; Sarakovskis, A.;
By: Jansons, J.; Elsts, E.; Rogulis, U.; Kundzins, K.; Stunda, A.; Doke, G.; Sarakovskis, A.;
2012 / IEEE
By: Kinka, M.; Maglione, M.; Banys, J.; Grigalaitis, R.; Samulionis, V.; Bagdzevicius, S.; Castel, E.; Josse, M.;
By: Kinka, M.; Maglione, M.; Banys, J.; Grigalaitis, R.; Samulionis, V.; Bagdzevicius, S.; Castel, E.; Josse, M.;
2012 / IEEE
By: Semenova, Y.; Ming Ding; Brambilla, G.; Murugan, G.S.; Pengfei Wang; Farrell, G.; Qiang Wu;
By: Semenova, Y.; Ming Ding; Brambilla, G.; Murugan, G.S.; Pengfei Wang; Farrell, G.; Qiang Wu;
2012 / IEEE
By: Costecalde, J.; Mazenq, L.; Saya, D.; Guillon, S.; Nicu, L.; Soyer, C.; Remiens, D.;
By: Costecalde, J.; Mazenq, L.; Saya, D.; Guillon, S.; Nicu, L.; Soyer, C.; Remiens, D.;
2012 / IEEE
By: Sarychev, D.A.; Titov, V.V.; Prosandeev, S.A.; Malitskaya, M.A.; Blazhevich, A.V.; Raevskaya, S.I.; Kubrin, S.P.; Raevski, I.P.; Zakharchenko, I.N.;
By: Sarychev, D.A.; Titov, V.V.; Prosandeev, S.A.; Malitskaya, M.A.; Blazhevich, A.V.; Raevskaya, S.I.; Kubrin, S.P.; Raevski, I.P.; Zakharchenko, I.N.;
2012 / IEEE
By: Reddy, P.S.; Tiwari, U.K.; Narayana, K.S.; Shankar, M.S.; Kishore, P.; Sengupta, D.; Prasad, R.L.N.S.;
By: Reddy, P.S.; Tiwari, U.K.; Narayana, K.S.; Shankar, M.S.; Kishore, P.; Sengupta, D.; Prasad, R.L.N.S.;
2012 / IEEE
By: Ferrero, F.; Gianesello, F.; Pilard, R.; Titz, D.; Luxey, C.; Gloria, D.; Jacquemod, G.; Brachat, P.;
By: Ferrero, F.; Gianesello, F.; Pilard, R.; Titz, D.; Luxey, C.; Gloria, D.; Jacquemod, G.; Brachat, P.;
2012 / IEEE
By: Bjorninen, T.; Babar, A.A.; Ukkonen, L.; Kallio, P.; Sydanheimo, L.; Bhagavati, V.A.;
By: Bjorninen, T.; Babar, A.A.; Ukkonen, L.; Kallio, P.; Sydanheimo, L.; Bhagavati, V.A.;
2012 / IEEE
By: Persons, R.; Tapaninen, O.; Sitomaniemi, A.; Juntunen, E.; Heikkinen, V.; Challingsworth, M.;
By: Persons, R.; Tapaninen, O.; Sitomaniemi, A.; Juntunen, E.; Heikkinen, V.; Challingsworth, M.;
1992 / IEEE / 000-0-0000-0000-0
By: Waganaar, W.J.; Muenchausen, R.E.; Linton, T.W.; Henins, I.; Greenly, J.B.; Rej, D.J.; Gautier, D.C.; Faehl, R.J.; Davis, H.A.; Bartsch, R.R.;
By: Waganaar, W.J.; Muenchausen, R.E.; Linton, T.W.; Henins, I.; Greenly, J.B.; Rej, D.J.; Gautier, D.C.; Faehl, R.J.; Davis, H.A.; Bartsch, R.R.;
2000 / IEEE
By: Cherepanov, V.P.; Deichuli, O.I.; Vinokurov, N.A.; Zinin, E.I.; Zinevich, N.I.; Tararyshkin, S.V.; Shubin, E.I.; Shaftan, T.V.; Scheglov, M.A.; Popik, V.M.; Ovchar, V.K.; Oreshkov, A.D.; Miginsky, S.V.; Gavrilov, N.G.; Gudkov, B.A.; Kulipanov, G.N.; Miginsky, E.G.;
By: Cherepanov, V.P.; Deichuli, O.I.; Vinokurov, N.A.; Zinin, E.I.; Zinevich, N.I.; Tararyshkin, S.V.; Shubin, E.I.; Shaftan, T.V.; Scheglov, M.A.; Popik, V.M.; Ovchar, V.K.; Oreshkov, A.D.; Miginsky, S.V.; Gavrilov, N.G.; Gudkov, B.A.; Kulipanov, G.N.; Miginsky, E.G.;
2004 / IEEE / 978-5-87911-088-3
By: Korzhenevski, S.R.; Filatov, A.L.; Motovilov, V.A.; Ananin, M.V.; Kuznetsov, V.L.;
By: Korzhenevski, S.R.; Filatov, A.L.; Motovilov, V.A.; Ananin, M.V.; Kuznetsov, V.L.;
2004 / IEEE / 978-5-87911-088-3
By: Mitchell, I.; Chuaqui, H.; Aliaga-Rossel, R.; Favre, M.; Wyndham, E.S.;
By: Mitchell, I.; Chuaqui, H.; Aliaga-Rossel, R.; Favre, M.; Wyndham, E.S.;
2004 / IEEE / 978-5-87911-088-3
By: Matsuura, K.; Hoshizuki, H.; Mitsudo, S.; Nishi, H.; Ishibashi, J.; Kitano, A.; Saji, T.; Iwai, Y.; Honda, T.; Eremeev, A.G.; Glyavin, M.Y.; Idehara, T.;
By: Matsuura, K.; Hoshizuki, H.; Mitsudo, S.; Nishi, H.; Ishibashi, J.; Kitano, A.; Saji, T.; Iwai, Y.; Honda, T.; Eremeev, A.G.; Glyavin, M.Y.; Idehara, T.;
2011 / IEEE / 978-3-00-035081-8
By: Zanjia Su; Ningsheng Xu; Shaozhi Deng; Jun Chen; Haibo Gan; Tongyi Guo; Lifang Li; Fei Liu;
By: Zanjia Su; Ningsheng Xu; Shaozhi Deng; Jun Chen; Haibo Gan; Tongyi Guo; Lifang Li; Fei Liu;