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Topic: Assembly

Results

New developments for the improvement of high voltage rectification with silicon series string
1964 / IEEE
By: Schuler, Chet;
Development of the RCA 25-inch 90-degree rectangular color picture tube
1964 / IEEE
By: Morrell, A. M.; Hardy, A. E.;
The COLUMBUS approach
1975 / IEEE
By: Witt, J.;
Automated database-driven digital testing
1974 / IEEE
By: Toth, Attila; Holt, Chip;
Power: Britain's fast breeder: The Dounreay test reactor experience has instilled confidence in its designers to press for commercialization
1980 / IEEE
By: Blumfield, C. W.;
Spectral lines: Good news amid the bad, part II
1980 / IEEE
By: Christiansen, Donald;
Robotics applications in electronics manufacturing
1985 / IEEE
By: Powers, J.H.;
Design of a laboratory for multineuron studies
1983 / IEEE
By: Espinosa, I.E.; Bloom, M.J.; Gerstein, G.L.; Turner, M.R.; Evanczuk, S.;
On reverse engineering
1985 / IEEE
By: Rekoff, M.G.;
Automating electronics manufacturing
1987 / IEEE
By: Powers, J.H.;
The impact on software development costs of using HOL's
1986 / IEEE
By: Gaffney, J.E.;
Validating Halstead's theory with system 3 data
1986 / IEEE
By: Lipow, M.;
Antenna designer's notebook
1988 / IEEE
By: Schrank, H.;
A TCP-Specific Traffic Profiling and Prediction Scheme for Performance Optimization in OBS Networks
2011 / IEEE
By: Vlachos, K.; Ramantas, K.;
Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing
2011 / IEEE
By: Koyanagi, M.; Ohara, Y.; Iwata, E.; Fukushima, T.; Murugesan, M.; Tanaka, T.; Kangwook Lee; Jichoel Bea;
Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly
2011 / IEEE
By: Hinmeng Au; Sungeun Jeon; Ming Kong; Yung-Cheng Lee; Chiwon Hwang;
High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined With Ultrasonic Bonding Technique
2011 / IEEE
By: Pykari, L.; Saarinen, I.J.; Kiwon Lee; Kyung Wook Paik;
Transfer-Printed Microscale Integrated Circuits for High Performance Display Backplanes
2011 / IEEE
By: Hamer, J.W.; Bonafede, S.; Menard, E.; Bower, C.A.; Cok, R.S.;
Investigations Into the Role of the Bremsstrahlung Conversion Target in the Self-Magnetic Pinch Radiographic Diode
2011 / IEEE
By: Threadgold, J.R.; Martin, P.N.; Juniper, P.; Jeffries, G.; Webb, K.; Cooper, G.M.; McLean, J.; Jones, A.;
A System for Nuclear Fuel Inspection Based on Ultrasonic Pulse-Echo Technique
2011 / IEEE
By: Seixas, J.M.; Machado, J.C.; Pereira, W.C.A.; Thome, Z.D.; Soares-Filho, W.;
Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages
2011 / IEEE
By: Surasit, C.; Drake, K.Y.S.; Beleran, J.; Tan Hua Hong; Wilson, O.P.L.; Zhang, X.R.; Librado, G.; Mehta, G.;
Development of a Bendable Permanent-Magnet Tubular Linear Motor
2012 / IEEE
By: Gunther, R.; Urban, C.; Witt, R.; Richter, R.; Nagel, T.;
Single-Port-Access Surgery with a Novel Magnet Camera System
2012 / IEEE
By: Rentschler, M.E.; Schoen, J.A.; Mills, Z.C.; Terry, B.S.;
Supporting Undergraduate Computer Architecture Students Using a Visual MIPS64 CPU Simulator
2012 / IEEE
By: Catania, V.; Fazzino, F.; Palesi, M.; Spadaccini, A.; Patti, D.;
Vertical RF Transition With Mechanical Fit for 3-D Heterogeneous Integration
2012 / IEEE
By: Barker, N.S.; Raman, S.; Wood, J.; Lihan Chen;
Fast Tessellated Solid Navigation in GEANT4
2012 / IEEE
By: Langton, C. M.; Trapp, J. V.; Cornelius, I.; Poole, C. M.;
Formation of Columnar Structures by the Magnetically Directed Assembly of Cobalt Ferrite Nanoparticles
2012 / IEEE
By: Lisjak, D.; Drofenik, M.; Jenus, P.;
Neutron Emission Characteristics of NX-3 Plasma Focus Device: Speed Factor as the Guiding Rule for Yield Optimization
2012 / IEEE
By: Verma, R.; Rawat, R.S.; Lee, P.; Tan, A.T.L.; Shyam, A.; Goh Jia Ying; Springham, S.V.; Talebitaher, A.; Ilyas, U.; Shariff, H.;
Development of a High Resolution X-Ray CT Technique for Irradiated Fuel Pellets
2012 / IEEE
By: Katsuyama, K.; Asaga, T.; Nagamine, T.; Maeda, K.; Ishimi, A.;
Development of ITER Sector Subassembly Procedure, Tools, and Mock-up Test
2012 / IEEE
By: Hyunki Park; Kyoungo Nam; Shaw, R.; Kihak Im; Byungseok Kim; Kyoungkyu Kim; Jooshik Bak; Heejae Ahn; Dongjin Kim;
Combining Self-Explaining With Computer Architecture Diagrams to Enhance the Learning of Assembly Language Programming
2012 / IEEE
By: Hung, Y.-C.;
Race-Car Instrumentation for Driving Behavior Studies
2012 / IEEE
By: Abbink, D.A.; Velenis, E.; Katzourakis, D.I.; Holweg, E.; Happee, R.;
Lean Software Development: A Tutorial
2012 / IEEE
By: Poppendieck, M.; Cusumano, M.A.;
Progress, Challenges, and Lessons Learned in the Construction of Wendelstein 7-X
2012 / IEEE
By: Brauer, T.; Bosch, H.-S.; Klinger, T.;
DEPFET Macropixel Detectors for MIXS: Integration and Qualification of the Flight Detectors
2012 / IEEE
By: Majewski, P.; Treis, J.; Bahr, A.; De Vita, G.; Gunther, B.; Hermenau, K.; Hilchenbach, M.; Lauf, T.; Lechner, P.; Lutz, G.; Miessner, D.; Porro, M.; Reiffers, J.; Richter, R.; Schaller, G.; Schnecke, M.; Schopper, F.; Soltau, H.; Stefanescu, A.; Strecker, R.; Struder, L.; Andricek, L.;
Unbalanced Magnetic Force Calculation for Assembly Jig Design
2012 / IEEE
By: Ji-Young Lee; Do-Kwan Hong; Dae-Suk Joo; Yo-Han Chio; Byoung-Uk Nam; Byung-Chul Woo;
Implementation of Earned Value Management Tools in the Wendelstein 7-X Project
2012 / IEEE
By: Kuttler, K.; Bosch, H.; Lorenz, A.;
Performance evaluation of an optical burst switched core node with generalized arrivals and partial wavelength conversion capability
2012 / IEEE
By: Shalaby, H.M.H.; El-Rahman, A.I.A.; Sowailem, M.Y.S.; Morsy-Osman, M.H.;
Rapid Dielectrophoresis Assembly of a Single Carbon Nanocoil on AFM Tip Apex
2012 / IEEE
By: Wen-Pin Shih; Ming-Dao Wu; Pei-Zen Chang; Shuo-Hung Chang; Yi-Jie Chen; Yao-Chuan Tsai;
The EDIPO Project: Status and Outlook
2012 / IEEE
By: Theisen, E.; Vogel, M.; Scheller, H.; Salpietro, E.; March, S.; Stepanov, B.; Fernandez-Cano, E.; Croari, G.; Cau, F.; Bruzzone, P.; Baker, W.; Amend, J.; Portone, A.; Wesche, R.;
Prognostics Model Development of BGA Assembly Under Vibration Environment
2012 / IEEE
By: Changwoon Han; Won-Sik Hong; Chul-Min Oh;
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
2012 / IEEE
By: Yu-Jiau Huang; Yu-Lan Lu; Lau, J.H.; Tao-Chih Chang; Ching-Kuan Lee; Ming-Jer Kao; Lo, R.; Huan-Chun Fu; Kuo-Shu Kao; Pei-Chen Chang; Ren-Shin Cheng; Cheng-Ta Ko; Zhi-Cheng Hsiao; Jui-Hsiung Huang;
The ALMA Band-7 Cartridge
2012 / IEEE
By: Perrin, G.; Lazareff, B.; Maier, D.; Mahieu, S.; Navarrini, A.; Laslaz, F.; Geoffroy, D.; Chalain, J.; Celestin, G.;
Competing Fracture Modeling of Thin Chip Pick-Up Process
2012 / IEEE
By: Yongan Huang; Bo Peng; Youlun Xiong; Zhouping Yin;
Hybrid-Integrated Polarization Diverse Coherent Receiver Based on Polymer PLC
2012 / IEEE
By: Grote, N.; Steffan, A.; Schubert, C.; Ziyang Zhang; Zawadzki, C.; Keil, N.; Matiss, A.; Theurer, A.; Richter, T.; Kroh, M.; Jin Wang;
Decirculation Process in Neural Network Dynamics
2012 / IEEE
By: Mau-Hsiang Shih; Feng-Sheng Tsai;
Industrial HTCC Antenna-Module SiP for 60-GHz Applications
2012 / IEEE
By: Ferrero, F.; Gianesello, F.; Pilard, R.; Titz, D.; Luxey, C.; Gloria, D.; Jacquemod, G.; Brachat, P.;
Accuracy, Memory, and Speed Strategies in GPU-Based Finite-Element Matrix-Generation
2012 / IEEE
By: Dziekonski, A.; Mrozowski, M.; Lamecki, A.; Sypek, P.;
Functional Connectivity Dynamics Among Cortical Neurons: A Dependence Analysis
2012 / IEEE
By: Seth, S.; Park, I.M.; Lin Li; Principe, J.C.; Sanchez, J.C.;
Design and Evaluation of an Orthotic Knee-Extension Assist
2012 / IEEE
By: Spring, A.N.; Lemaire, E.D.; Kofman, J.;
Fabrication and Assembly of the NHMFL 25 T Resistive Split Magnet
2012 / IEEE
By: Toth, J.; O'Reilly, J.W.; Bole, S.; Bird, M.D.;
Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling
2012 / IEEE
By: Goebel, K.; More, V.; Vaidya, R.; Lall, P.;
Effect of Nano-Particles on Heterogeneous Void Nucleation in No-Flow Underfill Materials
2012 / IEEE
By: Baldwin, D.; Myung Jin Yim; Lee, S.;
Novel Electrical Joints Using Deformation Machining Technology Part I: Computer Modeling
2012 / IEEE
By: Elmoursi, A.; Lisowsky, B.; Zubkov, N.; Solovyeva, L.;
Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding
2012 / IEEE
By: Soueidan, M.; Mouawad, B.; Martin, C.; Morel, H.; Bley, V.; Allard, B.; Buttay, C.; Fabregue, D.;
Neural Assembly Computing
2012 / IEEE
By: Ranhel, J.;
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
2012 / IEEE
By: Zirath, H.; Chee-Way Oh; Chang, E.Y.; Wei-Cheng Wu; Chin-Te Wang; Li-Han Hsu; Yueh-Chin Lin; Wee-Chin Lim; Szu-Ping Tsai;
Experimental Investigation of Contact Resistance for Water Cooled Jacket for Electric Motors and Generators
2012 / IEEE
By: Kulkarni, D.P.; Chen, E.; Rupertus, G.;
Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates
2012 / IEEE
By: Swenson, O.; Marinov, V.; Datta, S.; Semler, M.; Atanasov, Y.; Sarwar, F.; Miller, R.;
Experiences From the Assembly of the Magnet System for Wendelstein 7-X
2012 / IEEE
By: Wegener, L.;
Conical Insert Design for the HZB Series-Connected Hybrid
2012 / IEEE
By: White, M.; Gavrilin, A.; Bole, S.; Bird, M.D.; Jingping Chen;
Development of a New Insulation Approach for the LHC Main 13 kA Interconnection Splices
2012 / IEEE
By: Lackner, F.; Tock, J.P.; Prin, H.; Lopez, R.; Fessia, P.; Bertinelli, F.;
Status of Design and R&D for the ITER Feeder System Procurement in China
2012 / IEEE
By: Sumei Liu; Bauer, P.; Tingzhi Zhou; Yong Chen; Xiongyi Huang; Kun Lu; Yuntao Song; Zhongwei Wang; Guang Shen; Mitchell, N.; Chen-yu Gung; Niu, E.; Kaizhong Ding; Devred, A.; Yonghua Chen; Yanfang Bi;
R3B-Glad Magnet Cold Mass Manufacture: Coils and Casings Fabrication and Integration
2012 / IEEE
By: Gastineau, B.; Donati, A.; Berriaud, C.; Disset, G.; Mayri, C.; Godon, P.;
Investigation of the Packaging-Induced RF Attenuations and Resonances in a Broadband Optoelectronic Modulator Module
2012 / IEEE
By: Xin Wang; Rensing, M.; Wei Han; O'Brien, P.; Peters, F.H.; Hua Yang;
Mechanical Behavior of the KSTAR Central Solenoid Coil Structure During Thermal Cycles
2012 / IEEE
By: Oh, Y.K.; Lee, K.S.; Bang, E.N.; Kim, K.M.; Park, K.R.; Kwon, M.; Yang, H.L.; Kim, H.T.; Sa, J.W.; Kim, H.K.; Kim, Y.O.;
Field Correction of an Elliptically Polarized Undulator
2012 / IEEE
By: Jun-Tune Chen; Fu-Yuan Lin; Ching-Shiang Hwang; Jui-Che Huang; Cheng-Hsiang Chang; Cheng-Shin Chang;
Modeling and Characterizing Initial Component Assembly in Templated Assembly by Selective Removal
2012 / IEEE
By: Livermore, C.; Eid, F.; Sunghwan Jung;
Tolerance Analysis of ALMA Band 10 Corrugated Horns and Optics
2012 / IEEE
By: Gonzalez, A.; Uzawa, Y.;
Odd-Mode-Excited Tire-Wheel Assembly for Tire Pressure Monitoring Systems
2012 / IEEE
By: Nakatsu, K.; Ide, N.; Iizuka, H.; Sato, K.; Yoshimoto, H.;
Batch-Fabricated High-Power RF Microrelays With Direct On-PCB Packages
2012 / IEEE
By: Sarabandi, K.; Sangjo Choi; Ozkeskin, F.M.; Gianchandani, Y.B.;
Two-Dimensional Autonomous Microparticle Manipulation Strategies for Magnetic Microrobots in Fluidic Environments
2012 / IEEE
By: Floyd, S.; Pawashe, C.; Sitti, M.; Diller, E.;
Parallel Heterogeneous Integration of Chip-Scale Parts by Self-Assembly
2012 / IEEE
By: Baskaran, R.; Ji Hao Hoo; Kwang Soon Park; Bohringer, K.F.;
AutoAssem: An Automated Assembly Planning System for Complex Products
2012 / IEEE
By: Li Da Xu; Jiapeng Yu; Zhuming Bi; Chengen Wang;
Quantitative Analysis of the Self-Assembly Strategies of Intermediate Filaments from Tetrameric Vimentin
2012 / IEEE
By: Czeizler, E.; Petre, I.; Eriksson, J.E.; Back, R.-J.; Czeizler, E.; Mizera, A.;
Interchangeable Stage and Probe Mechanisms for Microscale Universal Mechanical Tester
2012 / IEEE
By: Dikin, D.A.; Brown, J.J.; Bright, V.M.; Ruoff, R.S.;
A Concurrent Approach to Reducing Environmental Impact of Product Development at the System Design Stage
2012 / IEEE
By: Chih-Hsing Chu; Yuan-Tsung Chen; Su, J.C.P.;
Application of the Assembly Skill Transfer System in an Actual Cellular Manufacturing System
2012 / IEEE
By: Feng Duan; Arai, T.; Kato, R.; Ji Gang Tong; Tan, J.T.C.;
Three-DOF Microrobotic Platform Based on Capillary Actuation
2012 / IEEE
By: Cojan, R.; Gauthier, M.; Lenders, C.; Lambert, P.;
Automatic Design and Manufacture of Soft Robots
2012 / IEEE
By: Lipson, H.; Hiller, J.;
Inductive energy store (IES) technology for multi-terra watt generators
1992 / IEEE / 000-0-0000-0000-0
By: Childers, F.K.; Ashby, S.R.; Sincerny, P.S.; Schlitt, L.; Stallings, C.; Deeney, C.; Roth, I.S.; Riordan, J.C.; Goyer, J.R.; Kortbawi, D.;
Development of photoconductive switches for stacked Blumlein pulsers
2002 / IEEE / 978-0-7354-0107-5
By: Collins, Carl B.; Davanloo, Farzin; Agee, Forrest J.;
Experiment on accelerating the cylindrically converged liner by single-turn EMG using magnetic-opening switch
2004 / IEEE / 978-5-87911-088-3
By: Reinovsky, R.E.; Lindemuth, I.R.; Sabayev, N.M.; Yakubov, V.B.; Vasyukov, V.A.; Achison, V.L.; Mokhov, V.N.; Chernyshev, V.K.; Petrukhin, A.A.; Fahel, R.I.;
Optimized algorithms for real time medical image registration
2010 / IEEE / 978-0-9552047-4-6
By: Elsayed, O.A.;
Research on atomic component model development in BOM-based HLA simulation
2011 / IEEE / 978-1-4244-9698-3
By: Huang Jian; Cai Ying; Yang Mei; Zhang Peng;
Aviation manufacturing equipment based WSN security monitoring system
2011 / IEEE / 978-1-61284-666-8
By: Guoyi Zhang;
Safety analysis and research on risk assessment model of spacecraft assembly
2011 / IEEE / 978-1-61284-666-8
By: Wenying Chen; Gang Sun; Bile Wan;
Optimal design for active self-assembly system
2011 / IEEE / 978-1-4577-0081-1
By: Yuzhen Xue; Grover, M.A.;
Research on the optimum model and example of clothing assembly line
2011 / IEEE / 978-1-4244-9698-3
By: Rong Cheng-lu; Hu Jue-liang; Zhang Fei; Ji Xiao-fen; Chen Wei;
On the topological characterization of robot singularity loci. a catastrophe-theoretic approach
2011 / IEEE / 978-1-61284-385-8
By: Thomas, F.; Wenger, P.;
Equivalent fixed shape robot model of a modular robot configuration based on module characterization
2011 / IEEE / 978-1-61284-385-8
By: Baca, J.; Escalera, J.A.; Aracil, R.; Ferre, M.;
Robotic force control assembly parameter optimization for adaptive production
2011 / IEEE / 978-1-61284-385-8
By: Gravel, D.; Biao Zhang; Bell, A.; Jianjun Wang; Zhang, G.;
A security-property-based approach for lowering power consumption of secure mobile Web access
2011 / IEEE / 978-1-4244-9538-2
By: Boudaoud, K.; Pita, C.; Riveill, M.;
A robotic assembly system capable of handling flexible cables with connector
2011 / IEEE / 978-1-4244-8115-6
By: Kitaaki, Y.; Matsuno, T.; Kaneko, S.; Fukuda, T.; Shiratsuchi, K.; Haraguchi, R.; Noda, A.; Okuda, H.; Domae, Y.; Sumi, K.;
The experimental test and FEA of a PKM (Exechon) in a flexible fixture application for aircraft wing assembly
2011 / IEEE / 978-1-4244-8115-6
By: Butterfield, J.; Mingdong Shang;
An efficient assembly line balancing in automobile manufacturing
2011 / IEEE / 978-1-4244-9655-6
By: Bin Tahar, R.; Adham, A.A.J.;
Assembly and disassembly of magnetic mobile micro-robots towards deterministic 2-D reconfigurable micro-systems
2011 / IEEE / 978-1-61284-385-8
By: Sitti, M.; Floyd, S.; Diller, E.; Pawashe, C.;
Application research on temperature WSN nodes in switchgear assemblies based on TinyOS and ZigBee
2011 / IEEE / 978-1-4577-0365-2
By: Zhao Xibin; Yang Jianxu; Yan Shaomin; Jin Xinchao; Cai Bin; Zou Guowei;
Modeling the hierarchical structure of reverse logistic using driving and dependence power analysis
2011 / IEEE / 978-1-4244-9655-6
By: Ming Lang Tseng; Yuan-Ho Chen;
Force controlled assembly of emergency stop button
2011 / IEEE / 978-1-61284-385-8
By: Robertsson, A.; Linderoth, M.; Stolt, A.; Johansson, R.;

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