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A Method for Integrating Network-on-Chip Topologies with 3D ICs
By: Murali, S.; Kumar, A.S.; Kumar, M.P.; Veezhinathan, K.; Benini, L.;
2011 / IEEE / 978-1-4577-0803-9
This item was taken from the IEEE Conference ' A Method for Integrating Network-on-Chip Topologies with 3D ICs ' Three dimensional integration is a promising approach for reducing the form factor of chips. Scalable Networks on Chips (NoCs) are a necessity to support the communication requirements of such 3D ICs. Mapping of NoC topologies onto the different layers of the 3D stack, while meeting the 3D technology requirements and application power-performance constraints is an important problem. In this paper, we present an algorithm that addresses this issue of performing 3D layer assignment of NoC components. We also integrate the algorithm with an existing NoC interconnect floor planner. Our experiments on many SoC benchmarks show a reduction of 8 - 10% in the NoC power consumption and a 49% reduction in the number of vertical links (and hence, the Through Silicon Vias (TSVs)) when compared to existing approaches.
Three Dimensional Integration
Chip Form Factor
Noc Power Consumption
Through Silicon Vias
Three Dimensional Displays
Interconnect Mapping & Placement
Three-dimensional Integrated Circuits
Application Power-performance Constraints