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CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
By: Bing Dang; Knickerbocker, J.; Prabhakar, A.; Trzcinski, R.; Polastre, R.; Maria, J.; Tsang, C.; Andry, P.;
2010 / IEEE / 978-1-4244-6412-8
Description
This item was taken from the IEEE Conference ' CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration ' This paper reports a thin wafer handling technology that is compatible to CMOS processing conditions to enable 3D integration and assembly with high throughput at low cost. Using pulsed ultraviolet (UV) radiation from excimer lasers, device wafers as thin as 50�m can be released from the temporary mechanical handler wafer in less than 1min. Bonding, adhesive, debonding and post debond clean processes were demonstrated. CMOS circuit test vehicles were shown to be compatible with this temporary bonding and debonding processes.
Related Topics
3d Integration
Thin Wafer Handling Technology
Pulsed Ultraviolet Radiation
Uv Radiation
Device Wafers
Cmos Circuit Test Vehicles
Debonding Processes
Cmos Process
Chemical Lasers
Laser Ablation
Wafer Bonding
Cmos Technology
Optical Materials
Glass
Chemical Technology
Throughput
Costs
Laser Release
Adhesive Process
Mechanical Handler Wafer
Cmos Compatible Thin Wafer Processing
Post Debond Process
Cmos Integrated Circuits
Adhesive Bonding
Wafer Bonding
Engineering
Thin Chips
