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CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration

By: Bing Dang; Knickerbocker, J.; Prabhakar, A.; Trzcinski, R.; Polastre, R.; Maria, J.; Tsang, C.; Andry, P.;

2010 / IEEE / 978-1-4244-6412-8

Description

This item was taken from the IEEE Conference ' CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration ' This paper reports a thin wafer handling technology that is compatible to CMOS processing conditions to enable 3D integration and assembly with high throughput at low cost. Using pulsed ultraviolet (UV) radiation from excimer lasers, device wafers as thin as 50�m can be released from the temporary mechanical handler wafer in less than 1min. Bonding, adhesive, debonding and post debond clean processes were demonstrated. CMOS circuit test vehicles were shown to be compatible with this temporary bonding and debonding processes.