Your Search Results

Use this resource - and many more! - in your textbook!

AcademicPub holds over eight million pieces of educational content for you to mix-and-match your way.

Experience the freedom of customizing your course pack with AcademicPub!
Not an educator but still interested in using this content? No problem! Visit our provider's page to contact the publisher and get permission directly.

50�m pitch Pb-free micro-bumps by C4NP technology

By: Da-Yuan Shih; Bing Dang; Hughlett, E.; Ruhmer, K.; Semkow, K.; Tsang, C.; Buchwalter, S.; Knickerbocker, S.; Gruber, P.; Knickerbocker, J.; Patel, C.; Garant, J.;

2008 / IEEE / 978-1-4244-2230-2


This item was taken from the IEEE Conference ' 50�m pitch Pb-free micro-bumps by C4NP technology ' Controlled collapse chip connection new process (C4NP) is currently used in IBM manufacturing for all 300 mm Pb-free wafer bumping for flip chip packages. In this study, the extendibility of C4NP technology to ultra fine pitch applications has been explored. Reusable C4NP glass molds were fabricated and characterized for 50�m pitch application. Mold fill and wafer transfer with Pb-free solders have been demonstrated using both 200mm and 300mm wafers in a manufacturing environment. Significant improvement in bump yield was achieved for these early demonstations of fine pitch interconnections through process optimization and contamination control. Challenge in wafer inspection metrology is discussed for the 50�m pitch micro-bumps. Mechanical strength of the C4NP micro-bumps has been characterized using test dies with a full area array of micro-bumps.