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Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization
By: Kang, S.K.; Pavlova, A.; Sprogis, E.; Knickerbocker, J.; Tsang, C.; Patel, C.; Lee, K.W.; Horton, R.; Buchwalter, L.P.; Polastre, R.; Wright, S.L.; Gan, H.; Andry, P.S.;
2006 / IEEE / 1-4244-0152-6
Description
This item was taken from the IEEE Conference ' Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization ' To support the next generation highly integrated microsystem with 3D silicon integration using fine pitch interconnection and Si carrier, we develop a fabrication and assembly process at IBM Research to produce solder micro-joints (fine pitch flip-chip interconnections) for our system-on-package (SOP) technology. We fabricate solder bumps with 25 /spl mu/m (or less) in diameter on 50 /spl mu/m pitch size, as well as 50 /spl mu/m in diameter on 100 /spl mu/m pitch size, at wafer level (200mm) by electroplating method. There are up to 10208 micro-bumps (25 /spl mu/m) built on a chip surface less than 0.4 cm/sup 2/. The process can be applied to various solder compositions, including eutectic SnPb, Pb-free (CuSn), AuSn and high Pb (3Sn97Pb) solders. The test matrix includes different solder/UBM (under bump metallization) combination. In this paper, the discussion focuses on the fabrication, assembly and characterization of the micro-joints made with of Pb-free (CuSn) and eutectic SnPb solders with Ni and/or Cu stack plating. The preliminary electrical and mechanical test results indicated that reliable and high yield micro-bumps can be successfully made with this fabrication and assembly process.
Related Topics
Fine Pitch Interconnection
Assembly Process
Solder Microjoints
Flip-chip Interconnections
System-on-package
Solder Bumps
Electroplating Method
Solder Compositions
Eutectic Solders
Under Bump Metallization
Stack Plating
50 Micron
200 Mm
Cusn
Snpb
Fabrication
Assembly
Printing
Integrated Circuit Interconnections
Flip Chip
Testing
Very Large Scale Integration
Wire
Bonding
Packaging
3d Silicon Integration
Ausn
System-in-package
Solders
Metallisation
Lead Alloys
Integrated Circuit Interconnections
Flip-chip Devices
Fine-pitch Technology
Eutectic Alloys
Copper Alloys
Assembling
Tin Alloys
Engineering
Pb-free Microjoints