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Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods
By: Lund, J.L.; Cotte, J.; Jahnes, C.V.; Seeger, D.; Magerlein, J.H.; Deligianni, H.; Hoivik, N.; Tornello, J.A.; Fryer, P.; Buchwalter, L.P.; Chinthakindi, A.;
2004 / IEEE / 0-7803-8265-X
Description
This item was taken from the IEEE Conference ' Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods ' This paper describes the successful concurrent fabrication of micro-electro-mechanical (MEM) electrostatic switches and resonators on the same wafer. Base processes from copper interconnect technology were used to fabricate devices allowing for easy introduction of MEMS technology into CMOS IC manufacturing. Both switches and resonators were electrically tested in a controlled ambient to determine performance and characteristics.
Related Topics
Copper Based Cmos Interconnection
Complementary Metal Oxide Semiconductor
Electrostatic Switches
Cmos Ic Manufacturing
Fabrication
Radiofrequency Microelectromechanical Systems
Switches
Manufacturing
Cmos Technology
Electrostatics
Copper
Micromechanical Devices
Cmos Process
Cmos Integrated Circuits
Radiofrequency Microelectromechanical System
Rf Mems Resonators Fabrication
Rf Mems Switches Fabrication
Cu
Integrated Circuit Manufacture
Micromechanical Resonators
Cmos Integrated Circuits
Electrostatic Devices
Microswitches
Copper
Integrated Circuit Interconnections
Engineering
Radiofrequency Integrated Circuits