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Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods

By: Lund, J.L.; Cotte, J.; Jahnes, C.V.; Seeger, D.; Magerlein, J.H.; Deligianni, H.; Hoivik, N.; Tornello, J.A.; Fryer, P.; Buchwalter, L.P.; Chinthakindi, A.;

2004 / IEEE / 0-7803-8265-X

Description

This item was taken from the IEEE Conference ' Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods ' This paper describes the successful concurrent fabrication of micro-electro-mechanical (MEM) electrostatic switches and resonators on the same wafer. Base processes from copper interconnect technology were used to fabricate devices allowing for easy introduction of MEMS technology into CMOS IC manufacturing. Both switches and resonators were electrically tested in a controlled ambient to determine performance and characteristics.