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On-chip assembly of silicon photonic band gap crystals

By: Sturm, J.C.; Bo, X.Z.; Norris, D.J.; Vlasov, Yu.A.;

2002 / IEEE / 1-55752-706-7


This item was taken from the IEEE Conference ' On-chip assembly of silicon photonic band gap crystals ' Three-dimensional silicon photonic band gap crystals are obtained by combining planar self-assembly of colloidal spheres with standard silicon deposition techniques. This simple and inexpensive approach, which is compatible with conventional microelectronics fabrication, yields high refractive- index inverted opals of controllable thickness that are integrated directly onto a silicon wafer. These photonic bandgap structures, which operate at telecommunications wavelengths, are planar single-crystals over large areas with very low defect densities.