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LTCC as MCM substrate: design of strip-line structures and flip-chip interconnects
By: Schmuckle, F.J.; Spinnler, M.; Butz, J.; Heinrich, W.; Jentzsch, A.;
2001 / IEEE / 0-7803-6538-0
Description
This item was taken from the IEEE Conference ' LTCC as MCM substrate: design of strip-line structures and flip-chip interconnects ' LTCC multilayer substrates offer a cost-effective MCM solution for frequencies around 20 GHz and beyond. This paper reports on LTCC-specific transmission-line structures using a commercially available process. For the chip interconnect, a flip-chip approach contacting the backside is chosen, which, in a first step, is realized on conventional ceramics.
Related Topics
20 Ghz
Ltcc
Mcm Substrate
Flip-chip Interconnects
Multilayer Substrates
Chip Interconnect
Backside
Microstrip
Ceramics
Strips
Surface Treatment
Nonhomogeneous Media
Frequency
Transmission Lines
Impedance
Temperature
Wiring
Flip-chip Devices
Integrated Circuit Interconnections
Ceramic Packaging
Multichip Modules
Strip Lines
Engineering
Strip-line Structures
