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Processing and properties of new soluble polyimides
2001 / IEEE / 0-7803-7038-4
This item was taken from the IEEE Conference ' Processing and properties of new soluble polyimides ' A new family of polyimides have been developed which possess useful properties for the electronics packaging, optoelectronics, and imaging applications areas. Attributes of these materials include processing ease-to give films and coatings, dielectric characteristics, and thermal and electrical stability.
Electronic Packaging Thermal Management
Dielectric Thin Films
Soluble Polyimide Film