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Processing and properties of new soluble polyimides
By: Kobayashi, M.; Ayukawa, H.; Givot, B.L.; Chien, B.; Bai, F.; Ezzell, S.A.; Aoki, S.;
2001 / IEEE / 0-7803-7038-4
Description
This item was taken from the IEEE Conference ' Processing and properties of new soluble polyimides ' A new family of polyimides have been developed which possess useful properties for the electronics packaging, optoelectronics, and imaging applications areas. Attributes of these materials include processing ease-to give films and coatings, dielectric characteristics, and thermal and electrical stability.
Related Topics
Optoelectronic Imaging
Dielectric Characteristics
Thermal Stability
Polyimides
Coatings
Solvents
Dielectric Materials
Optical Films
Nitrogen
Electronics Packaging
Dielectric Films
Electronic Packaging Thermal Management
Thermal Stability
Electronic Packaging
Electrical Stability
Thermal Stability
Dielectric Thin Films
Solubility
Polymer Films
Packaging
Engineering
Soluble Polyimide Film
