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Processing and properties of new soluble polyimides

By: Kobayashi, M.; Ayukawa, H.; Givot, B.L.; Chien, B.; Bai, F.; Ezzell, S.A.; Aoki, S.;

2001 / IEEE / 0-7803-7038-4

Description

This item was taken from the IEEE Conference ' Processing and properties of new soluble polyimides ' A new family of polyimides have been developed which possess useful properties for the electronics packaging, optoelectronics, and imaging applications areas. Attributes of these materials include processing ease-to give films and coatings, dielectric characteristics, and thermal and electrical stability.