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Flip-chip bonding on 6-/spl mu/m pitch using thin-film microspring technology
1998 / IEEE / 0-7803-4526-6
This item was taken from the IEEE Conference ' Flip-chip bonding on 6-/spl mu/m pitch using thin-film microspring technology ' Bonding-pad densities on high-performance integrated-circuit chips are beginning to exceed the limits of available interconnect technologies. Also, stresses due to thermal mismatch in flip-chipped packages are reducing time to contact failure. We have addressed both of these problems by microlithographically fabricating highly elastic cantilever springs in linear arrays on pitches down to 6 /spl mu/m. We have soldered test arrays of 52 springs on this pitch to Si chips with 100% contact yield and good solder wetting to every spring. The fine-pitch capability also facilitates off-chip routing; the very high compliance of the springs should avoid thermal fatigue; and the low thermal conductance along the springs should allow fast-cycle soldering of chips to multichip modules as well as replacement of chips subsequently testing faulty.
Thin-film Microspring Technology
High-performance Ic Chips
Low Thermal Conductance
Integrated Circuit Packaging
Highly Elastic Cantilever Springs