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ASIC/MCM and microcircuit testing using commercial practices

By: Myers, M.; Miller, M.;

1996 / IEEE / 0-7803-3306-3


This item was taken from the IEEE Periodical ' ASIC/MCM and microcircuit testing using commercial practices ' Plastic Encapsulated Microelectronics (PEMs) components are used increasing numbers in military applications. Influencing factors are improving reliability, greater availability and Federal initiatives for use. This discussion focuses on efforts to introduce plastic encapsulated microcircuits to a highly complex, highly integrated military product. The emphasis is on reliability testing of these components. Reliability testing of PEM's for military applications has been somewhat limited in ""high-end"" devices and packages. This discussion focuses on testing of a wide range of die sizes including large die (/spl ges/0.5"" per side), and a wide range of packages, including large packages (up to 2""/spl times/2"" per side) for both custom and off-the-shelf commercial packages.