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High-Performance Polycrystalline Silicon TFT on the Structure of a Dopant-Segregated Schottky-Barrier Source/Drain
By: Jin-Woo Han; Sung-Jin Choi; Yang-Kyu Choi; Moongyu Jang; Dong-Il Moon; Sungho Kim;
2010 / IEEE
Description
This item was taken from the IEEE Periodical ' High-Performance Polycrystalline Silicon TFT on the Structure of a Dopant-Segregated Schottky-Barrier Source/Drain ' A high-performance polycrystalline silicon (poly-Si) thin-film transistor (TFT) with Schottky-barrier (SB) source/drain (S/D) junctions is proposed. A p-channel operation on the intrinsic nickel (Ni) silicided S/D was successfully realized with the aid of a thin active layer, despite the fact that the Ni silicided material shows a high SB height (SBH) for holes. Furthermore, for n-channel operation, the dopant-segregation technique implemented on the intrinsic Ni silicide was utilized to reduce the effective SBH for electrons. The results show a higher on-current due to the lower parasitic resistance as well as superior immunity against short-channel effects, compared to the conventional poly-Si TFT composed of p-n S/D junctions.
Related Topics
Schottky Barriers
Semiconductor Doping
Silicon
Silicon Alloys
P-n S/d Junctions
Polycrystalline Silicon Tft
Dopant-segregated Schottky-barrier Source/drain
Poly-si Thin-film Transistor
Schottky-barrier Source/drain Junctions
P-channel Operation
Intrinsic Nickel
N-channel Operation
Dopant-segregation Technique
Parasitic Resistance
Short-channel Effects
Conventional Poly-si Tft
Silicon
Thin Film Transistors
Nickel
Silicides
Immune System
P-n Junctions
Decision Support Systems
Moon
Schottky Barriers
Circuits
Thin-film Transistors (tfts)
Dopant-segregated Schottky Barrier (dssb)
Dopant Segregation (ds)
High Performance
Mosfet
Ni Silicide
Schottky Barrier (sb)
Thin Body
P-n Junctions
Nickel Alloys
Elemental Semiconductors
Thin Film Transistors
Components, Circuits, Devices And Systems
Engineered Materials, Dielectrics And Plasmas
Engineering
Silicided Material