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A poly-Si TFT fabricated by excimer laser recrystallization on floating active structure
By: Cheon-Hong Kim; Min-Koo Han; Woo-Jin Nam; In-Hyuk Song;
2002 / IEEE
Description
This item was taken from the IEEE Periodical ' A poly-Si TFT fabricated by excimer laser recrystallization on floating active structure ' This letter reports a. new excimer laser annealing (ELA) method to produce large polycrystalline silicon (poly-Si) lateral grains exceeding 4 /spl mu/m. A selectively floating amorphous silicon (a-Si) flint with a 50 nm-thick air-gap was irradiated by a single-pulse XeCl excimer laser and uniform lateral grains were grown due to the lateral thermal gradient caused by the low thermal conductivity of the air. A poly-Si thin-film transistor (TFT) with two high-quality 4.6 /spl mu/m-long lateral grains was fabricated by employing the proposed ELA and high field-effect mobility of 331 cm/sup 2//Vsec was obtained due to. the high-quality grain structure.
Related Topics
Silicon
Thin Film Transistors
Laser Beam Annealing
Thermal Conductivity
Carrier Mobility
Si
Polysilicon Tft
Excimer Laser Recrystallization
Floating Active Structure
Lateral Grains
Single-pulse Laser
Lateral Thermal Gradient
Thermal Conductivity
High Field-effect Mobility
High-quality Grain Structure
50 Nm
4.6 Micron
Thin Film Transistors
Thermal Conductivity
Substrates
Air Gaps
Annealing
Semiconductor Films
Grain Size
Laser Sintering
Temperature
Silicon
Elemental Semiconductors
Crystal Microstructure
Components, Circuits, Devices And Systems
Engineered Materials, Dielectrics And Plasmas
Engineering
Excimer Laser Annealing