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Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers
By: Bewley, W.W.; Lee, H.; Yang, M.J.; Meyer, J.R.; Aifer, E.H.; Olafsen, L.J.; Vurgaftman, I.; Stokes, D.W.; Felix, C.L.;
1999 / IEEE
This item was taken from the IEEE Periodical ' Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers ' The heat-sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II ""W"" lasers operating in the mid-infrared. Values <2.0 K/spl middot/cm/sup 2//kW were obtained for all temperatures in the range 140-220 K.
Optically Pumped Mid-infrared Lasers
Optically Pumped Semiconductor Lasers
Dpb-mounted Type-ii W Lasers
140 To 220 K
Quantum Well Lasers
Photonics And Electrooptics
Engineered Materials, Dielectrics And Plasmas
Diamond-pressure-bond Heat Sinking