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Author: Xiaoxiong Gu

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An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects
2012 / IEEE
By: Dickson, T.O.; Yong Liu; Rylov, S.V.; Bing Dang; Tsang, C.K.; Andry, P.S.; Friedman, D.J.; Ainspan, H.A.; Xiaoxiong Gu; Turlapati, L.; Beakes, M.P.; Parker, B.D.; Knickerbocker, J.U.; Bulzacchelli, J.F.;
Signal integrity: Efficient, physics-based via modeling: Integration of striplines
2012 / IEEE
By: Schuster, C.; de Paulis, F.; Selli, G.; Rimolo-Donadio, R.; Xiaoxiong Gu; Bruens, H.-D.; Drewniak, J.L.; Kwark, Y.H.;
An 8�0-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
2011 / IEEE / 978-1-61284-175-5
By: Turlapati, L.; Beakes, M.P.; Ainspan, H.A.; Bulzacchelli, J.F.; Xiaoxiong Gu; Andry, P.S.; Tsang, C.K.; Bing Dang; Rylov, S.V.; Yong Liu; Dickson, T.O.; Friedman, D.J.; Knickerbocker, J.U.; Parker, B.D.;
Parametric study on the effect of asymmetry in multi-channel differential signaling
2011 / IEEE / 978-1-4577-0811-4
By: Xiaoxiong Gu; Ki Jin Han; Jun Fan; Connor, S.R.; Kwark, Y.H.; Archambeault, B.; Dazhao Liu; Zhenwei Yu;
High-density silicon carrier transmission line design for chip-to-chip interconnects
2011 / IEEE / 978-1-4244-9401-9
By: Beakes, M.P.; Dickson, T.O.; Andry, P.S.; Tsang, C.K.; Knickerbocker, J.U.; Bing Dang; Turlapati, L.; Xiaoxiong Gu; Friedman, D.J.;
Decoupling capacitor modeling and characterization for power supply noise in 3D systems
2012 / IEEE / 978-1-4673-0351-4
By: Knickerbocker, J.; Webb, B.; Rose, K.; Scheuermann, M.; Jian-Qiang Lu; Putnam, C.; Xiaoxiong Gu; Zheng Xu;
Modeling of power delivery into 3D chips on silicon interposer
2012 / IEEE / 978-1-4673-1965-2
By: Webb, B.C.; Rose, K.; Scheuermann, M.; Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu; Knickerbocker, J.U.;
Efficient parametric modeling and analysis for backplane channel characterization
2012 / IEEE / 978-1-4673-1965-2
By: Cracraft, M.; Ki Jin Han; Xiaoxiong Gu; Kwark, Y.; Donadio, R.R.;
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
2012 / IEEE / 978-1-4673-1965-2
By: Rose, K.; Scheuermann, M.; Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu; Knickerbocker, J.U.; Webb, B.C.;
Full-wave analysis of microstrip line coupling and fast solution of multi-via scattering in PCBs
2004 / IEEE / 0-7803-8302-8
By: Leung Tsang; Xiaoxiong Gu; Kin Lun Lai; Chong-Jin Ong; Qin Li; Chung-Chi Huang; Houfei Chen;
Effects of random rough surface on absorption by conductors at microwave frequencies
2006 / IEEE
By: Braunisch, H.; Xiaoxiong Gu; Leung Tsang;
Modeling Effects of Random Rough Interface on Power Absorption Between Dielectric and Conductive Medium in 3-D Problem
2007 / IEEE
By: Xiaoxiong Gu; Braunisch, H.; Leung Tsang;
Off-Chip Rough-Metal-Surface Propagation Loss Modeling and Correlation with Measurements
2007 / IEEE / 1-4244-0984-5
By: Camacho-Bragado, A.; Xiaoxiong Gu; Braunisch, H.; Leung Tsang;
Estimation of Roughness-Induced Power Absorption From Measured Surface Profile Data
2007 / IEEE
By: Braunisch, H.; Leung Tsang; Xiaoxiong Gu;
Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media
2008 / IEEE
By: Boping Wu; Chong-Jin Ong; Xiaoxiong Gu; Leung Tsang;
Analysis and Optimization of the Recessed Probe Launch for High Frequency Measurements of PCB Interconnects
2008 / IEEE / 978-3-9810801-3-1
By: Xiaoxiong Gu; Schuster, C.; Rimolo-Donadio, R.; Ritter, M.B.; Kwark, Y.H.;
The viability of 25 Gb/s on-board signalling
2008 / IEEE / 978-1-4244-2230-2
By: Baks, C.; Boping Wu; Rimolo-Donadio, R.; Young Kwark; Dong Kam; John, R.; Xiaoxiong Gu; Pepeljugoski, P.; Ritter, M.B.; Schuster, C.; Lei Shan;
Eliminating via-plane coupling using ground vias for high-speed signal transitions
2008 / IEEE / 978-1-4244-2873-1
By: Xiaoxiong Gu; Schuster, C.; Xin Chang; Songping Wu; Jun Fan;
Impedance design for multi-layered vias
2008 / IEEE / 978-1-4244-2873-1
By: Xiaoxiong Gu; Ritter, M.B.; Ruehli, A.E.;
Is 25 Gb/s On-Board Signaling Viable?
2009 / IEEE
By: Pepeljugoski, P.K.; Kwark, Y.H.; Beukema, T.J.; Ritter, M.B.; Kam, D.G.; Boping Wu; Rimolo-Donadio, R.; Schuster, C.; Hougham, G.; Bulzacchelli, J.F.; John, R.A.; Baks, C.W.; Xiaoxiong Gu; Lei Shan;
Bandwidth Study of Recessed Probe Launch Variations for Broadband Measurement of Embedded PCB Structures
2009 / IEEE / 978-3-9812668-0-1
By: Rimolo-Donadio, R.; Kotzev, M.; Ritter, M.B.; Kwark, Y.H.; Xiaoxiong Gu; Schuster, C.;
Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
2009 / IEEE
By: Bruns, H.-D.; Jun Fan; Yaojiang Zhang; de Paulis, F.; Archambeault, B.; Schuster, C.; Kwark, Y.H.; Xiaoxiong Gu; Rimolo-Donadio, R.; Ritter, M.B.;
On adding metalization to improve via performance on PCBs
2009 / IEEE / 978-1-4244-4447-2
By: Xiaoxiong Gu; Ruehli, A.E.; Ritter, M.B.;
Fast full wave analysis of PCB via arrays with model-to-hardware correlation
2009 / IEEE / 978-1-4244-4447-2
By: Xiaoxiong Gu; Tsang, L.; Baks, C.; Boping Wu;
Model-to-hardware correlation of disk resonators for via-array modeling in high-speed PCBs
2009 / IEEE / 978-1-4244-4447-2
By: Xiaoxiong Gu; Kwark, Y.H.; Chada, A.R.; Jun Fan;
Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect Technologies
2010 / IEEE
By: Melde, K.L.; Krabbenhoft, R.S.; Deutsch, A.; Standaert, T.E.; Xiaoxiong Gu; Winkel, T.-M.; Surovic, C.W.; Kwark, Y.H.; Zhaoqing Chen; Zhen Zhou; Kopcsay, G.V.; Katopis, G.A.;
Efficient full-wave modeling of high density TSVs for 3D integration
2010 / IEEE / 978-1-4244-6412-8
By: Boping Wu; Xiaoxiong Gu; Leung Tsang; Ritter, M.;
Electrical and physical parametric study of high-speed link performance
2010 / IEEE / 978-1-4244-6867-6
By: Xiaoxiong Gu; Ritter, M.B.; Ki Jin Han;
Random Rough Surface Effects on Wave Propagation in Interconnects
2010 / IEEE
By: Braunisch, H.; Leung Tsang; Xiaoxiong Gu; Ruihua Ding;
Design and Modeling Methodology of Vertical Interconnects for 3DI Applications
2011 / IEEE
By: Goren, D.; Gordin, R.; Tyberg, C.; Xiaoxiong Gu; Fei Liu; Young, A.; Scheuermann, M.; Elad, D.; Shlafman, S.;
Parasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packaging
2011 / IEEE / 978-1-61284-409-1
By: Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu;
A through-silicon-via to active device noise coupling study for CMOS SOI technology
2011 / IEEE / 978-1-61284-498-5
By: Jonghyun Cho; Xiaoxiong Gu; Xiaomin Duan; Joungho Kim;
Novel multiport probing fixture for high frequency measurements in dense via arrays
2011 / IEEE / 978-1-61284-757-3
By: Kwark, Y.H.; Schuster, C.; Xiaoxiong Gu; Baks, C.; Kotzev, M.;

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