Your Search Results

Use materials by this author in your textbook!

AcademicPub holds over eight million pieces of educational content – such as case studies and journal articles – for you to mix-and-match your way.

Experience the freedom of customizing your course pack with AcademicPub!
Not an educator but still interested in using this content? No problem! Visit our provider's page to contact the publisher and get permission directly.

Author: Sprogis, E.

Results

Array diagnostic monitor-a DRAM technology development vehicle
1990 / IEEE
By: Newhart, R.E.; Richard, G.; Sprogis, E.; Paggi, M.;
Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver
2005 / IEEE / 0-7803-8907-7
By: Tsang, C.K.; Schuster, C.; Sprogis, E.; Rosner, J.; Magerlein, J.H.; Kwietniak, K.T.; Kwark, Y.H.; Krywanczyk, T.; Knickerbocker, J.U.; Horton, R.; Patel, C.S.; Edelstein, D.C.; Canaperi, D.F.; Andry, P.S.; Buchwalter, L.P.; Budd, R.; Baks, C.W.; Nyikal, H.; Doany, F.E.;
The SPT cell—A new substrate-plate trench cell for DRAMs
1985 / IEEE
By: Lu, N.; Cottrell, P.; Terman, L.; Sprogis, E.; Scheuerlein, R.; Parent, R.; Noble, W.; Ning, T.; Machesney, B.; Mohler, R.; Critchlow, D.; Dash, S.; Craig, W.;
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
2005 / IEEE / 0-7803-9023-7
By: Hua Gan; Horton, R.R.; Paivikki Buchwalter, L.; Tsang, C.K.; Andry, P.S.; Patel, C.S.; Knickerbocker, J.U.; Cordes, S.; Rosner, J.; Doany, F.; Sprogis, E.; Baks, C.; Schuster, C.; Wright, S.L.; Polastre, R.;
Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
2006 / IEEE / 1-4244-0152-6
By: Andry, P.S.; Horton, R.; Buchwalter, L.P.; Gan, H.; Polastre, R.; Wright, S.L.; Sprogis, E.; Sharma, A.; Lloyd, J.R.; Sri-Jayantha, M.S.; Knickerbocker, J.; Tsang, C.; Patel, C.;
Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization
2006 / IEEE / 1-4244-0152-6
By: Kang, S.K.; Pavlova, A.; Sprogis, E.; Knickerbocker, J.; Tsang, C.; Patel, C.; Lee, K.W.; Horton, R.; Buchwalter, L.P.; Polastre, R.; Wright, S.L.; Gan, H.; Andry, P.S.;
Bond Pad Optimization for CMOS Imager with Chip Scale Package
2006 / IEEE / 1-4244-0205-0
By: Gambino, J.; Guthrie, W.; Rassel, R.J.; Jaffe, M.; Maloney, J.J.; Adkisson, J.W.; Sprogis, E.; Stidham, M.;
Assembly, Characterization, and Reworkability of Pb-free Ultra-Fine Pitch C4s for System-on-Package
2007 / IEEE / 1-4244-0984-5
By: Tsang, C.K.; Andry, P.S.; Wright, S.L.; Dang, B.; Knickerbocker, J.U.; Sharma, A.; Patel, C.; Sprogis, E.; Zhang, G.; Webb, B.C.; Sakuma, K.; Horton, R.; Polastre, R.;
3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections
2007 / IEEE / 1-4244-0984-5
By: Maria, J.; Dang, B.; Andry, P.S.; Sakuma, K.; Knickerbocker, J.U.; Horton, R.; Tsang, C.K.; Kang, S.K.; Polastre, R.; Sprogis, E.; Webb, B.; Wright, S.L.; Patel, C.;
Characterization of stacked die using die-to-wafer integration for high yield and throughput
2008 / IEEE / 978-1-4244-2230-2
By: Andry, P.S.; Sakuma, K.; Knickerbocker, J.U.; Horton, R.; Polastre, R.; Sprogis, E.; Tsang, C.K.; Webb, B.C.; Wright, S.L.; Dang, B.; Patel, C.; Oyama, Y.; Sueoka, K.;
Reliability testing of through-silicon vias for high-current 3D applications
2008 / IEEE / 978-1-4244-2230-2
By: Andry, P.S.; Wright, S.L.; Polastre, R.J.; Dang, B.; Sprogis, E.;
3D chip stack with integrated decoupling capacitors
2009 / IEEE / 978-1-4244-4475-5
By: Wright, S.L.; Bing Dang; Knickerbocker, J.; Polastre, R.; Tsang, C.; Ketkar, S.; Sprogis, E.; Andry, P.;
Reliable through silicon vias for 3D silicon applications
2009 / IEEE / 978-1-4244-4492-2
By: Liptak, R.; Tsang, C.; Shapiro, M.; Dang, B.; Andry, P.; Interrante, M.; Griffith, J.; Knickerbocker, J.; Berger, D.; Truong, V.; Guerin, L.; Sprogis, E.;
Three-Dimensional Chip Stack With Integrated Decoupling Capacitors and Thru-Si Via Interconnects
2010 / IEEE
By: Andry, P.; Shapiro, M.; Bing Dang; Knickerbocker, J.; Berger, D.; Liptak, R.; Tsang, C.; Guerin, L.; Truong, V.; Griffith, J.; Interrante, M.; Wright, S.; Sprogis, E.;

Return To Top