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Author: Soon Wee Ho

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Microfabrication and Characterization of W-Band Planar Helix Slow-Wave Structure With Straight-Edge Connections
2011 / IEEE
By: Ciersiang Chua; Lei Wang; Zhongxiang Shen; Soon Wee Ho; Min Tang; Aditya, S.; Tsai, J.M.;
273-GHz 2X Subharmonic Up-Conversion Mixer for System-on-Package Applications
2012 / IEEE
By: Soon Wee Ho; Teck Guan Lim; Rui Li;
Enhancement of Silicon-Based Inductor Q-Factor Using Polymer Cavity
2012 / IEEE
By: Xiaowu Zhang; Yong-Zhong Xiong; Rui Li; Soon Wee Ho; Teck Guan Lim; Yee Mong Khoo;
Development of Via in Mold (ViM) for embedded wafer level package (EWMLP)
2011 / IEEE / 978-1-4577-1982-0
By: Daniel, F.M.; Myo Ei Pa Pa; Soon Wee Ho; Gao Shan; Wen Sheng Lee; Damaruganath, P.; Hyoung Joon Kim; Ser Choong Chong;
Development of 25-$\mu{\rm m}$ -Pitch Microbumps for 3-D Chip Stacking
2012 / IEEE
By: Jong Ming Ching; Kripesh, V.; Su, N.; Lau, J.H.; Hnin Wai Yin; Soon Wee Ho; Kumar, A.; Aibin Yu; Chen, C.; Chih-Ming Huang; Chin-Huang Chang; Chang-Yueh Chan; Khong Chee Houe; Chi-Hsin Chiu; Chun-Chieh Chao; Chien-Feng Chan; Chen, S.;
Development of coaxial shield via in silicon carrier for high frequency application
2006 / IEEE / 1-4244-0664-1
By: Qratti Kalandar Navas Khan; Vempati Srinivasa Rao; Soon Wee Ho; Kripesh, V.; Seung Uk Yoon;
A Systematic Underfill Selection Methodology for Fine Pitch Cu/Low-k FCBGA Package
2007 / IEEE / 978-1-4244-1324-9
By: Yeo, D.; Yeow Kheng Lim; Vaidyanathan, K.; Soon Wee Ho; Leong Ching Wai; Yue Ying Ong; Kai Chong Chan; Xuefen Ong; Zhong Chen; Liang Choo Hsia; Dong Kyun Sohn; Juan Boon Tan;
High RF performance TSV silicon carrier for high frequency application
2008 / IEEE / 978-1-4244-2230-2
By: Qiaoer Zhou; Seung Wook Yoon; Soon Wee Ho; Lau, J.H.; Kripesh, V.; Pasad, K.;
Development of Fine Pitch Solder Microbumps for 3D Chip Stacking
2008 / IEEE / 978-1-4244-2117-6
By: Aibin Yu; Cheng-Hsu Hsiao; Soon Wee Ho; Hnin Wai Yin; Lau, J.H.; Khong Chee Houe; Lim Pei Siang, S.; Xiaowu Zhang; Da-Quan Yu; Nandar Su; Chew Bi-Rong, M.; Jong Ming Ching; Tan Teck Chun; Kripesh, V.; Lee, C.; Jun Pin Huang; Chiang, J.; Chen, S.; Chi-Hsin Chiu; Chang-Yueh Chan; Chin-Huang Chang; Chih-Ming Huang; Kumar, A.;
Study of 15�m pitch solder microbumps for 3D IC integration
2009 / IEEE / 978-1-4244-4475-5
By: Dim-Lee Kwong; Pinjala, D.; Kripesh, V.; Ming Ching Jong; Da-Quan Yu; Aibin Yu; Kumar, A.; Soon Wee Ho; Lau, J.H.; Wai Yin Hnin;
Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
2009 / IEEE / 978-1-4244-4475-5
By: Chi-Hsin Chiu; Chih-Ming Huang; Chien-Feng Chan; Chen, S.; Pinjala, D.; Chun-Chieh Chao; Kripesh, V.; Jong Ming Ching; Hnin Wai Yin; Kumar, A.; Soon Wee Ho; Lau, J.H.; Yu, A.; Chen, C.;
3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections
2009 / IEEE / 978-1-4244-4475-5
By: Nandar Su; Soon Wee Ho; Tan Siow Pin; Hong Yu; Khan, N.; Wai Yin Hnin; Lau, J.H.; Toh Kok Chuan; Pinjala; Kripesh, V.;
Development of negative profile of dry film resist for metal lift off process
2009 / IEEE / 978-1-4244-5099-2
By: Kumar, R.; Premachandran, C.S.; Rao, V.S.; Liao, E.; Damaruganath, P.; Soon Wee Ho; Chew, M.; Su, N.;
Development of thin film dielectric embedded 3D stacked package
2009 / IEEE / 978-1-4244-5099-2
By: Su, N.; Soon Wee Ho; Rao, V.S.; Wen Sheng Lee; Siong Chiew Ong; Li Shiah Lim;
Design of wideband bandpass filters using Si-BCB technology for millimeter-wave applications
2010 / IEEE / 978-1-4244-6412-8
By: Pinjala, D.; Yong Zhong Xiong; Soon Wee Ho; Teck Guan Lim; Rui Li;
Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device
2010 / IEEE / 978-1-4244-8562-8
By: Soon Wee Ho; Khan, N.; Xiaowu Zhang; Khong, C.H.; Fenner, A.; Ying Ying Lim; Pinjala, D.; Kripesh, V.; Lim, S.; Leong Ching Wai;
3D stacking by hybrid bonding with low temperature solder
2010 / IEEE / 978-1-4244-8562-8
By: Wai Hong See Toh; Soon Wee Ho; Ling Xie; Ser Choong Chong; Paing Myo; Tai Chong Chai;
Double side redistribution layer process on embedded wafer level package for package on package (PoP) applications
2010 / IEEE / 978-1-4244-8562-8
By: Wen Sheng Lee; Wai Hong SeeToh; Li Yan Siow; Daniel, F.M.; Soon Wee Ho; Vempati, S.R.; Ser Choong Chong;
Embedding of 15um thin chip and passives in thin flexible substrate
2010 / IEEE / 978-1-4244-8562-8
By: Xiaowu Zhang; Soon, J.W.K.; Thew, S.; Soon Wee Ho; Sekhar, V.N.; Lim, Y.Y.; Hong, J.S.T.W.; Moses, F.D.; Myo Paing; Chong, S.C.; Rajoo, R.;
Packaging and testing of electro-magnetically actuated silicon micro mirror for Pico-projector applications
2010 / IEEE / 978-1-4244-8562-8
By: Baram, A.; Ser Choong Chong; Paing Myo; Ling Xie; Soon Wee Ho; Herer, I.; Wang, S.; Premachandran, C.S.; Wee, J.;
Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)
2011 / IEEE
By: Pinjala, D.; Ling Xie; Siong Chiew Ong; Soon Wee Ho; Premachandran, C.S.; Won Kyoung Choi; Dim-Lee Kwong; Selvanayagam, C.S.; Rajoo, R.; Xiaowu Zhang; Shan Gao; Yee Mong Khoo;
Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding
2011 / IEEE
By: Kumar, A.; Sharma, G.; Kripesh, V.; Soon Wee Ho; Rao, V.S.;
Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package
2011 / IEEE
By: Lau, J.H.; Lim Yeow Kheng; Vaidyanathan, K.; Xiaowu Zhang; Seung Uk Yoon; Ong, J.; Xuefen Ong; Sekhar, V.N.; Soon Wee Ho; Yue Ying Ong; Dong Kyun Sohn; Juan Boon Tan; Yanfeng Zhang; Kai Chong Chan; Yeo, D.;
Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
2011 / IEEE
By: Aibin Yu; Chen, C.; Soon Wee Ho; Kumar, A.; Wai Yin Hnin; Wen Sheng Lee; Ming Ching Jong; Sekhar, V.N.; Kripesh, V.; Pinjala, D.; Chen, S.; Chien-Feng Chan; Chun-Chieh Chao; Chi-Hsin Chiu; Chih-Ming Huang; Lau, J.H.;

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