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Author: Schmuckle, F.J.

Results

On parasitic coupling in CPW structures
2012 / IEEE / 978-3-9812668-4-9
By: Heinrich, W.; Schmuckle, F.J.; Doerner, R.; Gia Ngoc Phung;
The method of lines for the analysis of lossy planar waveguides
1990 / IEEE
By: Schmuckle, F.J.; Pregla, R.;
The method of lines for the analysis of planar waveguides with finite metallization thickness
1991 / IEEE
By: Schmuckle, F.J.; Pregla, R.;
The method of lines for the rigorous full wave analysis of rectangular bends of multiple-line-systems
1992 / IEEE / 0-7803-0611-2
By: Pregla, R.; Schmuckle, F.J.;
The method of lines for the analysis of rectangular spiral inductors (in MMICs)
1993 / IEEE
By: Schmuckle, F.J.;
Modelling of passive elements for coplanar SiGe MMIC's
1995 / IEEE / 0-7803-2581-8
By: Heinrich, W.; Schmuckle, F.J.; Rheinfelder, C.; Gerdes, J.; Strohm, K.; Luy, J.-F.; Doerner, R.; Schaffler, F.;
26 GHz coplanar SiGe MMICs
1996 / IEEE / 0-7803-3360-8
By: Luy, J.-F.; Schmuckle, F.J.; Gerdes, J.; Beisswanger, F.; Strohm, K.; Rheinfelder, C.; Heinrich, W.;
26 GHz coplanar SiGe MMICs
1996 / IEEE / 0-7803-3246-6
By: Beisswanger, F.; Strohm, K.; Rheinfelder, C.; Heinrich, W.; Luy, J.-F.; Schmuckle, F.J.; Gerdes, J.;
A coplanar 38-GHz SiGe MMIC oscillator
1996 / IEEE
By: Beisswanger, F.; Rheinfelder, C.N.; Heinrich, W.; Luy, J.F.; Strohm, K.M.; Schmuckle, F.J.; Gerdes, J.;
Coplanar passive elements on Si substrate for frequencies up to 110 GHz
1998 / IEEE
By: Heinrich, W.; Strohm, K.; Rheinfelder, C.; Schmuckle, F.J.; Gerdes, J.;
The advantage of thin film technique in the application of spiral inductors and couplers [MCM]
2001 / IEEE / 0-930815-64-5
By: Schmuckle, F.J.; Wolf, J.; Reichl, H.; Heinrich, W.; Kasap, T.; Petter, D.;
LTCC as MCM substrate: design of strip-line structures and flip-chip interconnects
2001 / IEEE / 0-7803-6538-0
By: Schmuckle, F.J.; Spinnler, M.; Butz, J.; Heinrich, W.; Jentzsch, A.;
Silicon micromachined RF MEMS resonators
2002 / IEEE / 0-7803-7239-5
By: Schauwecker, B.; Schmuckle, F.J.; Strohm, K.M.; Heinrich, W.; Luy, J.-F.;
W-band flip-chip interconnects on thin-film substrate
2002 / IEEE / 0-7803-7239-5
By: Riepe, K.; Oppermann, H.; Jentzsch, A.; Schmuckle, F.J.; Heinrich, W.;
3D silicon micromachined RF resonators
2003 / IEEE / 0-7803-7695-1
By: Heinrich, W.; Luy, J.-F.; Yaglioglu, O.; Schmuckle, F.J.; Strohm, K.M.;
40 GHz hot-via flip-chip interconnects
2003 / IEEE / 0-7803-7695-1
By: Schmuckle, F.J.; Jentzsch, A.; Gassler, C.; Marschall, P.; Geiger, D.; Heinrich, W.;
120 GHz broadband chip-interconnects for high bit-rate communication systems
2004 / IEEE / 0-7803-8331-1
By: Kunze, M.; Adam, K.; Ferling, D.; Heinrich, W.; Schmuckle, F.J.; Talukder, P.;
W-band flip-chip VCO in thin-film environment
2005 / IEEE / 0-7803-8845-3
By: Schmuckle, F.J.; Heinrich, W.; Riepe, K.; Topper, M.; Engelmann, G.; Oppermann, H.; Klein, M.; Hutter, M.; Lenk, F.;
A 24 GHz Active Antenna in Flip-Chip Technology with Integrated Frontend
2006 / IEEE / 0-7803-9541-7
By: Schmuckle, F.J.; Meliani, C.; Neuner, M.; Talukder, P.K.; Heinrich, W.;
A 30-GHz Waveguide-to-Microstrip-Transition
2007 / IEEE / 1-4244-0687-0
By: Heinrich, W.; Rostewitz, M.; Hirche, K.; Gross, W.; Schmuckle, F.J.;
Feeding structures for packaged multifinger power transistors
2007 / IEEE / 978-2-87487-001-9
By: Breitkreutz, B.; Heinrich, W.; Schmuckle, F.J.;
A 77 GHz broadband flip-chip transition on LTCC submount
2010 / IEEE / 978-1-4244-6058-8
By: Pursche, U.; Schmuckle, F.J.; Purden, J.; Heinrich, W.;

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