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Author: Scheuermann, M.

Results

Design, CAD and technology challenges for future processors: 3D perspectives

2011 / IEEE / 978-1-4503-0636-2
By: Puri, R.; Kursun, E.; Carpenter, G.; Burns, J.; Scheuermann, M.; Warnock, J.;

Decoupling capacitor modeling and characterization for power supply noise in 3D systems

2012 / IEEE / 978-1-4673-0351-4
By: Knickerbocker, J.; Webb, B.; Rose, K.; Scheuermann, M.; Jian-Qiang Lu; Putnam, C.; Xiaoxiong Gu; Zheng Xu;

Modeling of power delivery into 3D chips on silicon interposer

2012 / IEEE / 978-1-4673-1965-2
By: Webb, B.C.; Rose, K.; Scheuermann, M.; Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu; Knickerbocker, J.U.;

Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs

2012 / IEEE / 978-1-4503-1199-1
By: Scheuermann, M.; Xin Zhao; Sung Kyu Lim;

Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks

2012 / IEEE / 978-1-4673-1965-2
By: Rose, K.; Scheuermann, M.; Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu; Knickerbocker, J.U.; Webb, B.C.;

A high-speed silicon metal-semiconductor-metal photodetector fully integrable with (Bi)CMOS circuits

1991 / IEEE / 0-7803-0243-5
By: Bassous, E.; Iyer, S.S.; Halbout, J.-M.; Ritter, M.; Kesan, V.P.; Scheuermann, M.;

Effect of line resistance on picosecond optoelectronic probes and device characterization

1991 / IEEE
By: Scheuermann, M.;

Physical design of a fourth-generation POWER GHz microprocessor

2001 / IEEE / 0-7803-6608-5
By: Anderson, C.J.; Zoric, B.; Weitzel, S.; Weiss, R.; Wagoner, J.; Schmidt, S.; Scheuermann, M.; Runyon, S.; Restle, P.J.; Plum, G.; McCredie, B.; Pong-Fei Lu; LeBlanc, J.; Krauter, B.; Harvey, P.; Dudley, P.; DiLullo, J.; Clabes, J.; Chu, S.; Carter, C.; Tendier, J.M.; Nussbaum, G.; Warnock, J.; Keaty, J.M.; Petrovick, J.;

Observation of vortex structures in Josephson junctions by laser scanning

1983 / IEEE
By: Chen, J.; Kuo, P.; Scheuermann, M.; Lhota, J.;

Minority carrier transport in silicon

1986 / IEEE
By: Chen, T.C.; Scheuermann, M.; Fang, F.F.; Tang, D.D.; Sai-Halasz, G.;

Design and Modeling Methodology of Vertical Interconnects for 3DI Applications

2011 / IEEE
By: Goren, D.; Gordin, R.; Tyberg, C.; Xiaoxiong Gu; Fei Liu; Young, A.; Scheuermann, M.; Elad, D.; Shlafman, S.;

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