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Author: Oppermann, M.

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Advances on GaN based switch mode amplifiers for communication applications
2011 / IEEE / 978-2-87487-022-4
By: Oppermann, M.; Leberer, R.; Grabherr, W.; Chartier, S.; Reber, R.; Schmid, U.;
InAlGaN/GaN MMICs in microstrip transmission line technology for wideband applications
2011 / IEEE / 978-2-87487-023-1
By: Ambacher, O.; Oppermann, M.; Sledzik, H.; Schuh, P.; Quay, R.; Mikulla, M.; Waltereit, P.; Lim, T.; Kuhn, J.;
Packaging development for GaAs X-ray line detectors
2011 / IEEE / 978-1-4577-1982-0
By: Metasch, R.; Lohse, T.; Albrecht, O.; Oppermann, M.; Wolter, K.-J.; Zerna, T.;
Ultra-Wideband GaN MMIC Chip Set and High Power Amplifier Module for Multi-Function Defense AESA Applications
2013 / IEEE
By: Schmid, U.; Sledzik, H.; Seelmann-Eggebert, M.; Quay, R.; van Raay, F.; Bruckner, P.; Oppermann, M.; Schroth, J.; Schuh, P.;
Dynamical coupling of molecular rotation and Coulomb explosion
2013 / IEEE
By: Oppermann, M.; Weber, S. J.; Marangos, J. P.; Frasinski, L. J.;
Multichip-modules (MCMs) for micro- and millimeter-wave applications-a challenge?
1998 / IEEE / 0-7803-4850-8
By: Oppermann, M.;
Optimization of inspection strategies by use of quality cost models
2001 / IEEE / 0-7803-7038-4
By: Zerna, T.; Wohlrabe, H.; Sauer, W.; Oppermann, M.;
Optimization of inspection strategies by use of quality cost models and SPC
2001 / IEEE / 0-7803-7111-9
By: Oppermann, M.; Wohlrabe, H.; Sauer, W.;
Further training of human resources as a key factor for commercial success [packaging production]
2002 / IEEE / 0-7803-7430-4
By: Oppermann, M.; Detert, M.; Zerna, Th.;
Innovative self-study tools in microsystems packaging education at Dresden University of technology
2003 / IEEE / 0-7803-7791-5
By: Zema, T.; Sauer, W.; Wolter, K.; Oppermann, M.;
New quality cost models to optimize inspection strategies
2003 / IEEE
By: Sauer, W.; Oppermann, M.; Zerna, T.; Wohlrabe, H.;
New quality cost models to optimize inspection strategies [Abstracts of Forthcoming Manuscripts]
2003 / IEEE
By: Oppermann, M.; Sauer, W.; Wohlrabe, H.; Zerna, T.;
Process technology of electronics - a graduate textbook
2004 / IEEE / 0-7803-8365-6
By: Zerna, T.; Wolter, K.-J.; Sauer, W.; Oppermann, M.;
Best quality strategy for electronics production
2005 / IEEE / 0-7803-9325-2
By: Oppermann, M.; Sauer, W.;
20W GaN HPAs for Next Generation X-Band T/R-Modules
2006 / IEEE / 0-7803-9541-7
By: Adelseck, B.; Schuh, P.; Oppermann, M.; Sledzik, H.; Leberer, R.; Brugger, H.; Kiefer, R.; Quay, R.; Leier, H.; Behtash, R.;
Linear broadband GaN MMICs for Ku-band Applications
2006 / IEEE / 0-7803-9541-7
By: Kiefer, R.; Seelmann-Eggebert, M.; van Raay, F.; Quay, R.; Brugger, H.; Adelseck, B.; Bronner, W.; Schmidt, D.; Sledzik, H.; Leberer, R.; Schuh, P.; Oppermann, M.;
Advanced High Power Amplifier Chain for X-Band T/R-Modules based on GaN MMICs
2006 / IEEE / 2-9600551-8-7
By: Oppermann, M.; Schuh, P.; Sledzik, H.; Leberer, R.; Adelseck, B.; Weimann, G.; Mikulla, M.; Quay, R.; Brugger, H.;
Cost Efficient Quality Strategies for Microsystems and Electronics Production
2006 / IEEE / 1-4244-0552-1
By: Wolter, K.-J.; Sauer, W.; Oppermann, M.;
The Center for Non-Destructive Nano Evaluation of Electronic Packaging (nanoEVA), a New Research Facility in Dresden
2007 / IEEE / 978-1-4244-1217-4
By: Wolter, K.-J.; Oppermann, M.; Meyendorf, N.; Kruger, P.; Kohler, B.; Heuer, H.;
Electronics Packaging for High Reliable Piezoactuators
2007 / IEEE / 978-1-4244-1324-9
By: Wolter, K.-J.; Zerna, T.; Schuh, C.; Schonecker, A.; Lenk, A.; Oppermann, M.;
Nano Packaging - A challenge for Non-destructive Testing
2008 / IEEE / 978-1-4244-2117-6
By: Zema, T.; Oppermann, M.; Wolter, K.-J.;
GaN MMIC based T/R-Module Front-End for X-Band Applications
2008 / IEEE / 978-2-87487-007-1
By: Seelmann-Eggebert, M.; van Raay, F.; Quay, R.; Oppermann, M.; Leberer, R.; Kiefer, R.; Reber, R.; Sledzik, H.; Schuh, P.; Fleckenstein, A.; Mikulla, M.;
T/R-module technologies today and possible evolutions
2009 / IEEE / 978-2-912328-55-7
By: Fleckenstein, A.; Rieger, R.; Schuh, P.; Brugger, H.; Mussig, H.; Adelseck, B.; Oppermann, M.;
Packaging for radiation resistant X-ray detectors
2010 / IEEE / 978-1-4244-7850-7
By: Oppermann, M.; Lohse, T.; Wolter, K.; Seilmayer, M.; Zerna, T.; Metasch, R.;
GaN based power amplifiers for broadband applications from 2 GHz to 6 GHz
2010 / IEEE / 978-2-87487-017-0
By: Seelmann-Eggebert, M.; Reber, R.; Sledzik, H.; Quay, R.; Bunz, B.; Musser, M.; Oppermann, M.; Schuh, P.;
T/R-module technologies today and future trends
2010 / IEEE / 978-2-87487-016-3
By: Sledzik, H.; Schuh, P.; Oppermann, M.; Schweizer, B.; Fleckenstein, A.; Widmer, K.; Reber, R.;
GaN based power amplifiers for broadband applications from 2 GHz to 6 GHz
2010 / IEEE / 978-2-87487-016-3
By: Oppermann, M.; Reber, R.; Schuh, P.; Bunz, B.; Musser, M.; Sledzik, H.; Quay, R.; Seelmann-Eggebert, M.;
X-ray computed tomography for nano packaging - a progressive NDE method
2010 / IEEE / 978-1-4244-8562-8
By: Zerna, T.; Oppermann, M.; Wolter, K.;

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