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Author: Lim, Y.K.

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Wire bonding, bumping & assembly related failures & improvements
2011 / IEEE / 978-1-4577-0158-0
By: Hua, Y.N.; Yeo, A.; Tan, J.B.; Yuan, S.; Lim, Y.K.; Siah, S.Y.; Rao, N.R.;
Singapore Telecom's optical fibre network master plan
1992 / IEEE / 0-7803-0803-4
By: Lye, K.M.; Quah, S.H.; Lim, Y.K.;
The effect of some geometric and packaging process parameters on die metallization failure
1995 / IEEE / 0-7803-2797-7
By: Lim, Y.K.; Ong, S.H.; Tay, A.A.O.;
Mechanism for Asian dust transport during blocking episode days in east Asia and North America in spring 2001
2002 / IEEE / 0-7803-7536-X
By: Bae, J.H.; Moon, Y.S.; Lee, H.W.; Kim, Y.K.; Strong, K.; Song, S.K.; Oh, I.B.; Lim, Y.K.;
Density modulation of the thin slab beam over a metal grating
2003 / IEEE / 0-7803-7911-X
By: Sung Oh Cho; Lee, H.J.; Lim, Y.K.; Young Uk Jeong; Byung Cheol Lee;
The LED lightbulb: are we there yet? progress and challenges for solid state illumination
2003 / IEEE / 1-55752-748-2
By: Fletcher, R.M.; Collins, D.; Mueller, G.O.; Mueller-Mach, R.; Holcomb, M.O.; Steigerwald, D.A.; Martin, P.S.; Krames, M.; Lim, Y.K.; Eberle, S.;
A study of SiN cap NH/sub 3/ plasma pre-treatment process on the PID, EM, GOI performance and BEOL defectivity in Cu dual damascene technology
2004 / IEEE / 0-7803-8528-4
By: Tan, T.H.S.; Ko, L.H.; Chua, C.S.; Lim, Y.K.; Goh, L.N.L.; Toh, S.L.; Yap, A.K.L.; Lu, W.H.; Ang, C.H.; Goh, L.C.; Hsia, L.C.;
Stress-induced voiding in multi-level copper/low-k interconnects
2004 / IEEE / 0-7803-8315-X
By: Seet, C.S.; Lim, Y.H.; Lim, Y.K.; Pey, K.L.; Zhang, B.C.; Hsia, L.C.; Lee, T.J.; See, K.H.; Chok, K.L.;
Stress-induced voiding beneath vias with wide copper metal leads
2004 / IEEE / 0-7803-8454-7
By: Pey, K.L.; Lee, T.J.; See, A.; Kamat, N.R.; Lim, Y.H.; Lim, Y.K.;
Domain-specific concept-based information retrieval system
2004 / IEEE / 0-7803-8519-5
By: Loh, H.T.; Lim, Y.K.; Shen, L.;
Integration and reliability of a manufacturable 130nm dual damascene Cu/low-k process
2004 / IEEE / 0-7803-8511-X
By: Bu, X.M.; Perera, C.; Siew, Y.K.; Tan, D.; Zhang, F.; Chong, D.; Lee, T.J.; Sun, S.C.; Lim, Y.K.; Vigar, D.;
Stress migration reliability of wide Cu interconnects with gouging vias
2005 / IEEE / 0-7803-8803-8
By: Vigar, D.; Lee, T.J.; Seet, C.S.; Tan, C.M.; Pey, K.L.; Arijit, R.; Lim, Y.K.;
Novel dielectric slots in Cu interconnects for suppressing stress-induced void failure
2005 / IEEE / 0-7803-9268-X
By: Lee, T.J.; Tan, J.B.; Pey, K.L.; Lim, Y.K.; Vigar, D.; Kamat, N.R.; Lim, Y.H.; Hsia, L.C.;
Preliminary Sea-trial of the Deep-sea Unmanned Underwater Vehicles HEMIRE and HENUVY
2006 / IEEE / 1-4244-0114-3
By: Kim, K.; Li, J.H.; Lim, Y.K.; Kim, D.J.; Cho, S.K.; Park, D.W.; Lee, J.W.; Gu, B.M.; Chung, H.S.; Park, C.S.; Yoon, S.J.; Seo, M.W.; Han, S.C.; Seo, Y.W.; Hong, S.W.; Choi, H.T.; Lee, C.M.; Jun, B.H.; Lee, P.M.;
Design for Manufacturability and its Role in Enhancing Stress Migration Reliability of Porous Ultra Low-k Copper Interconnects
2007 / IEEE / 1-4244-0918-7
By: Lim, Y.K.; Hsia, L.C.; Fu, T.; Tan, J.B.; Kamat, N.R.; Lee, Y.H.; Lee, P.S.; Pey, K.L.;
Design for Manufacturability in Backend Reliability and Packaging of Nanoscale Technologies
2007 / IEEE / 1-4244-1069-X
By: Fu, T.; Yeo, Y.H.; Chua, E.C.; Pey, K.L.; Tan, J.B.; Lim, Y.K.; Hsia, L.C.;
Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
2008 / IEEE / 978-1-4244-2230-2
By: Ong, J.M.G.; Sohn, D.K.; Tan, J.B.; Lim, Y.K.; Kripesh, V.; Zhang, X.; Tay, A.A.O.;
TDDB robustness of highly dense 65NM BEOL vertical natural capacitor with competitive area capacitance for RF and mixed-signal applications
2008 / IEEE / 978-1-4244-2049-0
By: Tan, J.B.; Keller, W.W.; Chua, E.C.; Zhang, B.C.; Pompl, T.; Riess, P.; Klee, V.; Fischer, A.H.; von Glasow, A.; Sohn, D.K.; Lim, Y.K.; Souche, D.; Tan, Y.C.;
Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package
2008 / IEEE / 978-1-4244-2117-6
By: Ong, Y.Y.; Sohn, D.K.; Ho, S.W.; Sekhar, V.N.; Jong, M.C.; Wai, L.C.; Rao, V.S.; Sheng, V.; Ong, J.; Ong, X.; Zhang, X.; Seung, Y.U.; Lau, J.; Lim, Y.K.; Yeo, D.; Chan, K.C.; Yanfeng, Z.; Tan, J.B.; Vaidyanathan, K.;
The effects of dielectric slots on Copper/Low-k interconnects reliability
2009 / IEEE / 978-1-4244-4492-2
By: Hsia, L.C.; Sohn, D.K.; Tan, J.B.; Liu, W.; Pey, K.L.; Lim, Y.K.; Heryanto, A.;
Effect of chemical mechanical polishing scratch on TDDB reliability and its reduction in 45nm BEOL process
2009 / IEEE / 978-1-4244-2888-5
By: Zhang, B.C.; Chen, C.Q.; Zhang, F.; Zhang, W.Y.; Tan, J.B.; Lim, Y.K.; Liu, W.; Hsia, L.C.; Sohn, D.K.;
A novel methodology to analyze time-dependent dielectric breakdown failure mechanism of copper/low-k interconnects
2009 / IEEE / 978-1-4244-3911-9
By: Lim, Y.K.; Tong, Y.; Hsia, L.C.; Sohn, D.K.; Tan, J.B.; Zhang, W.Y.; Chen, C.Q.;
Study of upstream electromigration bimodality and its improvement in Cu low-k interconnects
2010 / IEEE / 978-1-4244-5429-7
By: Zhao, Y.H.; Liu, H.; Zhang, F.; Lim, Y.K.; Zhang, B.C.; Du, A.Y.; Hsia, L.C.; Sohn, D.K.; Tan, J.B.; Liu, W.;
Study of stress migration and electromigration interaction in copper/low-� interconnects
2010 / IEEE / 978-1-4244-5429-7
By: Pey, K.L.; Heryanto, A.; Sohn, D.K.; Tan, J.B.; Lim, Y.K.; Raghavan, N.; Wei, J.; Liu, W.;

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