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Author: Jian-Qiang Lu

Results

Three-Dimensional Coaxial Through-Silicon-Via (TSV) Design
2012 / IEEE
By: Zheng Xu; Jian-Qiang Lu;
Evaluation of fabrication process for a novel Chip-to-Wafer (C2W) 3D integration approach using an alignment template
2012 / IEEE / 978-1-4673-0351-4
By: Jian-Qiang Lu; Dingyou Zhang;
Decoupling capacitor modeling and characterization for power supply noise in 3D systems
2012 / IEEE / 978-1-4673-0351-4
By: Knickerbocker, J.; Webb, B.; Rose, K.; Scheuermann, M.; Jian-Qiang Lu; Putnam, C.; Xiaoxiong Gu; Zheng Xu;
Modeling of power delivery into 3D chips on silicon interposer
2012 / IEEE / 978-1-4673-1965-2
By: Webb, B.C.; Rose, K.; Scheuermann, M.; Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu; Knickerbocker, J.U.;
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
2012 / IEEE / 978-1-4673-1965-2
By: Rose, K.; Scheuermann, M.; Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu; Knickerbocker, J.U.; Webb, B.C.;
Terahertz detector utilizing two-dimensional electronic fluid
1998 / IEEE
By: Liangquan Sun; Hesler, J.L.; Shur, M.S.; Jian-Qiang Lu; Weikle, R.;
Heterodimensional field effect transistors for ultra low power applications
1998 / IEEE / 0-7803-5049-9
By: Jian-Qiang Lu; Shur, M.S.; Peatman, W.C.B.; Hurt, M.J.;
A resonant terahertz detector utilizing a high electron mobility transistor
1998 / IEEE / 0-7803-4774-9
By: Hesler, J.L.; Shur, M.S.; Jian-Qiang Lu; Weikle, R., II; Liangquan Sun;
Modeling and simulation of single- and multiple-gate 2D MESFETs
1999 / IEEE
By: Peatman, W.C.B.; Hurt, M.J.; Jian-Qiang Lu; Iniguez, B.; Shur, M.S.;
Terahertz applications of plasma wave electronics
1999 / IEEE / 0-7803-5135-5
By: Dyaakonov, M.I.; Jian-Qiang Lu; Shur, M.S.;
Conducting laboratory experiments over the Internet
1999 / IEEE
By: Jian-Qiang Lu; Fjeldly, T.A.; Shur, M.S.; Strom, O.; Ytterdal, T.; Dalager, B.; Zheng Xu; Hong Shen; Kristiansen, V.;
Terahertz sources and detectors using two-dimensional electronic fluid in high electron-mobility transistors
2000 / IEEE
By: Shur, M.S.; Jian-Qiang Lu;
Experiences in developing a research-focused project course: IP-core based IC design enabled by 3D wafer bonding
2001 / IEEE / 0-7695-1156-2
By: Jian-Qiang Lu; Gutmann, R.J.;
Modeling Thermal Stresses in 3-D IC Interwafer Interconnects
2006 / IEEE
By: Jing Zhang; Bloomfield, M.O.; Jian-Qiang Lu; Gutmann, R.J.; Cale, T.S.;
Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits
2006 / IEEE / 1-4244-0438-X
By: Tsang, C.K.; Andry, P.S.; Sang Hwui Lee; Kuan-Neng Chen; Haensch, W.; Topol, A.W.; Meikei Ieong; Young, A.M.; Jian-Qiang Lu; Yu-Ming Lin;
Fabrication and Electrical Characterization of Densified Carbon Nanotube Micropillars for IC Interconnection
2009 / IEEE
By: Kar, S.; Lijie Ci; Zhengchun Liu; Jian-Qiang Lu; Ajayan, P.M.;
Fully Monolithic Cellular Buck Converter Design for 3-D Power Delivery
2009 / IEEE
By: Gutmann, R.J.; Chow, T.P.; Jian-Qiang Lu; Devarajan, S.; Giuliano, D.; Jian Sun;
3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems
2009 / IEEE
By: Jian-Qiang Lu;
Architecture design exploration of three-dimensional (3D) integrated DRAM
2009 / IEEE / 978-1-4244-2952-3
By: Jian-Qiang Lu; Hongbin Sun; Anigundi, R.; Tong Zhang; Rose, K.;
3D DRAM Design and Application to 3D Multicore Systems
2009 / IEEE
By: Hongbin Sun; Tong Zhang; Rose, K.; Jian-Qiang Lu; Nanning Zheng; Anigundi, R.S.; Jibang Liu;
Modeling and evaluation for electrical characteristics of through-strata-vias (TSVS) in three-dimensional integration
2009 / IEEE / 978-1-4244-4511-0
By: Tong Zhang; Rose, K.; Beece, A.; Zheng Xu; Jian-Qiang Lu;
Impacts of though-DRAM vias in 3D processor-DRAM integrated systems
2009 / IEEE / 978-1-4244-4511-0
By: Rose, K.; Qi Wu; Tong Zhang; Jian-Qiang Lu;
High-Speed Design and Broadband Modeling of Through-Strata-Vias (TSVs) in 3D Integration
2011 / IEEE
By: Zheng Xu; Jian-Qiang Lu;
Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network
2010 / IEEE / 978-1-4577-0527-4
By: Zheng Xu; Jian-Qiang Lu; Rose, K.; Kuan-neng Chen; Qianwen Chen; Dingyou Zhang; Beece, A.;
Demonstration and Electrical Performance Investigation of Wafer-Level Cu Oxide Hybrid Bonding Schemes
2011 / IEEE
By: Zheng Xu; Kuan-Neng Chen; Jian-Qiang Lu;
Parasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packaging
2011 / IEEE / 978-1-61284-409-1
By: Xiaoxiong Gu; Zheng Xu; Jian-Qiang Lu;
Electromagnetic-SPICE modeling and analysis of 3D power network
2011 / IEEE / 978-1-61284-498-5
By: Zheng Xu; Knickerbocker, J.U.; Webb, B.C.; Jian-Qiang Lu;
Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging
2011 / IEEE
By: Jian-Qiang Lu; Zheng Xu;

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