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Topic: Finite Element Modeling

Results

Piezoresistive Strain Sensors and Multiplexed Arrays Using Assemblies of Single-Crystalline Silicon Nanoribbons on Plastic Substrates

2011 / IEEE
By: Ameen, A.; Hoon-Sik Kim; Sang Min Won; Rogers, J.A.; Nanshu Lu; Duenas, T.; Del Solar, C.; Dae-Gon Kim;

Predicting Target Displacements Using Ultrasound Elastography and Finite Element Modeling

2011 / IEEE
By: Hansen, H.H.G.; op den Buijs, J.; Misra, S.; de Korte, C.L.; Lopata, R.G.P.;

Computation of Second Order Capacitance Sensitivity Using Adjoint Method in Finite Element Modeling

2012 / IEEE
By: Xiaoyu Xu; Hui Qu; Zhuoxiang Ren;

Core Tester Iron Losses Segregation by Finite Element Modeling

2012 / IEEE
By: Schlegel, J.P.; Espindola, A.A.; Bastos, J.P.A.; Iamamura, B.A.T.; Batistela, N.J.; Sadowski, N.;

Design, Modeling, and Analysis of a Compact Planar Transformer

2012 / IEEE
By: Djuric, S.; Stojanovic, G.; Radovanovic, M.; Laboure, E.; Damnjanovic, M.;

Real Time 3D Visualization of Intraoperative Organ Deformations Using Structured Dictionary

2012 / IEEE
By: Dan Wang; Tewfik, A.H.;

Kalman Filtered MR Temperature Imaging for Laser Induced Thermal Therapies

2012 / IEEE
By: Weinberg, J.S.; Hazle, J.D.; Yung, J.; Fuentes, D.; Stafford, R.J.;

Finite Element Modeling of Writer Head Design for Shingled Recording

2012 / IEEE
By: Wang, J.; Bai, D.Z.; Wang, L.;

1-G HTS Split Coil Magnet for Research Purposes

2012 / IEEE
By: Vysotsky, V.S.; Mukhanov, S.V.; Radchenko, I.P.; Zubko, V.V.; Fetisov, S.S.;

Thermal and Mechanical Considerations for Silicon-Resin High-Density Substrate

2012 / IEEE
By: Thompson, J.; Kwok, P.; Smith, B.; Racz, L.; Mueller, A.;

Finite Element Modeling and Analysis of Surface Acoustic Wave Devices in CMOS Technology

2012 / IEEE
By: Tigli, O.; Zaghloul, M.E.;

Thin-Film Piezoelectric MEMS Transducer Suitable for Middle-Ear Audio Prostheses

2012 / IEEE
By: Camargo, C.J.; Campanella, H.; Esteve, J.; Urquiza, R.; Daza, A.; Lopez Garcia, J.;

Bulk modes in silicon crystal silicon

2011 / IEEE / 978-1-61284-112-0
By: Ayazi, F.; Pourkamali, S.; Ho, G.K.;

Finite element modeling for microwave tomography

2011 / IEEE / 978-1-4244-9563-4
By: Attardo, E.A.; Vecchi, G.; Meaney, P.M.; Borsic, A.;

Fully overlapping domain decomposition method with h-refinement for finite element modeling of small features in large domains

2011 / IEEE / 978-1-4244-9563-4
By: Sertel, K.; Tao Peng; Volakis, J.L.;

Evaluation of inductance in a permanent magnet synchronous motor

2011 / IEEE / 978-1-4577-0061-3
By: Islam, M.; Gebregergis, A.; Ramakrishnan, R.; Sebastian, T.;

Finite element modeling of plasmon based single-photon sources

2011 / IEEE / 978-1-61284-878-5
By: Mork, J.; Lodahl, P.; Nielsen, T.R.; Gregersen, N.; Yuntian Chen;

Low frequency pulsating emissions from space vector PWM drives

2011 / IEEE / 978-1-61284-247-9
By: Enohnyaket, M.;

Finite element modeling on thermal fatigue of BGA solder joints with multiple voids

2011 / IEEE / 978-1-4577-2112-0
By: Meyer, S.; Schwerz, R.; Wolter, K.; Meier, K.; Roellig, M.;

Convergence of a fully overlapping domain decomposition method

2011 / IEEE / 978-1-4244-6051-9
By: Sertel, K.; Tao Peng; Volakis, J.L.;

Dynamic model of shipborne ultrasonic liquid level transducer and its simulation

2011 / IEEE / 978-1-4244-8165-1
By: Hao Wang; Chao-jie Zhang; Ting-feng Ming; Guo He;

Design of an experimental test stand for the study of liquid lithium film stability

2011 / IEEE / 978-1-4577-0668-4
By: Ramos, G.; Nieto-Perez, M.;

Investigations of solder ball drop reliability: BGA versus WLP

2011 / IEEE / 978-1-4577-1769-7
By: Xuejun Fan; Ranouta, A.S.;

Failure analysis of thick film resistors on stainless steel as sensing elements

2011 / IEEE / 978-1-4577-1769-7
By: Zongyang Zhang; Sheng Liu; Simin Wang; Zhimin Wan;

Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards

2011 / IEEE / 978-2-35500-016-4
By: Wittler, O.; Schacht, R.; Nowak, T.; Lang, K.-D.; Walter, H.; May, D.; Ras, M.A.; Wunderle, B.;

Parameters influence in steel corrosion evaluation using PEC thermography

2011 / IEEE / 978-1-86218-098-7
By: Yunze He; Jackson, P.; Hong Zhang; Liang Cheng; Guiyun Tian;

Influence of substrate on electrical conductivity of isotropic conductive adhesive

2011 / IEEE / 978-1-4673-0149-7
By: Lilei Ye; Cong Yue; Wenhui; Zhili Hu; Liu, J.; Zhichao Yuan;

Sensitivity analysis of silicon MEMS Thermal Flow Sensor for spirometer application

2011 / IEEE / 978-1-4577-1166-4
By: Hariadi, I.;

Global uncertainty analysis of solder joint fatigue life model in random vibration environment

2011 / IEEE / 978-1-4577-1389-7
By: Mei-Ling Wu; Ching-Yuan Kao;

Effective moduli prediction for silicon interposer with high-density Cu-filled through-silicon via

2011 / IEEE / 978-1-4577-1389-7
By: Chih-Sheng Wu; Yan-Shin Shih; Chang-Chun Lee;

Finite Element Modeling of Bone by Using Hydroxyapatite As Bioactive Nanomaterial in Bone Grafting, Bone Healing and the Reduction of Mechanical Failure in the Bone Surgery

2011 / IEEE / 978-1-4577-2037-6
By: Reddy, C.M.; Maheswaramma, K.S.; Reddy, E.K.; Reddy, B.R.B.;

Finite element modeling of two different CNT/polymer composites: CNT/PMMA and CNT/PmPV

2011 / IEEE / 978-1-4577-2141-0
By: Keyvani, P.; Nickkholgh, A.;

Characterization of a bionic electrolocation sensor using finite element modeling

2011 / IEEE / 978-1-4244-9289-3
By: Bousack, H.; Damalla, D.; von der Emde, G.; Gottwald, M.; Mayekar, K.;

A Cr-Ni thermoelectric MEMS energy harvester for low profile applications

2011 / IEEE / 978-1-4673-0465-8
By: Kulah, H.; Zorlu, O.; Topal, E.T.; Muhtaroglu, A.;

Finite element modeling of current-induced filaments in nanocrystalline silicon

2011 / IEEE / 978-1-4577-1756-7
By: Gokirmak, A.; Silva, H.; Williams, N.; Osorio, C.; Fischer, S.;

Self-exciting and self-sensing resonant cantilever sensors for improved monitoring of airborne nanoparticles exposure

2011 / IEEE / 978-1-4244-9289-3
By: Uhde, E.; Waag, A.; Merzsch, S.; Doering, L.; Wasisto, H.S.; Peiner, E.;

The influence of partial volume effect on the finite element modeling of bone

2011 / IEEE / 978-1-61284-704-7
By: Xiaoxi Guo; Lijun Chen; Yongjun Chen; Shaohui Huang; Shaoyin Duan; Boliang Wang;

Fine pitch flip chip chip scale packaging

2011 / IEEE / 978-0-9568086-0-8
By: Chung, H.; Appelt, B.K.; Wang, R.; Chienfan Chen;

Dynamic model of a cylindrical ionic polymer-metal composite actuator

2011 / IEEE / 978-1-4577-0723-0
By: Realmuto, J.; Gutta, S.; Kim, K.J.; Woosoon Yim;

Development of energy absorbing refuge island using crash simulation

2011 / IEEE / 978-1-4577-1701-7
By: Yonggang Tai; Jian Rong; Xiaoduan Sun; Yujuan Sun;

Finite element modeling of multi-walled carbon nanotubes under axial tension

2012 / IEEE / 978-1-4577-0798-8
By: Awang, M.; Mohammadpour, E.;

Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits

2011 / IEEE / 978-1-4577-1982-0
By: De Wolf, I.; Beyne, E.; Cherman, V.; Van der Plas, G.; Vandepitte, D.; Rebibis, K.J.; Vandevelde, B.; Ivankovic, A.; La Manna, A.;

Parameterized model order reduction for fast transient electromagnetic simulations

2012 / IEEE / 978-1-4673-0449-8
By: Mashuq-un-Nabi; Bazaz, M.A.; Janardhanan, S.;

FEM-predicted regional tissue strains aligned with the white matter tracts predict axonal injury

2012 / IEEE / 978-1-4673-1142-7
By: Eucker, S.A.; Sullivan, S.; Hashmi, S.K.; Margulies, S.S.; Lee, J.; Coats, B.;

Finite element HIFU transducer acoustic field modeling evaluation with measurements

2012 / IEEE / 978-1-4673-1134-2
By: Vera, A.; Martinez, R.; Leija, L.;

Modeling for critical design and performance of wafer level chip scale package

2012 / IEEE / 978-1-4673-1965-2
By: Yong Liu; Kinzer, D.; Jihwan Kim; Ring, M.; Qiuxiao Qian;

Finite element modeling of anomalous moisture diffusion with dual stage model

2012 / IEEE / 978-1-4673-1965-2
By: Nagaraj, V.; Xuejun Fan;

Two-step reduction procedure for parametric transient electromagnetic computations

2012 / IEEE / 978-0-9567157-1-5
By: Bazaz, Mohammad Abid; Janardhanan, S.; Mashuq-un-Nabi;

Studies of ${\rm Nb}_{3}{\rm Sn}$ Strands Based on the Restacked-Rod Process for High Field Accelerator Magnets

2012 / IEEE
By: Yamada, R.; Turrioni, D.; Lombardo, V.; Gallo, G.; Bossert, M.; Barzi, E.; Zlobin, A.V.;

Mechanical characterization of a Au coated carbon nanotube multi-layered structure

2014 / IEEE
By: Pu, Suan Hui; McBride, John W.; Liu, Hong; Jiang, Liudi; Down, Michael P.;

Magnetic flux density measurement in permanent magnet synchronous machines

2014 / IEEE
By: Saadoun, A.; Amirat, Y.;

Determination of material properties and failure using in-situ thermo-mechanical probe

2014 / IEEE
By: Montmitonnet, P.; Blayac, S.; Di-Giacomo, A.; Fornara, P.; Rivero, C.; Orellana, S.; Arrazat, B.; Inal, K.;

Non-destructive testing of steel sample by non-stationary thermal wave imaging

2015 / IEEE
By: Arora, Vanita; Subbarao, Ghali Venkata; Mulaveesala, Ravibabu;

Finite element modeling and analysis of thrombosis in middle cerebral artery

2014 / IEEE
By: Kouzani, Abbas Z.; Hasan, Md. Maodudul; Hossain, Md. Faruque; Jahan, Md. Sarwar;

FEM-Based Generation of Stiffness Maps

2015 / IEEE
By: Chapelle, F.; Mekaouche, A.; Balandraud, X.;

Analysis and Neutral Voltage-Based Detection of Interturn Faults in High-Speed Permanent-Magnet Machines With Parallel Strands

2015 / IEEE
By: Veltman, A.; Ferreira, J.A.; Polinder, H.; van der Geest, M.; Tsiara, N.; Wolmarans, J.J.;

Investigation of silicon stress around through silicon vias by high efficiency micro-Raman microscopy

2013 / IEEE
By: Daquan, Yu; Xiangmeng, Jing; Meiying, Su; Fengwei, Dai; Hongwen, He;

Homogenization schemes for TSV interposer packages

2014 / IEEE
By: Fei, Qin; Xiaorui, Bie; Si, Chen; Ying, Shen;

Modeling and simulation of inductive structures for non-invasive medical uses

2013 / IEEE
By: Mihailescu, B.; Marghescu, C.; Svasta, P.; Plotog, I.;

Simulation-based analysis of probe-type electrostatic sensors' spatial dynamic sensitivity

2014 / IEEE
By: Tang Xin; Yang Yongmin; Hu Zheng; Chen Zhongsheng; Li Yue;

A comparison between turn-off time of 4H-SiC and silicon power thyristor having the same breakdown voltage 5kV

2013 / IEEE
By: Besbes, Kamel; Garrab, Hatem; Jedidi, Atef;

Homogenization schemes for TSV interposer packages

2014 / IEEE
By: Xiaorui, Bie; Si, Chen; Ying, Shen; Fei, Qin;

Tibio-tarsal joint biomechanics analisys through Finite Element Modeling: A static loading model of the human tibio-tarsal joint

2014 / IEEE
By: Doru-Alexandru, Tofan; Gheorghe, Tomoaia;

Computation of magnetostatic field using second order edge elements in 3D

1999 / Emerald Publishing
By: N. Ida; Z. Ren;

Modeling of electrostatic fields in solid propellants using finite element techniques

1989 / IEEE
By: Curry, J.D.; SunderRaj, V.R.D.; Larson, R.W.;

Natural frequencies of sliders and transducers used to detect slider-disk contacts

1989 / IEEE
By: Bogy, D.B.; Jeong, T.G.;

Higher order asymptotic boundary condition for the finite element modeling of two-dimensional transmission line structures

1990 / IEEE
By: Mittra, R.; Kouki, A.B.; Khebir, A.;

A comprehensive approach for the analysis of package induced stress in ICs using analytical and empirical methods

1991 / IEEE
By: Pendse, R.D.;

Finite element modeling from CT scan data

1991 / IEEE / 0-7803-0030-0
By: Nowak, M.D.; Lewis, C.G.; Diemente, S.; Leone, D.J.;

Thermal analysis and modelling of a copper-polyimide thin-film-on-silicon multichip module packaging technology

1992 / IEEE / 0-7803-0500-0
By: Snyder, D.W.;

Structural design of the Tore Supra Phase III limiter head

1991 / IEEE / 0-7803-0132-3
By: Dempsey, J.F.; Watson, R.D.; Koski, J.A.;

A perturbation method for finite element modeling of piezoelectric vibrations in quartz plate resonators

1993 / IEEE
By: Zhang, Z.; Yong, Y.-K.;

Applications of potentials to finite element modeling of Maxwell's equations

1993 / IEEE
By: Minerbo, G.N.; Boyse, W.E.; Lynch, D.R.; Paulsen, K.D.;

Analysis of triboelectric charging of launch vehicle fairings

1990 / IEEE / 0-7803-7264-6
By: Shaw, R.L.; Holland, R.G.;

A novel ultrasonic array incorporating composite transducer technology

1992 / IEEE / 0-7803-0562-0
By: Powell, D.J.; Hayward, G.;

Adaptive approach to finite element modelling of corona fields

1994 / IEEE
By: Adamiak, K.;

A computer-aided tool for multichip module package design

1994 / IEEE / 0-7803-1850-1
By: Grosse, I.R.; Bhattacharya, S.; Katragadda, P.;

Capacitive microphone with a surface micromachined backplate using electroplating technology

1994 / IEEE
By: Bergqvist, J.; Gobet, J.;

Coupled electromagnetic structural analysis of a DC magnet for a MHD power generator

1994 / IEEE
By: Myatt, R.L.; Marston, P.G.;

An inverse analysis for crack identification in eddy current NDT of tubes

1994 / IEEE
By: Song-yop Hahn; Hyun-Kyo Jung; Hong-bae Lee; Jin-Kyo Chung;

Study of the new eddy current non-destructive testing sensor on ferromagnetic materials

1994 / IEEE
By: Namkung, M.; Fulton, J.P.; Wincheski, B.; Nath, S.;

Finite element modeling of electromagnetic wave interactions with periodic dielectric structures

1994 / IEEE
By: Pinello, W.P.; Cangellaris, A.C.; Lee, R.;

Cooperative application of holography and finite element modeling in determining critical vibration behavior of printed wiring boards

1993 / IEEE / 0-7803-0794-1
By: Brown, G.M.; Jih, E.E.J.; Blair, H.D.; Pan, T.-Y.;

Current carrying capacity of copper conductors in printed wiring boards

1993 / IEEE / 0-7803-0794-1
By: Blair, H.D.; Poulson, R.H.; Pan, T.-Y.;

Green Tape via design-FEM and proposed design philosophy

1993 / IEEE / 0-7803-0794-1
By: Poulin, T.R.; Nguyen, L.T.;

Flip-chip encapsulation on ceramic substrates

1993 / IEEE / 0-7803-0794-1
By: Niu, T.M.; McCreary, J.; Clementi, J.; Hill, G.; Varcoe, J.; Palomaki, J.;

Solder joint reliability of surface mount chip resistors/capacitors on insulated metal substrates

1994 / IEEE / 0-7803-0914-6
By: Knight, R.W.; Matthai, K.W.; White, J.D.; Johnson, R.W.; Suhling, J.C.; Burcham, S.W.; Romanczuk, C.S.;

Connectors-metallurgy meets modeling

1994 / IEEE / 0-7803-0914-6
By: Cribb, W.R.; Ratka, J.O.;

Finite element modeling of atherosclerotic plaque

1993 / IEEE / 0-8186-5470-8
By: Cornhill, J.F.; Veress, A.I.; Thomas, J.D.; Herderick, E.E.; Powell, K.A.;

Finite element modeling of resonant microelectromechanical structures for sensing applications

1994 / IEEE / 0-7803-2012-3
By: Stewart, J.T.;

Finite element modeling of the pulse-echo behavior of ultrasound transducers

1994 / IEEE / 0-7803-2012-3
By: Kaarmann, H.T.; Landes, H.; Lerch, R.;

Finite element modeling of an ultrasonic capacitive transducer

1994 / IEEE / 0-7803-2012-3
By: Adamowski, J.C.; Higuti, R.T.; Buiochi, F.; Simon, C.; Silva, E.C.N.;

A prism finite element time domain method with automatic mesh generation for solving microwave cavities

1994 / IEEE / 0-7803-2009-3
By: Buris, N.; Mohan, S.; Sacks, Z.; Jin-Fa Lee;

Absorbing boundary conditions for finite element modeling of phased array antennas

1994 / IEEE / 0-7803-2009-3
By: Frenkel, A.; Brauer, J.R.;

Finite element modeling of impedance imaging using induced currents

1994 / IEEE / 0-7803-2050-6
By: Adler, A.; Guardo, R.; Ruan, W.; Savoie, G.;

Finite element modeling of conductor groundings in TM field eddy current problems

1995 / IEEE
By: Konrad, A.; Qiushi Chen; Lavers, J.D.;

Design of small recording head elements using thermally constrained transmission line modeling

1995 / IEEE
By: Jander, A.; Kryder, M.H.; Jayasekara, W.; Bain, J.A.; Indeck, R.S.;

History and trends in the development of motorized spindles for hard disk drives

1996 / IEEE
By: Schirle, N.; Lieu, D.F.;

Optimizing AQP SAW resonators for reduced vibration sensitivity

1995 / IEEE / 0-7803-2940-6
By: Andres, D.; Parker, T.E.; Greer, J.A.; Montress, G.K.;

The finite element modeling of static and stationary electric and magnetic fields

1996 / IEEE
By: Lager, I.E.; Mur, G.;

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Topic: Finite Element Modeling

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