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Topic: Conductive Adhesives

Results

High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined With Ultrasonic Bonding Technique

2011 / IEEE
By: Pykari, L.; Saarinen, I.J.; Kiwon Lee; Kyung Wook Paik;

Analysis of Nonaqueous Electrowetting Fluids for Displays

2011 / IEEE
By: Clapp, L.; Heikenfeld, J.; Chevalliot, S.; Vilner, S.; Milarcik, A.;

Experimental Stress Characterization of a Biomedical Ultrasound Probe Soldered With Innovative Silver Isotropically Conductive Adhesive

2012 / IEEE
By: Bertocci, F.; Scarano, V.L.; Catelani, M.;

Effects of Cycling Humidity on the Performance of RFID Tags With ACA Joints

2012 / IEEE
By: Ukkonen, L.; Frisk, L.; Saarinen, K.;

Acoustic backing in 3-D integration of CMUT with front-end electronics

2012 / IEEE
By: Berg, S.; R�nnekleiv, A.;

Practical and Cost-Effective Bias Line Implementations for Reconfigurable Antennas

2012 / IEEE
By: Rahmat-Samii, Y.; Rajagopalan, H.; Kovitz, J. M.;

Liquid Leakage Thin Film-Tape Sensor

2012 / IEEE
By: Dong-Keun Yu; Gook-Hee Han; Kyung-Shin Kim; Hong-Keun Yu; Guangsup Cho; Kim, S.; In Tae Kim;

TEM Study of Local Conduction Mechanisms in Model Specimens of Ag-Based Conductive Adhesive

2012 / IEEE
By: Kurosu, K.; Shindo, D.; Murakami, Y.; Kawamoto, N.;

Effect of Surface Roughness on Paper Substrate Circuit Board

2012 / IEEE
By: Ryan, A.; Lewis, H.;

Three-Dimensional Solenoids Realized via High-Density Deep Coil Stacking for MEMS Application

2012 / IEEE
By: Kwong, D.L.; Gao, S.; Chong, S.C.; Hirshberg, A.; Li, H.Y.; Baram, A.; Ong, L.G.; Xie, L.; Herer, I.;

Aluminum-Based Mechanical and Electrical Laser Interconnection Process for Module Integration of Silicon Solar Cells

2012 / IEEE
By: Merkle, A.; Blankemeyer, S.; Bock, R.; Schulte-Huxel, H.; Brendel, R.;

Homogeneity of joints made of electrically conductive adhesive

2011 / IEEE / 978-1-4577-2112-0
By: Zak, P.; Kudlacek, I.; Tucan, M.;

Failure analysis of adhesive joining in electronics

2011 / IEEE / 978-1-4577-2112-0
By: Povolotskaya, E.; Mach, P.;

Correlations between mechanical and electrical parameters of modified electrically conductive adhesives

2011 / IEEE / 978-1-4577-2112-0
By: Busek, D.; Mach, P.; Selepova, J.;

Post-curing behavior of two-component Electrically Conductive Adhesive

2011 / IEEE / 978-1-4577-2112-0
By: Urbanek, J.; Tucan, M.; Zak, P.;

Climatic resistance of electrically conductive adhesive modified with silver nanoparticles

2011 / IEEE / 978-1-4577-2112-0
By: Mach, P.; Barto, S.;

Mechanical stress tests of SMT attachments

2011 / IEEE / 978-1-4577-2112-0
By: Tucan, M.; Zak, P.; Urbanek, J.;

An accurate method for thermal conductivity measurement of thermally conductive adhesives

2011 / IEEE / 978-1-4577-2112-0
By: Felba, J.; Falat, T.; Platek, B.;

Study into high temperature reliability of isotropic conductive adhesive

2011 / IEEE / 978-1-4577-1769-7
By: Wenhui Du; Liu, J.; Lilei Ye; Zhichao Yuan; Si Chen; Huiwang Cui;

Investigation of bulk resistance for metal-coated polymer particles used in anisotropic conductive adhesive

2011 / IEEE / 978-1-4577-1769-7
By: Xiancai Chen; Bo Tao; Zhouping Yin;

The effect of functionalized silver on properties of conductive adhesives

2011 / IEEE / 978-1-4577-1769-7
By: Johan Liu; Lilei Ye; Zhichao Yuan; Zhili Hu; Dongsheng Li; Huiwang Cui; Qiong Fan;

Mechanical and electronic analysis of 3D embedded capacitor filling with conductive adhesive

2011 / IEEE / 978-1-4577-1769-7
By: Daquan Yu; Huijuan Wang; Lixi Wan; Liqiang Cao; Fengwei Dai; Ran He;

2011 / IEEE / 978-1-4577-1769-7
By: Guanghua Wu; Bo Tao;

Discoloration mechanism of silver-filled adhesive used for packaging solder joint

2011 / IEEE / 978-1-4577-1769-7
By: Weiming Lai; Shengxiang Bao; Zhenzhen Rao; Jianhai Ye; Peng Li; Guanghua Shi;

Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives

2011 / IEEE / 978-1-4577-1769-7
By: Johan Liu; Lilei Ye; Zhichao Yuan; Yajun Duan; Qiong Fan; Huiwang Cui; Dongsheng Li;

Influence of thermal aging on the reliability of electrically conductive adhesives

2011 / IEEE / 978-1-4577-1277-7
By: Mach, P.; Cinert, J.; Barto, S.;

Resistance and non-linearity of electrically conductive adhesives aged by thermal, humidity and combined aging

2011 / IEEE / 978-1-4577-1277-7
By: Mach, P.; Barto, S.;

Modification of interfacial properties between filler particles in electrically conductive adhesives

2011 / IEEE / 978-1-4577-1277-7
By: Busek, D.; Mach, P.;

Influence of substrate on electrical conductivity of isotropic conductive adhesive

2011 / IEEE / 978-1-4673-0149-7
By: Lilei Ye; Cong Yue; Wenhui; Zhili Hu; Liu, J.; Zhichao Yuan;

Progress on thermally conductive adhesive for electronic packaging

2011 / IEEE / 978-1-4673-0149-7
By: Junying Zhang; Tianpeng Jin; Xibing Zhan; Jue Cheng;

Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED

2011 / IEEE / 978-1-4673-0149-7
By: Hongqin Wang; Ling Wang; Lijiao He; Meiling Deng; Bin Du; Mingyu Li; Pengcheng Wang; Chao Wan;

The effect of two different latent curing agents on the performance of anisotropic conductive adhesives

2011 / IEEE / 978-1-4673-0149-7
By: Meiling Deng; Hongqin Wang; Jiaqi Hu; Ling Wang; Lijiao He; Xionghui Cai; Bin Du; Chao Wan;

High performance flexible fabric electronics for megahertz frequency communications

2011 / IEEE / 978-1-4577-1016-2
By: Whittow, W.; Chauraya, A.; Shiyu Zhang; Acti, T.; Vardaxoglou, Y.; Dias, T.; Seager, R.;

Reliability of ACA joined thinned chips on rigid substrates under humid conditions

2011 / IEEE / 978-0-9568086-0-8
By: Frisk, L.; Kokko, K.; Saarinen, K.;

Low temperature die-bonding with Ag flakes

2011 / IEEE / 978-0-9568086-0-8
By: Suganuma, K.; Sakamoto, S.;

Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres

2011 / IEEE / 978-0-9568086-0-8
By: Redford, K.; Kristiansen, H.; Cottrill, M.; Whalley, D.C.; Nilsen, C.B.; Liu, C.; Jain, S.; Helland, T.;

Electrical, thermal and mechanical properties of epoxy composites with hybrid micro- and nano-sized fillers for electronic packaging

2011 / IEEE / 978-1-4577-1516-7
By: Platek, B.; Matkowski, P.; Felba, J.; Falat, T.; Demont, P.; Poltorak, K.; Moscicki, A.; Monfraix, P.; Marcq, F.;

A newly composite quartz crystal resonator

2011 / IEEE / 978-1-4673-1078-9
By: Yu-Guo Li; Chong-zhu Ma;

Measurement of the roundly bending characteristics of a cavity-backed slot antenna made of a conductive textile

2011 / IEEE / 978-0-85825-974-4
By: Shimasaki, H.; Tanaka, M.;

The finite element analysis of high-frequency vibrations of quartz crystal resonator strcuctures

2011 / IEEE / 978-1-4673-1078-9
By: Ze-zhong Jin; Ji-liang Li; Ji Wang;

High thermal performance ICP die attach process design and development for LQFP-EP

2011 / IEEE / 978-1-4577-1982-0
By: Khoo Ly Hoon; Lim Fui Yee; Yow Kai Yun; Tiu Kong Bee;

Non-destructive testing of crystalline silicon photovoltaic back-contact modules

2011 / IEEE / 978-1-4244-9965-6
By: Brockholz, B.; Bennett, I.J.; Veldman, D.; de Jong, P.C.;

Sinter adhesive - new horizons in semiconductor packaging

2011 / IEEE / 978-1-4577-1982-0
By: Thomas, M.; Krebs, T.; Lower, Y.;

Recent advances on nano-materials for advanced packaging applications

2012 / IEEE / 978-1-4673-1124-3
By: Wong, C.P.;

Usability of ECA materials in high temperature sensor applications

2012 / IEEE / 978-1-4673-1965-2
By: Frisk, L.; Lahokallio, S.;

Fabrication of a microcoil through parallel microassembly

2012 / IEEE / 978-1-4673-1405-3
By: Cleghorn, W.L.; Mills, J.K.; Chu, H.K.;

Low temperature curable anisotropic conductive films (ACFs) with photo-active curing agent (PA-ACFs)

2012 / IEEE / 978-1-4673-1965-2
By: Il Kim; Kyung-Wook Paik;

Copper conductive adhesives for printed circuit interconnects

2012 / IEEE / 978-1-4673-1965-2
By: Litchfield, R.; Siyuan Qi; Ebbens, S.; Webb, P.; Changqing Liu; Vaidhyanathan, B.; Hutt, D.A.;

Effect of surface treatment on the conductive adhesive interconnection of flexible solar cells

2012 / IEEE / 978-1-4673-2240-9
By: Wolter, K.-J.; Munch, M.; Reithe, A.;

Capability of biopolymers in electronics manufacturing

2012 / IEEE / 978-1-4673-2240-9
By: Reinhardt, Andreas; Schramm, Rene; Franke, Joerg;

Study of curing process of electrically conductive adhesives using differential scanning calorimetry

2012 / IEEE / 978-1-4673-2240-9
By: Povolotskaya, Evgenija; Mach, Pavel;

Using fractional factorial experiments for determination of factors influencing parameters of electrically conductive adhesives

2012 / IEEE / 978-1-4673-2240-9
By: Barto, Seba; Radev, Radoslav;

Novel Self-Assembly Process Using Magnetically Aligned $z$-Axis Anisotropic Conductive Adhesive for High-Density Vertical Interconnection

2012 / IEEE
By: Chappell, W.J.; Sungwook Moon;

A study of single-crystal silicon diodes integrated on flexible substrates using conductive adhesives

2012 / American Institute of Physics
By: C. Doran; W. Chen; T. L. Alford; S. S. Lau;

Local conductivity and electric field analysis of Ag-based conductive adhesive by transmission electron microscopy

2010 / American Institute of Physics
By: N. Kawamoto; Y. Murakami; D. Shindo;

In-situ analysis of electrical conductivity evolution in epoxy-based conductive adhesives with Ag loading during curing process

2014 / IEEE
By: Inoue, Masahiro; Tada, Yasunori; Sakaniwa, Yoshiaki;

Study of thermomechanical properties of one- and two-component conductive adhesives

2014 / IEEE
By: Mach, Pavel; Busek, David;

Properties of porous copper filled electrically conductive adhesives

2013 / IEEE
By: Ho, Li-Ngee; Nishikawa, Hiroshi;

The fatigue life analysis of conductive adhesive

2013 / IEEE
By: Huang, Jinxin; Liu, Peisheng;

Mechanical property and reliability of anisotropic conductive adhesive in surface mount applications

2013 / IEEE
By: Liangjie, Zhou; Lin, Huang; Zhe, Liu; Shiyu, Wang; Hongzhi, Fu; Weisheng, Xia; Fengshun, Wu; Hui, Liu;

Electrically conductive adhesives filled with surface modified copper particles

2013 / IEEE
By: Xiao, Fei; Deng, Dunying; Chen, Wenjun;

Microstructural control of electrically conductive adhesives with Ag micro-fillers by binder chemistry

2013 / IEEE
By: Tada, Yasunori; Inoue, Masahiro; Yamanaka, Shinsuke; Muta, Hiroaki;

Isotropically conductive adhesives filled with copper nanoparticles and micron-sized flakes

2014 / IEEE
By: Deng, Dunying; Chen, Wenjun; Xiao, Fei;

Influence of curing procedures on the electrical properties of epoxy-based isotropic conductive adhesives

2014 / IEEE
By: Li, Jingze; Li, Zhiling; Xiong, Nana; Wang, Yuehui; Xie, Hui;

Effect of chemical factors on the evolution of electrical conductivity during curing in Ag-loaded conductive adhesives composed of an epoxy-based binder — A new understanding of electrically conductive adhesives

2014 / IEEE
By: Tada, Yasunori; Sakaniwa, Yoshiaki; Inoue, Masahiro;

Influence of filler concentration on frequency dependence of electrically conductive adhesive joints impedance

2013 / IEEE
By: Mach, Pavel; Placek, Martin;

Influence of curing procedures on the electrical properties of epoxy-based isotropic conductive adhesives

2014 / IEEE
By: Li, Zhiling; Xiong, Nana; Wang, Yuehui; Xie, Hui; Li, Jingze;

Isotropically conductive adhesives filled with copper nanoparticles and micron-sized flakes

2014 / IEEE
By: Chen, Wenjun; Xiao, Fei; Deng, Dunying;

High volume, low cost flip chip assembly on polyester flex

1999 / Emerald Publishing
By: Ken Gilleo; Bob Boyes; Steve Corbett; Gary Larson; Dave Price;

Direct chip interconnect using polymer bonding

1990 / IEEE
By: Gilleo, K.;

Heat seal connectors: a new high density SMT interconnection system

1989 / IEEE
By: Juskey, F.;

Direct chip interconnect using polymer bonding

1989 / IEEE
By: Gilleo, K.;

Z-axis conductive adhesive for TAB and fine pitch interconnects

1991 / IEEE / 0-7803-0012-2
By: Dreier, G.; Chung, K.; Sager, J.; Lin, M.; Boyle, A.; Fitzgerald, P.;

Prediction and measurement of thermal conductivity of diamond filled adhesives

1992 / IEEE / 0-7803-0167-6
By: Bolger, J.C.;

Direct chip interconnect with adhesive-connector films

1992 / IEEE / 0-7803-0167-6
By: Cranston, B.H.; Chang, D.D.; Basavanhally, N.R.; Seger, S.G., Jr.;

An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

1993 / IEEE
By: Fulton, J.A.; Crawford, P.A.; Chang, D.D.; Wong, C.P.; Sinitski, R.E.; Schmidt, M.B.; Mcbride, R.;

Accelerated life test of Z-axis conductive adhesives

1993 / IEEE
By: Wong, C.P.; Sinitski, R.E.; Schmidt, M.B.; Ling, H.C.; Fulton, J.A.; Chang, D.D.;

Electrical, structural and processing properties of electrically conductive adhesives

1993 / IEEE
By: Sacolick, I.; Kim, H.; Lizzul, C.; Li, L.; Morris, J.E.;

Processing, structural and electrical properties of electrically conductive adhesives

1993 / IEEE / 0-7803-0794-1
By: Hansoo Kim; Morris, J.E.; Sacolick, I.; Lizzul, C.; Li Li;

Accelerated life test of z-axis conductive adhesives

1993 / IEEE / 0-7803-0794-1
By: Wong, C.P.; Sinitski, R.E.; Schmidt, M.B.; Ling, H.C.; Fulton, J.A.; Chang, D.D.;

A comparison of modelling methods for electronic interconnect structures

1993 / IEEE / 0-7803-0794-1
By: Whalley, D.C.; Ogunjimi, A.O.; Williams, D.J.;

Evaluation of thermally conductive adhesives for bonding heat sinks to electronic packages

1993 / IEEE / 0-7803-0794-1
By: Shaukatullah, H.; Gaynes, M.A.;

An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

1993 / IEEE / 0-7803-0794-1
By: McBride, R.; Fulton, J.A.; Crawford, P.A.; Chang, D.D.; Wong, C.P.; Sinitski, R.E.; Schmidt, M.B.;

Double sided flexible carrier with discretes and thermally enhanced FCA/COF

1993 / IEEE / 0-7803-0794-1
By: Milkovich, C.S.; Perkins, J.S.; Gaynes, M.A.;

Conductive adhesives for SMT and potential applications

1995 / IEEE
By: Hvims, H.L.;

Electrically conductive adhesives: a prospective alternative for SMD soldering?

1995 / IEEE
By: Jagt, J.C.; Lijten, G.F.C.M.; Beris, P.J.M.;

Reliability assessment of isotropically conductive adhesive joints in surface mount applications

1995 / IEEE
By: Rorgren, R.S.; Johan Liu;

Development of conductive adhesive joining for surface-mounting electronics manufacturing

1995 / IEEE
By: Zonghe Lai; Ljungkrona, L.; Johan Liu;

Reliability issues of replacing solder with conductive adhesives in power modules

1995 / IEEE
By: Lenkkeri, J.; Rusanen, O.;

Modeling joining materials for microelectronics packaging

1995 / IEEE
By: Kivilahti, J.K.;

An environmental comparison of solder and conductive adhesives for SMT interconnect

1993 / IEEE / 0-7803-1424-7
By: Conway, P.P.;

Solder replacement

1993 / IEEE / 0-7803-1424-7
By: Hvims, H.;

Investigation of crack propagation in ceramic/conductive epoxy/glass systems

1995 / IEEE
By: Hu, J.M.; Zhu, J.S.; Sheng Liu; Yi-Hsin Pao;

Reliability of electronic devices containing epoxy resins

1995 / IEEE / 0-7803-2633-4
By: Spitsbergen, J.C.;

A new approach to using anisotropically conductive adhesives for flip-chip assembly

1996 / IEEE
By: Lyons, A.M.; Adams, G.; Yiu-Huen Wong; Hall, E.;

Life cycle assessment of tin-lead solder and silver-epoxy conductive adhesive

1996 / IEEE / 0-7803-2950-3
By: Segerberg, T.; Hedemalm, P.;

A new approach to using anisotropically conductive adhesives for flip chip assembly

1995 / IEEE / 0-7803-2736-5
By: Yiu-Huen Wong; Hall, E.E.; Lyons, A.M.; Adams, G.;

Reliability and failure mechanism of isotropically conductive adhesives joints

1995 / IEEE / 0-7803-2736-5
By: Johan Liu; Morris, J.E.; Li Li; Changhai Li; Ljungkrona, L.; Zonghe Lai;

Fine pitch COG interconnections using anisotropically conductive adhesives

1995 / IEEE / 0-7803-2736-5
By: Loh, K.I.; Chang Hoon Lee;

Assembly of a prototype flip-chip-on-glass liquid crystal display

1995 / IEEE / 0-7803-2736-5
By: Chang Hoon Lee; Fei-Jain Wu; Loh, K.;

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Topic: Conductive Adhesives

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