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Topic: Components
Results
2011 / IEEE / 978-3-943024-05-0
By: Mohtashami, M.; Marlowe, T.J.; Ku, C.S.; Kirova, V.; Jastroch, N.;
By: Mohtashami, M.; Marlowe, T.J.; Ku, C.S.; Kirova, V.; Jastroch, N.;
2011 / IEEE / 978-1-4577-2116-8
By: Boyer, F.; Coupaye, T.; Etchevers, X.; Salaun, G.; de Palma, N.;
By: Boyer, F.; Coupaye, T.; Etchevers, X.; Salaun, G.; de Palma, N.;
2006 / RSC Publishing
By: Enrique GarciacuteaEspantildea; Fernando Pina; A. Jorge Parola; Damiaacuten Fernaacutendez; Conxa Soriano; M. Paz Clares; Carlos Lodeiro; Roberto Tejero;
By: Enrique GarciacuteaEspantildea; Fernando Pina; A. Jorge Parola; Damiaacuten Fernaacutendez; Conxa Soriano; M. Paz Clares; Carlos Lodeiro; Roberto Tejero;
2008 / RSC Publishing
By: Kenneth R. Seddon; Gadi Rothenberg; Ignacio LpezMartin; John D. Holbrey; Xi Zheng; Guadalupe Silvero;
By: Kenneth R. Seddon; Gadi Rothenberg; Ignacio LpezMartin; John D. Holbrey; Xi Zheng; Guadalupe Silvero;
2007 / RSC Publishing
By: P. Rod Dunbar; Paul W. R. Harris; Renata Kowalczyk; Margaret A. Brimble; Victoria J. Muir;
By: P. Rod Dunbar; Paul W. R. Harris; Renata Kowalczyk; Margaret A. Brimble; Victoria J. Muir;
2009 / RSC Publishing
By: Diego Lomonaco; Giuseppe Vasapollo; Giuseppe Mele; Selma Elaine Mazzetto; Acircngela Martha Campos Arriaga; Yana Silva Ferreira; Gilvandete Maria Pinheiro Santiago;
By: Diego Lomonaco; Giuseppe Vasapollo; Giuseppe Mele; Selma Elaine Mazzetto; Acircngela Martha Campos Arriaga; Yana Silva Ferreira; Gilvandete Maria Pinheiro Santiago;
2009 / RSC Publishing
By: Barbara Ventura; Ana I. Oliva; Lucia Flamigni; Pablo Ballester; Christopher A. Hunter; Amaya CamaraCampos; Frank Wuumlrthner;
By: Barbara Ventura; Ana I. Oliva; Lucia Flamigni; Pablo Ballester; Christopher A. Hunter; Amaya CamaraCampos; Frank Wuumlrthner;
2009 / RSC Publishing
By: Koichi Kondo; Takaaki Taniguchi; Subramani K. Ailoor; Nobuhiro Matsushita; Masahiro Yoshimura; Masanori Abe; Takashi Nakagawa; Masaru Tada;
By: Koichi Kondo; Takaaki Taniguchi; Subramani K. Ailoor; Nobuhiro Matsushita; Masahiro Yoshimura; Masanori Abe; Takashi Nakagawa; Masaru Tada;
2009 / RSC Publishing
By: Alexander Muck; Antony M. Hooper; Xaoli He; Samuel Dufour; JingJiang Zhou; John A. Pickett; Alescaron Svatoscaron; Linda M. Field; Reinaldo Almeida;
By: Alexander Muck; Antony M. Hooper; Xaoli He; Samuel Dufour; JingJiang Zhou; John A. Pickett; Alescaron Svatoscaron; Linda M. Field; Reinaldo Almeida;
Droplet-based compartmentalization of chemically separated components in two-dimensional separations
2009 / RSC PublishingBy: D. R. Klug; J. B. Edel; O. Ces; R. T. Marszalek; B. Zhangfnotereffnoteref; X. Z. Niufnotereffnotereffootnote idfn2The authors contributed equally to the paper.footnote; A. J. deMello;
2001 / Emerald Publishing
By: Stephen OReilly; Maeve Duffy; Terence ODonnell; Paul McCloskey; Sen Cian Mathna;
By: Stephen OReilly; Maeve Duffy; Terence ODonnell; Paul McCloskey; Sen Cian Mathna;
Time-domain network analysis of MM-wave circuits based on a photoconductive probe sampling technique
1993 / IEEE / 0-7803-1209-0By: Williamson, S.; Son, J.; Nees, J.; Wakana, S.; Whitaker, J.; Kim, J.; Pavlidis, D.; Kwon, Y.;
1993 / IEEE / 0-7803-1203-1
By: Ruth, R.D.; Adolphsen, C.; Youngman, B.; Yeremian, A.; Wilson, P.B.; Wang, J.W.; Vylet, V.; Vlieks, A.; Thompson, K.A.; Tantawi, S.; Spencer, J.; Rifkin, J.; Phillips, R.; Pearson, C.; Paterson, J.M.; Nantista, C.; Miller, R.H.; Menegat, A.; Loew, G.A.; Lavine, R.T.; Kroll, N.M.; Koontz, R.; Kheifets, S.; Humphrey, R.; Hoag, H.; Heifets, S.; Fuller, R.; Bane, K.; Boyce, R.F.; Burke, D.L.; Calin, R.; Caryotakis, G.; Cassel, R.; Clark, S.L.; Deruyter, H.; Fant, K.;
By: Ruth, R.D.; Adolphsen, C.; Youngman, B.; Yeremian, A.; Wilson, P.B.; Wang, J.W.; Vylet, V.; Vlieks, A.; Thompson, K.A.; Tantawi, S.; Spencer, J.; Rifkin, J.; Phillips, R.; Pearson, C.; Paterson, J.M.; Nantista, C.; Miller, R.H.; Menegat, A.; Loew, G.A.; Lavine, R.T.; Kroll, N.M.; Koontz, R.; Kheifets, S.; Humphrey, R.; Hoag, H.; Heifets, S.; Fuller, R.; Bane, K.; Boyce, R.F.; Burke, D.L.; Calin, R.; Caryotakis, G.; Cassel, R.; Clark, S.L.; Deruyter, H.; Fant, K.;
1996 / IEEE / 0-7803-3286-5
By: Wong, Y.M.; Muehlner, D.J.; Marta, T.; Kalweit, E.; Walterson, R.; Lehman, J.; Hibbs-Brenner, M.K.; Morgan, R.A.; Whitlock, B.; Engebretsen, D.; Nation, W.; Stawiasz, K.; Pepeljugoski, P.K.; Kuchta, D.M.; Crow, J.D.; Choi, J.; Cyr, G.J.; Anthony, P.J.; Gates, J.V.; Fishteyn, M.; Faudskar, C.C.;
By: Wong, Y.M.; Muehlner, D.J.; Marta, T.; Kalweit, E.; Walterson, R.; Lehman, J.; Hibbs-Brenner, M.K.; Morgan, R.A.; Whitlock, B.; Engebretsen, D.; Nation, W.; Stawiasz, K.; Pepeljugoski, P.K.; Kuchta, D.M.; Crow, J.D.; Choi, J.; Cyr, G.J.; Anthony, P.J.; Gates, J.V.; Fishteyn, M.; Faudskar, C.C.;