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Topic: Breakdown
Results
2011 / IEEE
By: Hyun-Jong Chung; Jinseong Heo; Sung Kwan Lim; Chunhum Cho; Hyeon Jun Hwang; Heejun Yang; Sang Kyung Lee; Chang Goo Kang; Byoung Hun Lee; Young Gon Lee; Sunae Seo;
By: Hyun-Jong Chung; Jinseong Heo; Sung Kwan Lim; Chunhum Cho; Hyeon Jun Hwang; Heejun Yang; Sang Kyung Lee; Chang Goo Kang; Byoung Hun Lee; Young Gon Lee; Sunae Seo;
2012 / IEEE
By: Wilson, M.P.; Given, M.J.; MacGregor, S.J.; Timoshkin, I.V.; Mermigkas, A.C.; Tao Wang;
By: Wilson, M.P.; Given, M.J.; MacGregor, S.J.; Timoshkin, I.V.; Mermigkas, A.C.; Tao Wang;
2012 / IEEE
By: Gutierrez-Aitken, A.; Wang, S.; Monier, C.; Scott, D.W.; Radisic, V.; Deal, W.R.; Cavus, A.; Phuong Nguyen;
By: Gutierrez-Aitken, A.; Wang, S.; Monier, C.; Scott, D.W.; Radisic, V.; Deal, W.R.; Cavus, A.; Phuong Nguyen;
2011 / IEEE / 978-1-4244-7355-7
By: Dung, N.V.; Mauseth, F.; Hoidalen, H.K.; Linhjell, D.; Ingebrigtsen, S.; Lundgaard, L.E.; Unge, M.;
By: Dung, N.V.; Mauseth, F.; Hoidalen, H.K.; Linhjell, D.; Ingebrigtsen, S.; Lundgaard, L.E.; Unge, M.;
2011 / IEEE / 978-1-4577-0170-2
By: Yuan Li; Zhiyong Xiao; Minghui Sun; Yang Chai; Chan, P.C.H.; Min Zhang;
By: Yuan Li; Zhiyong Xiao; Minghui Sun; Yang Chai; Chan, P.C.H.; Min Zhang;
2011 / IEEE / 978-1-4577-1694-2
By: Rozman, D.; Roiter, Y.; Capua, E.; Bunin, G.; Baksht, T.; Alpern, Y.;
By: Rozman, D.; Roiter, Y.; Capua, E.; Bunin, G.; Baksht, T.; Alpern, Y.;
2011 / IEEE / 978-1-4577-1756-7
By: Vandelli, L.; Larcher, L.; Padovani, A.; Pavan, P.; Pirrotta, O.;
By: Vandelli, L.; Larcher, L.; Padovani, A.; Pavan, P.; Pirrotta, O.;
2014 / IEEE
By: Mu, H.B.; Zhu, M.X.; Li, Y.; Li, Z.M.; Deng, J.B.; Zahn, M.; Jadidian, J.; Zhang, G.J.; Zhang, W.Z.;
By: Mu, H.B.; Zhu, M.X.; Li, Y.; Li, Z.M.; Deng, J.B.; Zahn, M.; Jadidian, J.; Zhang, G.J.; Zhang, W.Z.;
2014 / IEEE
By: Hurkx, G.A.M.; Bertin, M.; Cibin, G.; Meneghini, M.; Ivo, P.; Meneghesso, G.; Croon, J.A.; Sonsky, J.; Zanoni, E.;
By: Hurkx, G.A.M.; Bertin, M.; Cibin, G.; Meneghini, M.; Ivo, P.; Meneghesso, G.; Croon, J.A.; Sonsky, J.; Zanoni, E.;
2014 / IEEE
By: Raghunathan, Uppili S.; Wier, Brian; Oakley, Michael A.; Cressler, John D.; Chakraborty, Partha S.;
By: Raghunathan, Uppili S.; Wier, Brian; Oakley, Michael A.; Cressler, John D.; Chakraborty, Partha S.;
2014 / IEEE
By: Maglaras, Leandros A.; Topalis, Frangiskos V.; Maglaras, Athanasios L.; Tsilika, Kyriaki D.; Giannakopoulou, Konstantina G.;
By: Maglaras, Leandros A.; Topalis, Frangiskos V.; Maglaras, Athanasios L.; Tsilika, Kyriaki D.; Giannakopoulou, Konstantina G.;
2014 / IEEE
By: Anza, Sergio; Vicente, Carlos; Raboso, David; Gimeno, Benito; Boria, Vicente E.; Wochner, Ulrich; Wolk, Dieter; Mattes, Michael; Gil, Jordi;
By: Anza, Sergio; Vicente, Carlos; Raboso, David; Gimeno, Benito; Boria, Vicente E.; Wochner, Ulrich; Wolk, Dieter; Mattes, Michael; Gil, Jordi;
2014 / IEEE
By: Hayakawa, Naoki; Okubo, Hitoshi; Hanai, Masahiro; Kojima, Hiroki; Mastuoka, Tastuya; Nishimachi, Seiichiro;
By: Hayakawa, Naoki; Okubo, Hitoshi; Hanai, Masahiro; Kojima, Hiroki; Mastuoka, Tastuya; Nishimachi, Seiichiro;