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Topic: Adhesives
Results
2012 / IEEE
By: Fujisaki, Y.; Nakajima, Y.; Takei, T.; Yamamoto, T.; Furukawa, T.; Fujikake, H.; Kinoshita, A.; Hosoi, M.;
By: Fujisaki, Y.; Nakajima, Y.; Takei, T.; Yamamoto, T.; Furukawa, T.; Fujikake, H.; Kinoshita, A.; Hosoi, M.;
2012 / IEEE
By: Takahiro, T.; Sei, T.; Iriuchijima, Y.; Fujiwara, T.; Sagawa, N.; Nakamura, K.; Khorram, H.R.; Hayashi, T.; Nakano, K.; Shiraishi, K.;
By: Takahiro, T.; Sei, T.; Iriuchijima, Y.; Fujiwara, T.; Sagawa, N.; Nakamura, K.; Khorram, H.R.; Hayashi, T.; Nakano, K.; Shiraishi, K.;
2012 / IEEE
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
2012 / IEEE
By: Kripesh, V.; Premchandran, C.S.; Tai Chong Chai; Xiaowu Zhang; Seung Wook Yoon; Kumar, A.; Lu Shen; Sekhar, V.N.; Lau, J.H.;
By: Kripesh, V.; Premchandran, C.S.; Tai Chong Chai; Xiaowu Zhang; Seung Wook Yoon; Kumar, A.; Lu Shen; Sekhar, V.N.; Lau, J.H.;
2012 / IEEE
By: Ho Soon Wee; Sekhar, V.N.; Rao, V.S.; Damaruganath, P.; Lim Ying Ying; Sharma, G.; Rajoo, R.;
By: Ho Soon Wee; Sekhar, V.N.; Rao, V.S.; Damaruganath, P.; Lim Ying Ying; Sharma, G.; Rajoo, R.;
2004 / IEEE / 978-5-87911-088-3
By: Petrov, A.V.; Ryabchikov, A.I.; Matvienko, V.M.; Struts, V.K.; Shlapakovski, A.S.;
By: Petrov, A.V.; Ryabchikov, A.I.; Matvienko, V.M.; Struts, V.K.; Shlapakovski, A.S.;
2011 / IEEE / 978-3-00-035081-8
By: Jing Chen; Xiaobing Zhang; Wei Lei; Xiaxi Yang; Yunsong Di; Yunkang Cui;
By: Jing Chen; Xiaobing Zhang; Wei Lei; Xiaxi Yang; Yunsong Di; Yunkang Cui;
2011 / IEEE / 978-1-4244-9439-2
By: Huibin Qin; Jiangxia Deng; Liang Zheng; Jun Wu; Weiguang Xiang; Zhihua Ying;
By: Huibin Qin; Jiangxia Deng; Liang Zheng; Jun Wu; Weiguang Xiang; Zhihua Ying;
2011 / IEEE / 978-1-61284-385-8
By: XiaoQi Chen; Journee, M.; Sellier, M.; Jermy, M.; Robertson, J.;
By: XiaoQi Chen; Journee, M.; Sellier, M.; Jermy, M.; Robertson, J.;
2011 / IEEE / 978-1-4577-0158-0
By: Young-Bae Park; Hee-yeon Kim; Hak-Joo Lee; Kwang-Seup Kim; Jae-Won Kim; Seungmin Hyun;
By: Young-Bae Park; Hee-yeon Kim; Hak-Joo Lee; Kwang-Seup Kim; Jae-Won Kim; Seungmin Hyun;
2011 / IEEE / 978-1-4244-9277-0
By: Abastado, J.-P.; Shiang Rong Leong; Shek Yoon Wong; Narang, V.; Gouaillard, A.;
By: Abastado, J.-P.; Shiang Rong Leong; Shek Yoon Wong; Narang, V.; Gouaillard, A.;
2011 / IEEE / 978-1-4577-0336-2
By: Leong, J.Y.; Sinha, S.K.; Fook Siong Chau; Guangya Zhou; Hongbin Yu;
By: Leong, J.Y.; Sinha, S.K.; Fook Siong Chau; Guangya Zhou; Hongbin Yu;
2011 / IEEE / 978-1-61284-456-5
By: Ulmen, John; Hawkes, Elliot W.; Cutkosky, Mark R.; Esparza, Noe;
By: Ulmen, John; Hawkes, Elliot W.; Cutkosky, Mark R.; Esparza, Noe;
2011 / IEEE / 978-1-61284-777-1
By: Jen-I Liang; Yu-Fu Wang; Shean-Jen Chen; Ming-Long Yeh; Chien-Te Lee;
By: Jen-I Liang; Yu-Fu Wang; Shean-Jen Chen; Ming-Long Yeh; Chien-Te Lee;
2011 / IEEE / 978-1-61284-777-1
By: Yi-Shan Chung; Wen-Ling Chen; Ming-Long Yeh; Ming-Jer Tang; Yu-Wei Chiou;
By: Yi-Shan Chung; Wen-Ling Chen; Ming-Long Yeh; Ming-Jer Tang; Yu-Wei Chiou;
2011 / IEEE / 978-1-61284-247-9
By: Tabarraee, K.; Chapariha, M.; Iyer, J.; Jatskevich, J.; Gougani, M.;
By: Tabarraee, K.; Chapariha, M.; Iyer, J.; Jatskevich, J.; Gougani, M.;
2011 / IEEE / 978-1-4577-1589-1
By: Schleich, Jean-Marc; Imms, Ryan A.; Abdulla, Tariq; Summers, Ron;
By: Schleich, Jean-Marc; Imms, Ryan A.; Abdulla, Tariq; Summers, Ron;
2011 / IEEE / 978-1-4577-1769-7
By: Hao Zhang; Renzheng Sang; Jianhua Zhang; Tao Feng; Xingyang Wu; Bin Wei; Jianling Yu; Zikai Hua; Li Long;
By: Hao Zhang; Renzheng Sang; Jianhua Zhang; Tao Feng; Xingyang Wu; Bin Wei; Jianling Yu; Zikai Hua; Li Long;
2011 / IEEE / 978-1-4577-1769-7
By: Johan Liu; Lilei Ye; Zhichao Yuan; Zhili Hu; Dongsheng Li; Huiwang Cui; Qiong Fan;
By: Johan Liu; Lilei Ye; Zhichao Yuan; Zhili Hu; Dongsheng Li; Huiwang Cui; Qiong Fan;
Electroless and eletroplating copper on liquid crystal polymer (LCP) for high frequency applications
2011 / IEEE / 978-1-4577-1769-7By: Ming Li; Dongyan Ding; Wenlong Zhang; Meisheng Zhou;
2011 / IEEE / 978-1-4577-0509-0
By: Jansen, C.; Wietzke, S.; Durrschmidt, S.F.; Koch, M.; Guozhong Zhao; Haiyan Wang;
By: Jansen, C.; Wietzke, S.; Durrschmidt, S.F.; Koch, M.; Guozhong Zhao; Haiyan Wang;
2011 / IEEE / 978-1-4577-0554-0
By: Niepel, M.S.; Groth, T.; Leipner, H.S.; Fuhrmann, B.; Singh, P.;
By: Niepel, M.S.; Groth, T.; Leipner, H.S.; Fuhrmann, B.; Singh, P.;
2011 / IEEE / 978-1-4577-0554-0
By: Gabhann, P.M.; Davies, A.; O'Neill, F.T.; Katsikogianni, M.G.; Dowling, D.P.;
By: Gabhann, P.M.; Davies, A.; O'Neill, F.T.; Katsikogianni, M.G.; Dowling, D.P.;