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Topic: Adhesives

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High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined With Ultrasonic Bonding Technique
2011 / IEEE
By: Pykari, L.; Saarinen, I.J.; Kiwon Lee; Kyung Wook Paik;
Fiber Optic Distributed Differential Displacement Sensor
2011 / IEEE
By: Colpitts, B.G.; Wylie, M.T.V.; Brown, A.W.;
Molecular Dynamics Simulation for Lubricant Shear Properties During Heating
2012 / IEEE
By: Sasaki, N.; Saito, Y.; Komatsu, T.;
Numerical Simulation of Touchdown Dynamics of Thermal Flying-Height Control Sliders
2012 / IEEE
By: Bogy, D.B.; Jinglin Zheng;
Atomistically Tuning Lubricant Adhesion on Carbon Overcoat Surface
2012 / IEEE
By: Smith, R.L.; Pil Seung Chung; Vemuri, S.H.; Biegler, L.T.; Jhon, M.S.;
The Shuttle Nanoelectromechanical Nonvolatile Memory
2012 / IEEE
By: Tsai, J.M.-L.; Vaddi, R.; Geng Li Chua; Pott, V.; Kim, T.T.;
Silica-Encapsulated Nanoparticle Films as Surface Modifications for MEMS
2011 / IEEE
By: Ansari, N.; Hurst, K.M.; Ashurst, W.R.; Roberts, C.B.;
Adhesion Properties of Monolayer Lubricant Films Coated on Magnetic Disk Surfaces: Contributions of Mobile and Bonded Molecules
2012 / IEEE
By: Itoh, S.; Fukuzawa, K.; Itakura, M.; Hedong Zhang; Renguo Lu;
Simple Transfer Technology for Fabrication of TFT Backplane for Flexible Displays
2012 / IEEE
By: Fujisaki, Y.; Nakajima, Y.; Takei, T.; Yamamoto, T.; Furukawa, T.; Fujikake, H.; Kinoshita, A.; Hosoi, M.;
Cosputtered Cu/Ti Bonded Interconnects With a Self-Formed Adhesion Layer for Three-Dimensional Integration Applications
2012 / IEEE
By: Sheng-Yao Hsu; Kuan-Neng Chen; Hsiao-Yu Chen;
Adhesion and Friction Behaviors of Probes Approaching Magnetic Disk Surfaces
2012 / IEEE
By: Tani, H.; Mitsutome, T.; Tsujiguchi, Y.; Kanda, M.; Tagawa, N.;
Performance Enhancement of Thin-Film Transistors With Suspended Poly-Si Nanowire Channels by Embedding Silicon Nanocrystals in Gate Nitride
2012 / IEEE
By: Chia-Hao Kuo; Tiao-Yuan Huang; Horng-Chih Lin;
Cost of Ownership/Yield Enhancement of High Volume Immersion Lithography Using Topcoat-Less Resists
2012 / IEEE
By: Takahiro, T.; Sei, T.; Iriuchijima, Y.; Fujiwara, T.; Sagawa, N.; Nakamura, K.; Khorram, H.R.; Hayashi, T.; Nakano, K.; Shiraishi, K.;
Quantitative Analysis of the Combined Effect of Substrate Rigidity and Topographic Guidance on Cell Morphology
2012 / IEEE
By: Deok-Ho Kim; Hong-Nam Kim; JinSeok Park; Kahp-Yang Suh; Levchenko, A.;
Trivalent Chrome Plating for ITER Strands
2012 / IEEE
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
Comparative Analysis of Rac1 Binding Efficiency With Different Classes of Ligands: Morpholines, Flavonoids and Imidazoles
2012 / IEEE
By: Arrigo, P.; Maggi, N.; Ruggiero, C.;
Nanofork for Single Cells Adhesion Measurement via ESEM-Nanomanipulator System
2012 / IEEE
By: Homma, M.; Kojima, S.; Kojima, M.; Nakajima, M.; Ahmad, M.R.; Fukuda, T.;
MEMS Reliability Review
2012 / IEEE
By: Pecht, M.; Osterman, M.; Doraiswami, R.; Vasan, A.S.S.; Yunhan Huang;
Packaging Considerations for a Surface Acoustic Wave Strain Sensor
2012 / IEEE
By: Geraghty, D.; Donohoe, B.; Stoney, R.; O'Donnell, G.E.;
Design Optimization of Pulsed-Mode Electromechanical Nonvolatile Memory
2012 / IEEE
By: Lin, J.T.M.; Geng Li Chua; Vaddi, R.; Pott, V.; Kim, T.T.;
Design and Scalability of a Memory Array Utilizing Anchor-Free Nanoelectromechanical Nonvolatile Memory Device
2012 / IEEE
By: Vaddi, R.; Kim, T.T.; Lin, J.T.M.; Geng Li Chua; Pott, V.;
Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack
2012 / IEEE
By: Kripesh, V.; Premchandran, C.S.; Tai Chong Chai; Xiaowu Zhang; Seung Wook Yoon; Kumar, A.; Lu Shen; Sekhar, V.N.; Lau, J.H.;
Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
2012 / IEEE
By: Ho Soon Wee; Sekhar, V.N.; Rao, V.S.; Damaruganath, P.; Lim Ying Ying; Sharma, G.; Rajoo, R.;
Pick-and-Place Silver Sintering Die Attach of Small-Area Chips
2012 / IEEE
By: Heuck, N.; Kahler, J.; Peiner, E.; Waag, A.; Stranz, A.;
High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles
2012 / IEEE
By: Suganuma, K.; Nogi, M.; Niwa, M.; Ogawa, S.; Kuramoto, M.; Kunimune, T.;
Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly
2012 / IEEE
By: Kiwon Lee; Won-Chul Kim; Kyung-Wook Paik; Pykari, L.; Saarinen, I.J.;
Two-Dimensional Autonomous Microparticle Manipulation Strategies for Magnetic Microrobots in Fluidic Environments
2012 / IEEE
By: Floyd, S.; Pawashe, C.; Sitti, M.; Diller, E.;
Fabrication of Large-Area Three-Dimensional Microstructures on Flexible Substrates by Microtransfer Printing Methods
2012 / IEEE
By: Chi-Chieh Huang; Hongrui Jiang; Xuefeng Zeng;
Sidewall Adhesion and Sliding Contact Behavior of Polycrystalline Silicon Microdevices Operated in High Vacuum
2012 / IEEE
By: Komvopoulos, K.; Ritchie, R.O.; Hua Xiang; Alsem, D.H.;
Characterization of Adhesion Force in MEMS at High Temperature Using Thermally Actuated Microstructures
2012 / IEEE
By: Maboudian, R.; Carraro, C.; Wenjuan Gou; Shavezipur, M.;
Polarization effect on wettability of bioceramic electrets
2012 / IEEE
By: Yamashita, K.; Nakamura, M.;
TFTs With High Overlay Alignment for Integration of Flexible Display Backplanes
2012 / IEEE
By: Sazonov, A.; Pathirane, M.; Moradi, M.; Nathan, A.; Chaji, R.;
Rapid Silicon-to-Steel Bonding by Induction Heating for MEMS Strain Sensors
2012 / IEEE
By: Sosnowchik, B.D.; Liwei Lin; Pisano, A.P.; Chan, M.W.; Myers, D.R.; Azevedo, R.G.;
Polyethersulfone Membrane Coated With Nanoporous Parylene for Ultrafiltration
2012 / IEEE
By: Kanno, Y.; Nishinaka, Y.; Ito, H.; Prihandana, G.S.; Miki, N.;
Inline Measurement of Adhesion Force Using Electrostatic Actuation and Capacitive Readout
2012 / IEEE
By: Fisch, M.; Gou, W.; Shavezipur, M.; Maboudian, R.; Carraro, C.;
Influence of deposition conditions on characteristics of thin-film coatings obtained using high-power ion beams
2004 / IEEE / 978-5-87911-088-3
By: Petrov, A.V.; Ryabchikov, A.I.; Matvienko, V.M.; Struts, V.K.; Shlapakovski, A.S.;
Cell Image Processing Based on Distance Transform and Regional Growth
2010 / IEEE / 978-1-4244-9954-0
By: Duan Jun; Qinglong Bai;
Atomistic Simulations of Tribological Properties of Ultra-Thin Carbon Nanotube Films on Silicon
2010 / IEEE / 978-1-61284-986-7
By: Welch, C.R.; Lee, N.J.;
Automated batch transfer of zebrafish embryos using a multi-degrees-of-freedom system
2011 / IEEE / 978-1-61284-385-8
By: Ciruna, B.; Gelinas, D.; Zhe Lu; Xuping Zhang; Yu Sun;
A new two-phase fluid dispensing technology for the adhesive distribution
2011 / IEEE / 978-1-4244-8115-6
By: Jianhua Zhang; Peng Peng; Jinsong Zhang;
Field emission properties of metal oxide-incorporated carbon nanotube films on a metal mesh
2011 / IEEE / 978-3-00-035081-8
By: Han Sung Lee; Ju Sung Choi; Naesung Lee;
Research on simulation for fracture process of T-type adhesive bonded joint under peel load
2011 / IEEE / 978-1-4244-9439-2
By: Hongyan Wang; Huafeng Wang; Junyi Chen;
Large emission current from carbon nanotubes cathode by peeling-off process
2011 / IEEE / 978-3-00-035081-8
By: Jing Chen; Xiaobing Zhang; Wei Lei; Xiaxi Yang; Yunsong Di; Yunkang Cui;
Dynamics analysis of the AFM manipulator-sample interaction using nano-contact mechanics models
2011 / IEEE / 978-1-4244-8115-6
By: Daeinabi, K.; Korayem, M.H.;
Effect of annealing on adhesion for Ti/Ni/Ag electrodes
2011 / IEEE / 978-1-4244-9439-2
By: Huibin Qin; Jiangxia Deng; Liang Zheng; Jun Wu; Weiguang Xiang; Zhihua Ying;
Multi-material compliant mechanisms for mobile millirobots
2011 / IEEE / 978-1-61284-385-8
By: Gupta, Satyandra K.; Vogtmann, Dana E.; Bergbreiter, Sarah;
A novel, flexible and multi-functional handling device based on Bernoulli principle
2011 / IEEE / 978-1-4577-1255-5
By: Sam, R.; Nefti, S.;
Images segmentation of feeding or discharging in jaw crusher based on network edition software ImageJ
2011 / IEEE / 978-1-61284-774-0
By: Shuo Rong; Xingfu Rong; Zhiyu Qin;
Synthesis of polyurethane using soybean oil based polyol and characterization of their coating properties
2011 / IEEE / 978-1-4577-1280-7
By: Ramli, R.; Mohd, A.F.; Nagteni, M.M.;
A study of using Fenton-like to enhance mass transfer during deep oxidative desulfurization
2011 / IEEE / 978-1-4244-9439-2
By: Feng Liu; Wang Dongfang;
An investigation into improved non-contact adhesion mechanism suitable for wall climbing robotic applications
2011 / IEEE / 978-1-61284-385-8
By: XiaoQi Chen; Journee, M.; Sellier, M.; Jermy, M.; Robertson, J.;
Process prediction model for wood plastic composites pencil boards based on BP neural network
2011 / IEEE / 978-1-4244-9439-2
By: Chiwu Bu;
State of the art of researches on racking performance of post and beam timber construction
2011 / IEEE / 978-1-4244-9439-2
By: Songlai Chen; Mingjuan He;
The effect of plasma pre-cleaning on the Cu-Cu direct bonding for 3D chip stacking.
2011 / IEEE / 978-1-4577-0158-0
By: Young-Bae Park; Hee-yeon Kim; Hak-Joo Lee; Kwang-Seup Kim; Jae-Won Kim; Seungmin Hyun;
ABS Control of Electric Vehicle on Various Road Conditions
2011 / IEEE / 978-1-4577-0860-2
By: Du Qifei; Sha Lin; Cheng, K.W.E.;
Application of PLC in adhesive spraying control system for fiber optic precise winding
2011 / IEEE / 978-1-4577-0536-6
By: Ma BaoJi; Ma Yao;
Kinetic study of bacterial adhesion on biomaterials by using optical waveguide lightmode spectroscopy
2011 / IEEE / 978-1-61284-088-8
By: Ramsden, J.J.; Ma, K.J.; Chien, H.H.; Yeh, Y.P.;
Development of CPU module test device based on the virtual instrument
2011 / IEEE / 978-1-61284-088-8
By: Huiqin Jia;
Single cell adhesion force measurement for viability identification using nanorobotic manipulation system inside ESEM
2011 / IEEE / 978-1-61284-777-1
By: Yajing Shen; Fukuda, T.; Homma, M.; Kojima, S.; Nakajima, M.;
Deterministic three-dimensional micro-assembly in parallel
2011 / IEEE / 978-1-61284-777-1
By: Wang, K.; Chia-Chung Wang; Huo-Chuan Lin;
Study on optimal slip ratio identification and traction control for electric vehicle
2011 / IEEE / 978-1-61284-722-1
By: Qiang Gu; Xiusheng Cheng;
Theoretical analysis of Wheel Slide Protection controllers for rail vehicles
2011 / IEEE / 978-1-4577-0914-2
By: Barna, G.;
Using impedance biosensors to distinguish the PC12 cells adhesion and differentiation
2011 / IEEE / 978-1-61284-777-1
By: Chen-Chia Chen; Jeng-Tzong Sheu; Shan-Yu Lin;
A study on marginal microleakage of five different restorative materials in vitro
2011 / IEEE / 978-1-61284-726-9
By: Liu Zhengyu; Ou Xiaoyan; Yang Jian; Xiong Wei; Gao Yun;
Comparing mathematical models of cell adhesion in tumors
2011 / IEEE / 978-1-4244-9277-0
By: Abastado, J.-P.; Shiang Rong Leong; Shek Yoon Wong; Narang, V.; Gouaillard, A.;
Service continuity of an IM distributed railway traction with a speed sensor fault
2011 / IEEE / 978-90-75815-14-6
By: Achour, T.; Pietrzak-David, M.;
Impact of amino acid substitutions in domain 5 of high molecular weight kininogen on suppression of breast cancer cells invasion
2011 / IEEE / 978-1-61284-726-9
By: Zhang Xiujuan; Xu Guangyu; An Liping; Han Xiao; Du Peige;
The variation of NF-kB p65 and ICAM-1 induced by homocysteine in the brain microvascular endothelial cells (BMECs)
2011 / IEEE / 978-1-61284-726-9
By: Liu Huimin; Sun Wenping;
Microtribometer based on a rotational grating displacement sensing mechanism
2011 / IEEE / 978-1-4577-0336-2
By: Leong, J.Y.; Sinha, S.K.; Fook Siong Chau; Guangya Zhou; Hongbin Yu;
Research on the stickiness effects of ceramic brackets and light-cured composite resin prosthetic replacement treated with different adhesive agents and surface treatment
2011 / IEEE / 978-1-61284-726-9
By: Tiejing Song; Jing Guo; Fasheng Wang; Dong Li;
Peculiar Phenomenon in Friction Coefficient of Tin Plated Connector Contacts with Application of Lubricant
2011 / IEEE / 978-1-61284-651-4
By: Tamai, T.; Hattori, Y.; Sawada, S.;
Scaling walls: Applying dry adhesives to the real world
2011 / IEEE / 978-1-61284-456-5
By: Ulmen, John; Hawkes, Elliot W.; Cutkosky, Mark R.; Esparza, Noe;
3D photo-crosslinking pattern scaffold for cell application by two-photon laser scanning system
2011 / IEEE / 978-1-61284-777-1
By: Jen-I Liang; Yu-Fu Wang; Shean-Jen Chen; Ming-Long Yeh; Chien-Te Lee;
Adhesion strengths of normal epithelial cells and epithelial mesenchymal transition cells by using single-cell force spectroscopy
2011 / IEEE / 978-1-61284-777-1
By: Yi-Shan Chung; Wen-Ling Chen; Ming-Long Yeh; Ming-Jer Tang; Yu-Wei Chiou;
Fabrication of biomimetic gecko setae by direct photolithography and micromolding processes
2011 / IEEE / 978-1-61284-777-1
By: Hao Lv; Zirong Tang; Peng Zhang; Shiyuan Liu;
Regulation of chemokine receptor CXCR4 in HepG2 cell adhesion sensing by QCM
2011 / IEEE / 978-1-61284-726-9
By: Jing Zhang; Xiao-Lan Wei; Zhi-Hong Mo;
Optimization of functional layers in piezoelectric thick film MEMS process
2011 / IEEE / 978-1-61284-777-1
By: Dong-Yeon Lee; Jae Hong Park; Tae Song Kim; Jaesool Shim;
Controlling parameter experiments of pillar insulators live-line clearing apparatus by dry ice
2011 / IEEE / 978-1-4244-8165-1
By: Yuan Fang; Ming Liu; Wen-jun Zhou; Jian-hui Yu; Yang-jue Huang;
The research of interaction between the silicone rubber sealant and concrete
2011 / IEEE / 978-1-4244-8165-1
By: Donglai Li; Shaopeng Wu; Jiesheng Liu; Chuancheng Zhang;
Influence of surface finish on resistance of contacts between ECA and Pad
2011 / IEEE / 978-1-4577-2112-0
By: Cinert, J.; Mach, P.;
Auto anti-lock braking system bench test results classification model based on neural network
2011 / IEEE / 978-1-4577-0321-8
By: Zhao Xiang-mo; Hao Ru-ru; Xu Zhi-gang;
Load sharing in V/F speed controlled multi-motor driven system under mechanical wheel-slippage
2011 / IEEE / 978-1-61284-247-9
By: Tabarraee, K.; Chapariha, M.; Iyer, J.; Jatskevich, J.; Gougani, M.;
Characterization of barrier and seed layer integrity for copper interconnects
2011 / IEEE / 978-1-4577-0430-7
By: Neumann, V.; Lehninger, D.; Wojcik, H.; Bartha, J.W.;
A novel slip frequency control scheme with feed-forward compensation of SLIM in traction system
2011 / IEEE / 978-1-4577-1043-8
By: Qiongxuan Ge; Liping Wang;
Towards multiscale systems modeling of endocardial to mesenchymal transition
2011 / IEEE / 978-1-4577-1589-1
By: Schleich, Jean-Marc; Imms, Ryan A.; Abdulla, Tariq; Summers, Ron;
Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface
2011 / IEEE / 978-1-4577-1769-7
By: Xiancai Chen; Zhouping Yin; Bo Tao;
Sample preparation device for molding compound adhesion test
2011 / IEEE / 978-1-4577-1769-7
By: Wenjing Zhang; Qin Lu; Dali Mao; Ming Li;
Study on the adhesion and reliability of Epoxy Molding Compound and shaped Pd Preplated leadframes
2011 / IEEE / 978-1-4577-1769-7
By: Ming Li; Wenjing Zhang; Mingzhi Ni; Dali Mao;
Thin film encapsulation for OLED display using silicon nitride and silicon oxide composite film
2011 / IEEE / 978-1-4577-1769-7
By: Hao Zhang; Renzheng Sang; Jianhua Zhang; Tao Feng; Xingyang Wu; Bin Wei; Jianling Yu; Zikai Hua; Li Long;
Improving plated copper adhesion for metallisation of glass PCBs
2011 / IEEE / 978-1-4577-1769-7
By: Baofeng He; Leach, R.; Petzing, J.; Webb, D.P.;
Simulations for a novel fluid dispensing technology based on gas-liquid slug flow
2011 / IEEE / 978-1-4577-1769-7
By: Jinsong Zhang; Jianhua Zhang; Peng Peng;
Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products
2011 / IEEE / 978-1-4577-1769-7
By: Hongbin Shi; Ueda, T.;
The effect of functionalized silver on properties of conductive adhesives
2011 / IEEE / 978-1-4577-1769-7
By: Johan Liu; Lilei Ye; Zhichao Yuan; Zhili Hu; Dongsheng Li; Huiwang Cui; Qiong Fan;
Electroless and eletroplating copper on liquid crystal polymer (LCP) for high frequency applications
2011 / IEEE / 978-1-4577-1769-7
By: Ming Li; Dongyan Ding; Wenlong Zhang; Meisheng Zhou;
A blister-test apparatus for studies on the adhesion of materials used for neural electrodes
2011 / IEEE / 978-1-4577-1589-1
By: Boehler, C.; Ordonez, J.; Stieglitz, T.; Schuettler, M.;
Scratch reduction in oxide CMP process
2011 / IEEE / 978-1-4577-1647-8
By: Ohtsuka, Yosuke;
Terahertz testing of adhesive bonds
2011 / IEEE / 978-1-4577-0509-0
By: Jansen, C.; Wietzke, S.; Durrschmidt, S.F.; Koch, M.; Guozhong Zhao; Haiyan Wang;
Cell adhesion on nanostructured surfaces designed by nanosphere lithography
2011 / IEEE / 978-1-4577-0554-0
By: Niepel, M.S.; Groth, T.; Leipner, H.S.; Fuhrmann, B.; Singh, P.;
Influence of thermal aging on the reliability of electrically conductive adhesives
2011 / IEEE / 978-1-4577-1277-7
By: Mach, P.; Cinert, J.; Barto, S.;
Use of atmospheric plasma jet treatments for the enhancement of cell adhesion to 1 mm internal diameter microwell cell arrays
2011 / IEEE / 978-1-4577-0554-0
By: Gabhann, P.M.; Davies, A.; O'Neill, F.T.; Katsikogianni, M.G.; Dowling, D.P.;

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