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Topic: Adhesion
Results
2011 / IEEE
By: Li-Han Chen; Villwock, D.; Cihan Kuru; Daehoon Hong; Sungho Jin; Young Oh; Kunbae Noh; Chulmin Choi;
By: Li-Han Chen; Villwock, D.; Cihan Kuru; Daehoon Hong; Sungho Jin; Young Oh; Kunbae Noh; Chulmin Choi;
2012 / IEEE
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
2012 / IEEE
By: Ho Soon Wee; Sekhar, V.N.; Rao, V.S.; Damaruganath, P.; Lim Ying Ying; Sharma, G.; Rajoo, R.;
By: Ho Soon Wee; Sekhar, V.N.; Rao, V.S.; Damaruganath, P.; Lim Ying Ying; Sharma, G.; Rajoo, R.;
2004 / IEEE / 978-5-87911-088-3
By: Shlapakovski, A.S.; Usov, Y.P.; Struts, V.K.; Petrov, A.V.; Matvienko, V.M.; Ryabchikov, A.I.;
By: Shlapakovski, A.S.; Usov, Y.P.; Struts, V.K.; Petrov, A.V.; Matvienko, V.M.; Ryabchikov, A.I.;
2004 / IEEE / 978-5-87911-088-3
By: Petrov, A.V.; Ryabchikov, A.I.; Matvienko, V.M.; Struts, V.K.; Shlapakovski, A.S.;
By: Petrov, A.V.; Ryabchikov, A.I.; Matvienko, V.M.; Struts, V.K.; Shlapakovski, A.S.;
2011 / IEEE / 978-1-61284-175-5
By: Murmann, B.; Wang, S.X.; Makinwa, K.; Osterfeld, S.J.; Gaster, R.S.; Hall, D.A.;
By: Murmann, B.; Wang, S.X.; Makinwa, K.; Osterfeld, S.J.; Gaster, R.S.; Hall, D.A.;
2011 / IEEE / 978-3-00-035081-8
By: Park, K.S.; Kyu Chang Park; Jin Jang; Young Ju Eom; Hee Chul Woo; Kim, C.D.; An Na Ha; Woo Mi Bae; Su Woong Lee; Eun Hye Lee;
By: Park, K.S.; Kyu Chang Park; Jin Jang; Young Ju Eom; Hee Chul Woo; Kim, C.D.; An Na Ha; Woo Mi Bae; Su Woong Lee; Eun Hye Lee;
2011 / IEEE / 978-3-00-035081-8
By: Xiaxi Yang; Yunsong Di; Wei Lei; Xiaobing Zhang; Yunkang Cui; Jing Chen;
By: Xiaxi Yang; Yunsong Di; Wei Lei; Xiaobing Zhang; Yunkang Cui; Jing Chen;
2011 / IEEE / 978-1-4244-9439-2
By: Huibin Qin; Jiangxia Deng; Liang Zheng; Jun Wu; Weiguang Xiang; Zhihua Ying;
By: Huibin Qin; Jiangxia Deng; Liang Zheng; Jun Wu; Weiguang Xiang; Zhihua Ying;
2011 / IEEE / 978-1-61284-329-2
By: Haehnel, M.; Lindequist, U.; Haertel, B.; von Woedtke, T.; Oehmigen, K.; Wende, K.;
By: Haehnel, M.; Lindequist, U.; Haertel, B.; von Woedtke, T.; Oehmigen, K.; Wende, K.;
2011 / IEEE / 978-1-61284-777-1
By: Ming-Long Yeh; Yu-Wei Chiu; Jen-I Liang; Tsung-Hsien Wu; Chia-Hsin Chen;
By: Ming-Long Yeh; Yu-Wei Chiu; Jen-I Liang; Tsung-Hsien Wu; Chia-Hsin Chen;
2011 / IEEE / 978-1-4577-0522-9
By: Ribeiro, A.S.; Bernardes, N.; Fialho, A.M.; Paredes, J.; Seruca, R.;
By: Ribeiro, A.S.; Bernardes, N.; Fialho, A.M.; Paredes, J.; Seruca, R.;
2011 / IEEE / 978-1-4577-0336-2
By: Leong, J.Y.; Sinha, S.K.; Fook Siong Chau; Guangya Zhou; Hongbin Yu;
By: Leong, J.Y.; Sinha, S.K.; Fook Siong Chau; Guangya Zhou; Hongbin Yu;
2011 / IEEE / 978-1-61284-777-1
By: Yi-Shan Chung; Wen-Ling Chen; Ming-Long Yeh; Ming-Jer Tang; Yu-Wei Chiou;
By: Yi-Shan Chung; Wen-Ling Chen; Ming-Long Yeh; Ming-Jer Tang; Yu-Wei Chiou;
2011 / IEEE / 978-1-61284-247-9
By: Tabarraee, K.; Chapariha, M.; Iyer, J.; Jatskevich, J.; Gougani, M.;
By: Tabarraee, K.; Chapariha, M.; Iyer, J.; Jatskevich, J.; Gougani, M.;
2011 / IEEE / 978-1-4577-1769-7
By: Hao Zhang; Renzheng Sang; Jianhua Zhang; Tao Feng; Xingyang Wu; Bin Wei; Jianling Yu; Zikai Hua; Li Long;
By: Hao Zhang; Renzheng Sang; Jianhua Zhang; Tao Feng; Xingyang Wu; Bin Wei; Jianling Yu; Zikai Hua; Li Long;
2011 / IEEE / 978-1-4577-1769-7
By: Yiping Wu; Liangquan Sun; Tailieh Lu; Techun Wang; Lan Ding; Bing An;
By: Yiping Wu; Liangquan Sun; Tailieh Lu; Techun Wang; Lan Ding; Bing An;
2011 / IEEE / 978-1-4577-1769-7
By: Lilei Ye; Zandira, M.; Carlberg, B.; Xin Luo; Xiuzhen Lu; Lei Zhang; Liu, J.;
By: Lilei Ye; Zandira, M.; Carlberg, B.; Xin Luo; Xiuzhen Lu; Lei Zhang; Liu, J.;
Electroless and eletroplating copper on liquid crystal polymer (LCP) for high frequency applications
2011 / IEEE / 978-1-4577-1769-7By: Ming Li; Dongyan Ding; Wenlong Zhang; Meisheng Zhou;
2011 / IEEE / 978-1-4577-1589-1
By: de Beeck, M.O.; O'Callaghan, J.M.; Linde, A.S.; Mertens, R.; Van Hoof, C.; Neves, H.P.;
By: de Beeck, M.O.; O'Callaghan, J.M.; Linde, A.S.; Mertens, R.; Van Hoof, C.; Neves, H.P.;
2011 / IEEE / 978-1-4577-1025-4
By: Wirges, W.; Mwale, F.; Ruiz, J.C.; Petit, A.; Elkin, B.; St-Georges-Robillard, A.; Wertheimer, M.R.; Oehr, C.; Gerhard, R.;
By: Wirges, W.; Mwale, F.; Ruiz, J.C.; Petit, A.; Elkin, B.; St-Georges-Robillard, A.; Wertheimer, M.R.; Oehr, C.; Gerhard, R.;
2011 / IEEE / 978-1-4577-0554-0
By: Niepel, M.S.; Groth, T.; Leipner, H.S.; Fuhrmann, B.; Singh, P.;
By: Niepel, M.S.; Groth, T.; Leipner, H.S.; Fuhrmann, B.; Singh, P.;
2011 / IEEE / 978-1-4577-0554-0
By: Gabhann, P.M.; Davies, A.; O'Neill, F.T.; Katsikogianni, M.G.; Dowling, D.P.;
By: Gabhann, P.M.; Davies, A.; O'Neill, F.T.; Katsikogianni, M.G.; Dowling, D.P.;
2011 / IEEE / 978-1-61284-846-4
By: Lee Boon Seong; Eu Poh Leng; Wong Boh Kid; Yap Boon Kar; Weily, C.;
By: Lee Boon Seong; Eu Poh Leng; Wong Boh Kid; Yap Boon Kar; Weily, C.;
2011 / IEEE / 978-1-4577-1362-0
By: Homma, M.; Nakajima, M.; Yajing Shen; Fukuda, T.; Najdovski, Z.; Kojima, S.; Kojima, M.; Zhan Yang;
By: Homma, M.; Nakajima, M.; Yajing Shen; Fukuda, T.; Najdovski, Z.; Kojima, S.; Kojima, M.; Zhan Yang;
2011 / IEEE / 978-1-4577-1376-7
By: Mazzitelli, C.L.; Chipuk, J.E.; Chamberlin, S.C.; Reaves, M.A.; Straight, S.D.; Kendall, J.K.;
By: Mazzitelli, C.L.; Chipuk, J.E.; Chamberlin, S.C.; Reaves, M.A.; Straight, S.D.; Kendall, J.K.;
2011 / IEEE / 978-1-4673-0149-7
By: Gavin, J.; Yamaguchi, T.; Xiuzhen Lu; Wenhui Du; Xin Luo; Liu, J.; Li Lei Ye;
By: Gavin, J.; Yamaguchi, T.; Xiuzhen Lu; Wenhui Du; Xin Luo; Liu, J.; Li Lei Ye;
2011 / IEEE / 978-1-4577-1362-0
By: Umezu, M.; Okano, T.; Shimizu, T.; Terajima, Y.; Sakaguchi, K.; Fukumori, K.; Takeuchi, R.;
By: Umezu, M.; Okano, T.; Shimizu, T.; Terajima, Y.; Sakaguchi, K.; Fukumori, K.; Takeuchi, R.;
2011 / IEEE / 978-1-4577-1389-7
By: Chia-Hsun Yeh; Durn-Yuan Huang; Sheng-Jye Hwang; Huei-Huang Lee; Chen-hung Deng;
By: Chia-Hsun Yeh; Durn-Yuan Huang; Sheng-Jye Hwang; Huei-Huang Lee; Chen-hung Deng;
2011 / IEEE / 978-2-35500-015-7
By: Collins, G.; Meletis, E.; Jiechao Jiang; Jie He; Chen, C.; Ayon, A.; Chabanov, A.; Chunrui Ma; Elam, D.; Ming Liu; Silva, E.;
By: Collins, G.; Meletis, E.; Jiechao Jiang; Jie He; Chen, C.; Ayon, A.; Chabanov, A.; Chunrui Ma; Elam, D.; Ming Liu; Silva, E.;
Characterization of the adhesion between nanoparticles and polymer matrix by atomic force microscopy
2011 / IEEE / 978-1-4577-1516-7By: Chung, W.R.; Amo, K.;
2011 / IEEE / 978-1-4673-0451-1
By: Somekh, M.; Crowe, J.; Sottile, V.; Morris, D.; Jing Zhang; Mather, M.;
By: Somekh, M.; Crowe, J.; Sottile, V.; Morris, D.; Jing Zhang; Mather, M.;