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Topic: Adhesion

Results

Diameter-Reduced Islands for Nanofabrication Toward Bit Patterned Magnetic Media
2011 / IEEE
By: Li-Han Chen; Villwock, D.; Cihan Kuru; Daehoon Hong; Sungho Jin; Young Oh; Kunbae Noh; Chulmin Choi;
Automated composition of data-path functionality in the future internet
2011 / IEEE
By: Wolf, T.; Shanbhag, S.;
Evaluation of the Single Yeast Cell's Adhesion to ITO Substrates With Various Surface Energies via ESEM Nanorobotic Manipulation System
2011 / IEEE
By: Yajing Shen; Fukuda, T.; Homma, M.; Kojima, S.; Nakajima, M.; Ahmad, M.R.;
Molecular Dynamics Simulation for Lubricant Shear Properties During Heating
2012 / IEEE
By: Sasaki, N.; Saito, Y.; Komatsu, T.;
Numerical Simulation of Touchdown Dynamics of Thermal Flying-Height Control Sliders
2012 / IEEE
By: Bogy, D.B.; Jinglin Zheng;
Atomistically Tuning Lubricant Adhesion on Carbon Overcoat Surface
2012 / IEEE
By: Smith, R.L.; Pil Seung Chung; Vemuri, S.H.; Biegler, L.T.; Jhon, M.S.;
Adhesion Properties of Monolayer Lubricant Films Coated on Magnetic Disk Surfaces: Contributions of Mobile and Bonded Molecules
2012 / IEEE
By: Itoh, S.; Fukuzawa, K.; Itakura, M.; Hedong Zhang; Renguo Lu;
Adhesion and Friction Behaviors of Probes Approaching Magnetic Disk Surfaces
2012 / IEEE
By: Tani, H.; Mitsutome, T.; Tsujiguchi, Y.; Kanda, M.; Tagawa, N.;
Intravascular ultrasound catheter to enhance microbubble-based drug delivery via acoustic radiation force
2012 / IEEE
By: Wamhoff, B.R.; Klibanov, A.L.; Kilroy, J.P.; Hossack, J.A.;
Trivalent Chrome Plating for ITER Strands
2012 / IEEE
By: Kanithi, H.; Scoble, H.; Smith, D.; Bates, C.; Berglund, D.; Lajewski, J.; Pyon, T.;
Cultured Cell-Adherable Electrochemical NO Biosensor With Fe Complex Sensor Matrix for High-Throughput Qualified Analysis
2012 / IEEE
By: Haruyama, T.; Tanoue, C.; Tateishi, A.;
Robust Superhydrophobic Surfaces Prepared With Epoxy Resin and Silica Nanoparticles
2012 / IEEE
By: Yonghao Xiu; Chingping Wong; Hess, D.W.; Balu, B.; Yan Liu;
Nanofork for Single Cells Adhesion Measurement via ESEM-Nanomanipulator System
2012 / IEEE
By: Homma, M.; Kojima, S.; Kojima, M.; Nakajima, M.; Ahmad, M.R.; Fukuda, T.;
The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples
2012 / IEEE
By: Frisk, L.; Kiilunen, J.; Hoikkanen, M.;
Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
2012 / IEEE
By: Ho Soon Wee; Sekhar, V.N.; Rao, V.S.; Damaruganath, P.; Lim Ying Ying; Sharma, G.; Rajoo, R.;
Sintering of Copper Particles for Die Attach
2012 / IEEE
By: Waag, A.; Peiner, E.; Stranz, A.; Wagner, A.; Heuck, N.; Kahler, J.;
Improvement of Cr- and Ni-Coating Technology for ITER Conductors' Production
2012 / IEEE
By: Ipatov, Y.P.;
A Hybrid Cellular Automaton Model of Solid Tumor Growth and Bioreductive Drug Transport
2012 / IEEE
By: Kazmi, N.; Phillips, R.M.; Hossain, M.A.;
Sidewall Adhesion and Sliding Contact Behavior of Polycrystalline Silicon Microdevices Operated in High Vacuum
2012 / IEEE
By: Komvopoulos, K.; Ritchie, R.O.; Hua Xiang; Alsem, D.H.;
Characterization of Adhesion Force in MEMS at High Temperature Using Thermally Actuated Microstructures
2012 / IEEE
By: Maboudian, R.; Carraro, C.; Wenjuan Gou; Shavezipur, M.;
A Generalized Tip-Membrane Contact Detection Algorithm for Automated Single Cell Electroporation Using Statistical Process Control
2012 / IEEE
By: Park, E.J.; Burke, R.D.; Dechev, N.; Esmaeilsabzali, H.; Sakaki, K.;
Analysis of a fractured 500 kV composite insulator - identification of aging mechanisms and their causes
2012 / IEEE
By: Cheng, L.; Lutz, B.; Zhang, F.; Wang, L.; Guan, Z.;
Polarization effect on wettability of bioceramic electrets
2012 / IEEE
By: Yamashita, K.; Nakamura, M.;
A Lithographic Resist-Based Simple Technology for High Yield Microfabrication of Air Bridges
2012 / IEEE
By: Jie, S.;
Rapid Silicon-to-Steel Bonding by Induction Heating for MEMS Strain Sensors
2012 / IEEE
By: Sosnowchik, B.D.; Liwei Lin; Pisano, A.P.; Chan, M.W.; Myers, D.R.; Azevedo, R.G.;
Inline Measurement of Adhesion Force Using Electrostatic Actuation and Capacitive Readout
2012 / IEEE
By: Fisch, M.; Gou, W.; Shavezipur, M.; Maboudian, R.; Carraro, C.;
Application of high-power ion beams to thin films deposition and stimulating mass transfer of previously implanted dopants in materials
2004 / IEEE / 978-5-87911-088-3
By: Shlapakovski, A.S.; Usov, Y.P.; Struts, V.K.; Petrov, A.V.; Matvienko, V.M.; Ryabchikov, A.I.;
Influence of deposition conditions on characteristics of thin-film coatings obtained using high-power ion beams
2004 / IEEE / 978-5-87911-088-3
By: Petrov, A.V.; Ryabchikov, A.I.; Matvienko, V.M.; Struts, V.K.; Shlapakovski, A.S.;
Atomistic Simulations of Tribological Properties of Ultra-Thin Carbon Nanotube Films on Silicon
2010 / IEEE / 978-1-61284-986-7
By: Welch, C.R.; Lee, N.J.;
Effect of loading phase angle on interfacial fracture toughness for Circumferentially Notched Tensile specimens
2010 / IEEE / 978-1-4244-5261-3
By: Elambasseril, J.; Das, R.; Ibrahim, R.;
Bacterial interactions with optical fibre surfaces
2010 / IEEE / 978-1-4244-5261-3
By: Mitik-Dineva, N.; Ivanova, E.P.; Crawford, R.J.;
A 256 channel magnetoresistive biosensor microarray for quantitative proteomics
2011 / IEEE / 978-1-61284-175-5
By: Murmann, B.; Wang, S.X.; Makinwa, K.; Osterfeld, S.J.; Gaster, R.S.; Hall, D.A.;
Graphite coated CNTs for high current electron emission devices
2011 / IEEE / 978-3-00-035081-8
By: Park, K.S.; Kyu Chang Park; Jin Jang; Young Ju Eom; Hee Chul Woo; Kim, C.D.; An Na Ha; Woo Mi Bae; Su Woong Lee; Eun Hye Lee;
Field emission properties of metal oxide-incorporated carbon nanotube films on a metal mesh
2011 / IEEE / 978-3-00-035081-8
By: Han Sung Lee; Ju Sung Choi; Naesung Lee;
High emission current density from printed CNTs by enhanced emitters-substrate contact
2011 / IEEE / 978-3-00-035081-8
By: Xiaxi Yang; Yunsong Di; Wei Lei; Xiaobing Zhang; Yunkang Cui; Jing Chen;
Research on simulation for fracture process of T-type adhesive bonded joint under peel load
2011 / IEEE / 978-1-4244-9439-2
By: Hongyan Wang; Huafeng Wang; Junyi Chen;
Effect of annealing on adhesion for Ti/Ni/Ag electrodes
2011 / IEEE / 978-1-4244-9439-2
By: Huibin Qin; Jiangxia Deng; Liang Zheng; Jun Wu; Weiguang Xiang; Zhihua Ying;
Study on the tension in the geomembrane due to compaction work
2011 / IEEE / 978-1-4244-9439-2
By: Juan Cheng; Qi-mao Cai;
Synthesis of polyurethane using soybean oil based polyol and characterization of their coating properties
2011 / IEEE / 978-1-4577-1280-7
By: Ramli, R.; Mohd, A.F.; Nagteni, M.M.;
Plasma-cell-interaction: Expression of surface molecules on HaCaT keratinocytes after treatment with dielectric barrier discharge (DBD) plasma
2011 / IEEE / 978-1-61284-329-2
By: Haehnel, M.; Lindequist, U.; Haertel, B.; von Woedtke, T.; Oehmigen, K.; Wende, K.;
Synthesis and field emission properties of molybdenum nanowall arrays
2011 / IEEE / 978-3-00-035081-8
By: Yu Zhang; Deng, S.Z.; Yan Shen; Xu, N.S.; Chen, J.;
Kinetic study of bacterial adhesion on biomaterials by using optical waveguide lightmode spectroscopy
2011 / IEEE / 978-1-61284-088-8
By: Ramsden, J.J.; Ma, K.J.; Chien, H.H.; Yeh, Y.P.;
Effect of Fillet Angle on Stress in Weld-Bonded Aluminum Joints
2011 / IEEE / 978-1-4577-0860-2
By: Dingfeng Zhu; Min You; Chunzhi Mei; Cunjun Chen; Jialing Yan;
Research of vehicle brake system characteristic based on simulation analysis
2011 / IEEE / 978-1-61284-088-8
By: Lina Chen;
Single cell adhesion force measurement for viability identification using nanorobotic manipulation system inside ESEM
2011 / IEEE / 978-1-61284-777-1
By: Yajing Shen; Fukuda, T.; Homma, M.; Kojima, S.; Nakajima, M.;
Deterministic three-dimensional micro-assembly in parallel
2011 / IEEE / 978-1-61284-777-1
By: Wang, K.; Chia-Chung Wang; Huo-Chuan Lin;
Mechanical quantification of the Epithelial mesenchymal transition
2011 / IEEE / 978-1-61284-777-1
By: Ming-Long Yeh; Yu-Wei Chiu; Jen-I Liang; Tsung-Hsien Wu; Chia-Hsin Chen;
The research in chemistry and cardiovascular effects of Pueraria lobata
2011 / IEEE / 978-1-61284-726-9
By: Hanshen Zhen; Rui Tan; Shengmao Li; Xiaohe Xiao; Yang Li;
Bacterial protein azurin as a new candidate drug to treat untreatable breast cancers
2011 / IEEE / 978-1-4577-0522-9
By: Ribeiro, A.S.; Bernardes, N.; Fialho, A.M.; Paredes, J.; Seruca, R.;
The use of bacteriophages for P. aeruginosa biofilm control
2011 / IEEE / 978-1-4577-0522-9
By: Pires, D.P.; Azeredo, J.; Sillankorva, S.;
Using impedance biosensors to distinguish the PC12 cells adhesion and differentiation
2011 / IEEE / 978-1-61284-777-1
By: Chen-Chia Chen; Jeng-Tzong Sheu; Shan-Yu Lin;
Impact of amino acid substitutions in domain 5 of high molecular weight kininogen on suppression of breast cancer cells invasion
2011 / IEEE / 978-1-61284-726-9
By: Zhang Xiujuan; Xu Guangyu; An Liping; Han Xiao; Du Peige;
The variation of NF-kB p65 and ICAM-1 induced by homocysteine in the brain microvascular endothelial cells (BMECs)
2011 / IEEE / 978-1-61284-726-9
By: Liu Huimin; Sun Wenping;
Microtribometer based on a rotational grating displacement sensing mechanism
2011 / IEEE / 978-1-4577-0336-2
By: Leong, J.Y.; Sinha, S.K.; Fook Siong Chau; Guangya Zhou; Hongbin Yu;
Peculiar Phenomenon in Friction Coefficient of Tin Plated Connector Contacts with Application of Lubricant
2011 / IEEE / 978-1-61284-651-4
By: Tamai, T.; Hattori, Y.; Sawada, S.;
Adhesion strengths of normal epithelial cells and epithelial mesenchymal transition cells by using single-cell force spectroscopy
2011 / IEEE / 978-1-61284-777-1
By: Yi-Shan Chung; Wen-Ling Chen; Ming-Long Yeh; Ming-Jer Tang; Yu-Wei Chiou;
Fabrication of biomimetic gecko setae by direct photolithography and micromolding processes
2011 / IEEE / 978-1-61284-777-1
By: Hao Lv; Zirong Tang; Peng Zhang; Shiyuan Liu;
Optimization of functional layers in piezoelectric thick film MEMS process
2011 / IEEE / 978-1-61284-777-1
By: Dong-Yeon Lee; Jae Hong Park; Tae Song Kim; Jaesool Shim;
Void formation on PCB surface finish during reflow soldering
2011 / IEEE / 978-1-4577-2112-0
By: Wolter, K.; Holle, N.; Ewald, T.D.;
Study of influencing factors in aluminum surface self-assembled film processes
2011 / IEEE / 978-1-4244-8165-1
By: Haiyan Xing; Pin Lu; Zemin Chen;
A climbing robot based on Hot Melt Adhesion
2011 / IEEE / 978-1-61284-456-5
By: Osswald, M.; Iida, F.;
Load sharing in V/F speed controlled multi-motor driven system under mechanical wheel-slippage
2011 / IEEE / 978-1-61284-247-9
By: Tabarraee, K.; Chapariha, M.; Iyer, J.; Jatskevich, J.; Gougani, M.;
A novel slip frequency control scheme with feed-forward compensation of SLIM in traction system
2011 / IEEE / 978-1-4577-1043-8
By: Qiongxuan Ge; Liping Wang;
Thin film encapsulation for OLED display using silicon nitride and silicon oxide composite film
2011 / IEEE / 978-1-4577-1769-7
By: Hao Zhang; Renzheng Sang; Jianhua Zhang; Tao Feng; Xingyang Wu; Bin Wei; Jianling Yu; Zikai Hua; Li Long;
Improving plated copper adhesion for metallisation of glass PCBs
2011 / IEEE / 978-1-4577-1769-7
By: Baofeng He; Leach, R.; Petzing, J.; Webb, D.P.;
Improvement of the second bond strength in copper wire bonding on pre-plated leadframe
2011 / IEEE / 978-1-4577-1769-7
By: Yiping Wu; Liangquan Sun; Tailieh Lu; Techun Wang; Lan Ding; Bing An;
Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures
2011 / IEEE / 978-1-4577-1769-7
By: Lilei Ye; Zandira, M.; Carlberg, B.; Xin Luo; Xiuzhen Lu; Lei Zhang; Liu, J.;
Electroless and eletroplating copper on liquid crystal polymer (LCP) for high frequency applications
2011 / IEEE / 978-1-4577-1769-7
By: Ming Li; Dongyan Ding; Wenlong Zhang; Meisheng Zhou;
Hydrogel optimization towards fibroblast-friendly biomimetic coatings for implantable devices
2011 / IEEE / 978-1-4577-1589-1
By: de Beeck, M.O.; O'Callaghan, J.M.; Linde, A.S.; Mertens, R.; Van Hoof, C.; Neves, H.P.;
Improving the bioactivity of bioglass/ (PMMA-co-MPMA) organic/inorganic hybrid
2011 / IEEE / 978-1-4577-1589-1
By: Dehghani, F.; Wei, H.; Ravarian, R.;
A blister-test apparatus for studies on the adhesion of materials used for neural electrodes
2011 / IEEE / 978-1-4577-1589-1
By: Boehler, C.; Ordonez, J.; Stieglitz, T.; Schuettler, M.;
Adhesion of U937 monocytes on polymer surfaces: Chemistry or electrostatics?
2011 / IEEE / 978-1-4577-1025-4
By: Wirges, W.; Mwale, F.; Ruiz, J.C.; Petit, A.; Elkin, B.; St-Georges-Robillard, A.; Wertheimer, M.R.; Oehr, C.; Gerhard, R.;
Cell adhesion on nanostructured surfaces designed by nanosphere lithography
2011 / IEEE / 978-1-4577-0554-0
By: Niepel, M.S.; Groth, T.; Leipner, H.S.; Fuhrmann, B.; Singh, P.;
Use of atmospheric plasma jet treatments for the enhancement of cell adhesion to 1 mm internal diameter microwell cell arrays
2011 / IEEE / 978-1-4577-0554-0
By: Gabhann, P.M.; Davies, A.; O'Neill, F.T.; Katsikogianni, M.G.; Dowling, D.P.;
Metallurgical bond integrity of C45 ultra fine pitch with 18�m copper wire
2011 / IEEE / 978-1-61284-846-4
By: Lee Boon Seong; Eu Poh Leng; Wong Boh Kid; Yap Boon Kar; Weily, C.;
Test method research of rape adhesion properties based on image technology
2011 / IEEE / 978-1-4244-9306-7
By: Li Yaoming; Xu Lizhang; Ma Zheng;
Accelerated differentiation of myoblast with electric pulses in vitro
2011 / IEEE / 978-1-4577-0554-0
By: Uemura, R.; Nakajima, A.; Hashimoto, S.;
Method to study the single cell's time-variation adhesion strength during the manipulation inside ESEM
2011 / IEEE / 978-1-4577-1362-0
By: Homma, M.; Nakajima, M.; Yajing Shen; Fukuda, T.; Najdovski, Z.; Kojima, S.; Kojima, M.; Zhan Yang;
Micro-rotation flow chamber rapidly forming collagen gel-mediated hetero-spheroids
2011 / IEEE / 978-1-4577-1362-0
By: Okano, T.; Yamato, M.; Kodama, T.; Ota, H.; Miki, N.;
Tunable, self-curing polymers for the forensic collection of latent signatures from within porous materials
2011 / IEEE / 978-1-4577-1376-7
By: Mazzitelli, C.L.; Chipuk, J.E.; Chamberlin, S.C.; Reaves, M.A.; Straight, S.D.; Kendall, J.K.;
Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM
2011 / IEEE / 978-1-4673-0149-7
By: Gavin, J.; Yamaguchi, T.; Xiuzhen Lu; Wenhui Du; Xin Luo; Liu, J.; Li Lei Ye;
The effect of thermal stress on high density packaging integrated circuits
2011 / IEEE / 978-1-4673-0149-7
By: Jian Liu; Ping Lai; Bin Yao; Xiaosi Liang;
Low alpha green compound development for CMOS 90 LQFP automotive product
2011 / IEEE / 978-1-4673-0149-7
By: Junhua Luo; Yuan Yuan; Jinmei Liu; Jinzhong Yao;
Nano copper conductive ink for RFID application
2011 / IEEE / 978-1-4673-0149-7
By: Bing An; Jian Li; Yiping Wu; Jian Qin;
Novel device for transplantation of cell sheet and evaluation of thin polymer films by atomic force microscopy
2011 / IEEE / 978-1-4577-1362-0
By: Umezu, M.; Okano, T.; Shimizu, T.; Terajima, Y.; Sakaguchi, K.; Fukumori, K.; Takeuchi, R.;
Dielectric behaviour of polyperyleneimide films
2011 / IEEE / 978-1-61284-172-4
By: Bruma, M.; Rusu, R.; Damaceanu, M.;
On mold corner effects of EMC adhesion for IC encapsulation process
2011 / IEEE / 978-1-4577-1389-7
By: Chia-Hsun Yeh; Durn-Yuan Huang; Sheng-Jye Hwang; Huei-Huang Lee; Chen-hung Deng;
Nickel solder ball performance for Pb-free LFBGA assembly under oxygenous reflow
2011 / IEEE / 978-1-4577-1389-7
By: Tien-Tsorng Shih; Mu-Chun Wang; Win-Der Lee; Wei-Chih Chen;
Oxygenous reflow affecting performance of Pb-free TFBGA assembly
2011 / IEEE / 978-1-4577-1389-7
By: Mu-Chun Wang; Win-Der Lee; Wei-Chih Chen; Tien-Tsorng Shih;
Investigations of adhesion between Cu and Benzocyclobutene (BCB) polymer dielectric for 3D integration applications
2011 / IEEE / 978-1-4577-1389-7
By: Hu, S.H.; Ko, C.T.; Huang, W.C.; Chen, K.N.; Leu, J.;
Integration of ferroelectric BaTiO3 on metallic Ni tapes for power generation
2011 / IEEE / 978-2-35500-015-7
By: Collins, G.; Meletis, E.; Jiechao Jiang; Jie He; Chen, C.; Ayon, A.; Chabanov, A.; Chunrui Ma; Elam, D.; Ming Liu; Silva, E.;
Blue light-emitting polynaphthaleneimides
2011 / IEEE / 978-1-61284-172-4
By: Bruma, M.; Damaceanu, M.; Rusu, R.;
Polymer-based fabrication techniques for enclosed microchannels in biomedical applications
2011 / IEEE / 978-2-35500-015-7
By: Nussbaum, D.; Knoll, T.; Krebs, A.; Velten, T.;
Characterization of the adhesion between nanoparticles and polymer matrix by atomic force microscopy
2011 / IEEE / 978-1-4577-1516-7
By: Chung, W.R.; Amo, K.;
Inverse modeling of the button shear test
2011 / IEEE / 978-0-9568086-0-8
By: Min Ding; Hauck, T.; Schmadlak, I.;
Pressure distribution investigation on interaction between rail-wheel
2011 / IEEE / 978-1-4577-1884-7
By: Sudin, M.B.; Windarta;
Study of the protein structure analysis and molecular evolution of E-selectin in Homo sapiens
2011 / IEEE / 978-1-61284-704-7
By: Simin Chen; Thapa, M.; Quhuan Li; Jing Wang; Qiongshan Wang;
Multi-Walled Carbon Nanotubes Polymer Composites by Electrophoretic Deposition
2011 / IEEE / 978-1-4577-2037-6
By: Samal, S.; Bhattacharjee, S.; Singh, B.P.; Besra, L.;
The effect of cell shape on local hydrodynamic environment
2011 / IEEE / 978-1-61284-704-7
By: Ying Fang; Yi Fu; Cheng Dong; Jianhua Wu;
Non-invasive, label free, quantitative characterisation of live cells in monolayer culture
2011 / IEEE / 978-1-4673-0451-1
By: Somekh, M.; Crowe, J.; Sottile, V.; Morris, D.; Jing Zhang; Mather, M.;

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