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Topic: Active Interrogation
Results
2011 / IEEE / 978-1-4673-0120-6
By: Bernstein, A.; Blackburn, B.W.; Hynes, M.V.; Lanza, R.C.; Erickson, A.S.; Dazeley, S.;
By: Bernstein, A.; Blackburn, B.W.; Hynes, M.V.; Lanza, R.C.; Erickson, A.S.; Dazeley, S.;
2015 / IEEE
By: Schumer, J. W.; Clemett, C. D.; Jackson, S. L.; Zier, J. C.; Wulf, E. A.; Hutcheson, A. L.; Phlips, B. F.; Woolf, R. S.; O'Malley, J.; Campbell, B.; Maddock, R. C.; Threadgold, J. R.; Hill, C.; Martin, P. N.; Commisso, R. J.;
By: Schumer, J. W.; Clemett, C. D.; Jackson, S. L.; Zier, J. C.; Wulf, E. A.; Hutcheson, A. L.; Phlips, B. F.; Woolf, R. S.; O'Malley, J.; Campbell, B.; Maddock, R. C.; Threadgold, J. R.; Hill, C.; Martin, P. N.; Commisso, R. J.;
2005 / IEEE
By: Pohl, B.A.; Manatt, D.R.; Loshak, A.; Hall, J.M.; Dougan, A.D.; Walling, R.S.; Accatino, M.R.; Slaughter, D.R.; Prussin, S.G.; Bernstein, A.; Weirup, D.L.;
By: Pohl, B.A.; Manatt, D.R.; Loshak, A.; Hall, J.M.; Dougan, A.D.; Walling, R.S.; Accatino, M.R.; Slaughter, D.R.; Prussin, S.G.; Bernstein, A.; Weirup, D.L.;
2005 / IEEE
By: Scott, S.C.; Scarlett, W.R.; Saeger, K.J.; Richter, G.W.; Wagner, R.L., Jr.; Priedhorsky, W.C.; Moss, J.M.; Byrd, R.C.; Pura, C.A.;
By: Scott, S.C.; Scarlett, W.R.; Saeger, K.J.; Richter, G.W.; Wagner, R.L., Jr.; Priedhorsky, W.C.; Moss, J.M.; Byrd, R.C.; Pura, C.A.;
2007 / IEEE / 978-1-4244-0922-8
By: Hinshelwood, D.D.; Blackburn, B.W.; Commisso, R.J.; Schumer, J.W.; Valles, N.O.; Johnson, J.; Jones, J.L.; Mosher, D.; Cooperstein, G.; Young, F.C.; Weber, B.V.; Stephanakis, S.J.; Phipps, D.G.; Ottinger, P.F.; Murphy, D.P.;
By: Hinshelwood, D.D.; Blackburn, B.W.; Commisso, R.J.; Schumer, J.W.; Valles, N.O.; Johnson, J.; Jones, J.L.; Mosher, D.; Cooperstein, G.; Young, F.C.; Weber, B.V.; Stephanakis, S.J.; Phipps, D.G.; Ottinger, P.F.; Murphy, D.P.;
2009 / Springer Science+Business Media / 0236-5731
By: Alexander Barzilov; Brian Cooper; Ivan Novikov;
By: Alexander Barzilov; Brian Cooper; Ivan Novikov;