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Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications

By: Eom, Y.; Lee, H.; Lee, J.H.; Choi, K.; Bae, H.;

2014 / IEEE

Description

This item from - IEEE Transaction - Components, Circuits, Devices and Systems - Popular solder-bumping mechanisms such as electroplating and stencil printing suffer from either high process costs or technical limitations. A low-cost solder-on-pad (SoP) process has been developed to meet the requirements of fine-pitch solder bumping. This paper focuses on the characterization and estimation of the SoP process. To form a solder bump without soldering defects, optimum process conditions should be carefully designed. A model to estimate the bump volume and predict the bump height is suggested. By optimizing the composition of solder paste material called solder-bump-maker, and by adjusting the process conditions, Sn-Ag–Cu solder bumps with different heights are obtained. The experiments and analysis to understand the impact of parameters were based on test vehicles with 80 (μ ) m pitch size. Then, the measured heights of solder bumps are compared with the model to see how they fit the estimation. Finally, a similar process has been conducted to test vehicles with pitch sizes of 150 and 40 (μ ) m, to confirm the scalability of the SoP process in different pitch sizes.