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Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
2014 / IEEE
This item from - IEEE Transaction - Components, Circuits, Devices and Systems - Popular solder-bumping mechanisms such as electroplating and stencil printing suffer from either high process costs or technical limitations. A low-cost solder-on-pad (SoP) process has been developed to meet the requirements of fine-pitch solder bumping. This paper focuses on the characterization and estimation of the SoP process. To form a solder bump without soldering defects, optimum process conditions should be carefully designed. A model to estimate the bump volume and predict the bump height is suggested. By optimizing the composition of solder paste material called solder-bump-maker, and by adjusting the process conditions, Sn-Ag–Cu solder bumps with different heights are obtained. The experiments and analysis to understand the impact of parameters were based on test vehicles with 80