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Demonstration of high-bandwidth data transmission above 240 Gbps for optoelectronic module with low-loss and low-crosstalk polynorbornene waveguides
By: Ito, Y.; Choki, K.; Arai, S.; Singh, M.K.; Terada, S.;
2012 / IEEE / 978-1-4673-1965-2
This item was taken from the IEEE Conference ' Demonstration of high-bandwidth data transmission above 240 Gbps for optoelectronic module with low-loss and low-crosstalk polynorbornene waveguides ' We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.
Wavelength 850 Nm
Flexible Optoelectronic Transceiver Module
High-bandwidth Data Transmission
Low-loss Polynorbornene Waveguides
Board Level Interconnects
Vertical-cavity Surface-emitting Laser Diodes
Flexible Printed Circuit
24-channel Polynorbornene Waveguides
O/e Module Fabrication
Optical Linked O/e Transceiver Module
Optical Device Fabrication
Surface Emitting Lasers
Low-crosstalk Polynorbornene Waveguides