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Self-assembly-based 3D integration technologies
2012 / IEEE / 978-1-4673-0742-0
This item was taken from the IEEE Conference ' Self-assembly-based 3D integration technologies ' We have proposed and developed massively parallel chip self-assembly technologies using surface tension of liquid for advanced chip-to-wafer 3D integration. Here, we introduce flip-chip self-assembly in batch processing and reconfigured wafer-to-wafer 3D integration as a new chip-to-wafer 3D integration approach using self-assembly.
Reconfigured Wafer-to-wafer 3d Integration
Parallel Chip Self-assembly Technologies
Large Scale Integration
Batch Production Systems
Self-assembly-based 3d Integration Technologies
Three-dimensional Integrated Circuits
Wafer Level Packaging
Advanced Chip-to-wafer 3d Integration Approach