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Self-assembly-based 3D integration technologies

By: Koyanagi, M.; Tanaka, T.; Lee, K.-W.; Murugesan, M.; Bea, J.; Fukushima, T.;

2012 / IEEE / 978-1-4673-0742-0


This item was taken from the IEEE Conference ' Self-assembly-based 3D integration technologies ' We have proposed and developed massively parallel chip self-assembly technologies using surface tension of liquid for advanced chip-to-wafer 3D integration. Here, we introduce flip-chip self-assembly in batch processing and reconfigured wafer-to-wafer 3D integration as a new chip-to-wafer 3D integration approach using self-assembly.