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Emerging CMOS and beyond CMOS technologies for an ultra-low power 3D world
By: Loh, W.; Arkalgud, S.; Hill, R.; Ang, K.; Kang, C.; Jammy, R.; Oh, J.; Hummler, K.; Kirsch, P.; Hobbs, C.; Bersuker, G.; Gilmer, D.; Lee, R.;
2012 / IEEE / 978-1-4673-0145-9
Description
This item was taken from the IEEE Conference ' Emerging CMOS and beyond CMOS technologies for an ultra-low power 3D world ' We review various technology options for low power operation beyond the 14nm technology node with an insight into lower power solutions from both the technology and system perspectives.
Related Topics
Tfets
Multi-valued Logic
Nems
Low Power
Iii–v Mosfets
Power Management
Random Access Memory
Silicon
Reliability
Substrates
Nanoelectromechanical Systems
Logic Gates
Ultra-low Power 3d World
Cmos Technologies
System Perspectives
Cmos Integrated Circuits
Three-dimensional Integrated Circuits
Engineering
Power Integrated Circuits
